Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2009
07/09/2009US20090174020 Solid-state imaging device and method for manufacturing the same
07/09/2009US20090174018 Construction methods for backside illuminated image sensors
07/09/2009US20090174015 Memory Cell and Method of Forming a Magnetic Tunnel Junction (MTJ) of a Memory Cell
07/09/2009US20090174013 Semiconductor device and manufacturing method thereof
07/09/2009US20090174010 Sram device structure including same band gap transistors having gate stacks with high-k dielectrics and same work function
07/09/2009US20090174009 Semiconductor device and method for producing the same
07/09/2009US20090174008 METHOD AND STRUCTURE TO PROTECT FETs FROM PLASMA DAMAGE DURING FEOL PROCESSING
07/09/2009US20090174006 Structure and method of creating entirely self-aligned metallic contacts
07/09/2009US20090174005 Semiconductor device with gate-undercutting recessed region
07/09/2009US20090174004 Semiconductor device and fabricating method thereof
07/09/2009US20090174003 Dual work function device with stressor layer and method for manufacturing the same
07/09/2009US20090174002 Mosfet having a high stress in the channel region
07/09/2009US20090174001 Semiconductor device having fin transistor and planar transistor and associated methods of manufacture
07/09/2009US20090173997 Mosfet and method for manufacturing mosfet
07/09/2009US20090173995 Trench semiconductor device of improved voltage strength, and method of fabrication
07/09/2009US20090173994 Recess gate transistor
07/09/2009US20090173993 Structure and Method of Forming a Topside Contact to a Backside Terminal of a Semiconductor Device
07/09/2009US20090173991 Methods for forming rhodium-based charge traps and apparatus including rhodium-based charge traps
07/09/2009US20090173985 Dense arrays and charge storage devices
07/09/2009US20090173984 Integrated circuit and method of manufacturing an integrated circuit
07/09/2009US20090173981 Nonvolatile semiconductor storage device and method of manufacturing the same
07/09/2009US20090173980 Providing isolation for wordline passing over deep trench capacitor
07/09/2009US20090173977 Method of MRAM fabrication with zero electrical shorting
07/09/2009US20090173975 Well for cmos imager and method of formation
07/09/2009US20090173971 Memory cell layout structure with outer bitline
07/09/2009US20090173970 Method of fabricating hetero-junction bipolar transistor (hbt) and structure thereof
07/09/2009US20090173969 Semiconductor Device
07/09/2009US20090173967 Strained-channel fet comprising twist-bonded semiconductor layer
07/09/2009US20090173966 Integrated low leakage diode
07/09/2009US20090173964 Method of forming a carbon nanotube-based contact to semiconductor
07/09/2009US20090173962 Semiconductor light-emitting device, method of manufacturing the same, and lamp including the same
07/09/2009US20090173957 Wavelength-converting converter material, light-emitting optical component, and method for the production thereof
07/09/2009US20090173956 Contact for a semiconductor light emitting device
07/09/2009US20090173954 Semiconducting sheet
07/09/2009US20090173953 Package with overlapping devices
07/09/2009US20090173952 Semiconductor light-emitting device, illuminator and method of manufacturing semiconductor light-emitting device
07/09/2009US20090173951 COMPOUND SEMICONDUCTOR DEVICE USING SiC SUBSTRATE AND ITS MANUFACTURE
07/09/2009US20090173950 Controlling diamond film surfaces and layering
07/09/2009US20090173949 Silicon carbide mos field effect transistor with built-in schottky diode and method for manufacturing such transistor
07/09/2009US20090173948 Uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors formed using sequential lateral solidification and devices formed thereon
07/09/2009US20090173941 Method for fabricating a semiconductor structures and structures thereof
07/09/2009US20090173940 Image Sensor and Method for Manufacturing the Same
07/09/2009US20090173938 Metal oxide semiconductor, semiconductor element, thin film transistor and method of manufacturing thereof
07/09/2009US20090173935 PREPARATION OF THIN FILM TRANSISTORS (TFT's) OR RADIO FREQUENCY IDENTIFICATION (RFID) TAGS OR OTHER PRINTABLE ELECTRONICS USING INK-JET PRINTER AND CARBON NANOTUBE INKS
07/09/2009US20090173932 Thermoelectric Material, Infrared Sensor and Image Forming Device
07/09/2009US20090173927 Storage node, phase change memory device and methods of manufacturing and operating the same
07/09/2009US20090173910 Polishing composition
07/09/2009US20090173893 Semiconductor device and its manufacturing method
07/09/2009US20090173885 Scintillation element, scintillation array and method for producing the same
07/09/2009US20090173715 Light source device, substrate treating device, and substrate treating method
07/09/2009US20090173446 Substrate support, substrate processing apparatus including substrate support, and method of aligning substrate
07/09/2009US20090173389 Methods and apparatus for a wide conductance kit
07/09/2009US20090173274 PRODUCTION OF A GaN BULK CRYSTAL SUBSTRATE AND A SEMICONDUCTOR DEVICE FORMED THEREON
07/09/2009US20090172941 Land grid array site geometry for electronic assemblies
07/09/2009DE212007000081U1 Einrichtung für das Plasmaätzen von Halbleiterwafern und/oder Bildung von dielektrischen Filmen darauf Means for plasma etching of semiconductor wafers and / or formation of dielectric films on it,
07/09/2009DE19900169B4 Verfahren zur Herstellung eines vertikalen Siliciumcarbid-Feldeffekttransistors A method for producing a vertical silicon carbide field effect transistor
07/09/2009DE112007002124T5 Steuerverfahren für ein Beschichtungs- und Entwicklungssystem zum Steuern eines Beschichtungs- und Entwicklungssystems A control method for a coating and developing system for controlling a coating and developing system
07/09/2009DE112007001813T5 Verfahren zum Steuern der Morphologie während der Bildung einer epitaktischen Schicht A method for controlling the morphology during the formation of an epitaxial layer
07/09/2009DE112007001599T5 Anwendung von Smart-Polymer-Verbunden beim Packaging von integrierten Schaltungen Application of smart polymer composites in packaging of integrated circuits
07/09/2009DE112006003964T5 Anordnung von halbleitenden Nanodrähten auf Metallelektroden Arrangement of semiconducting nanowires on metal electrodes
07/09/2009DE112004001530B4 Versiegelte Poren in Damascene-Strukturen mit Low-k-Material Sealed pores in damascene structures with low-k material
07/09/2009DE102008064373A1 Halbleiteranordnung und Verfahren zur Herstellung einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device
07/09/2009DE102008063979A1 Bildsensor und Verfahren zu seiner Herstellung Image sensor and method for its preparation
07/09/2009DE102008063633A1 Verfahren zum Herstellen eines Halbleiterbauelements A method of manufacturing a semiconductor device
07/09/2009DE102008062625A1 Bildsensor und Verfahren zu seiner Herstellung Image sensor and method for its preparation
07/09/2009DE102008060704A1 Zusammengesetzter Passivierungsprozess für Nitrid-Feldeffekttransistoren A composite nitride passivation process for field effect transistors
07/09/2009DE102008055153A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation
07/09/2009DE102008054927A1 Halbleitergerät und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
07/09/2009DE102008047611A1 Verfahren und Vorrichtung für das Laserglühen Method and device for the laser annealing
07/09/2009DE102008002753A1 Verfahren zur optischen Inspektion, Detektion und Visualisierung von Defekten auf scheibenförmigen Objekten Method for the optical inspection, detecting and visualization of defects on the disk-shaped objects
07/09/2009DE102007063268A1 Drahtverbindung mit aluminiumfreien Metallisierungsschichten durch Oberflächenkonditionierung Wire bonding with aluminum-free metallization layers by surface conditioning
07/09/2009DE102007063230A1 Dielektrisches Zwischenschichtmaterial in einem Halbleiterbauelement mit einer Doublet-Struktur verspannter Materialien Interlayer dielectric material in a semiconductor device having a doublet structure of strained materials
07/09/2009DE102007061882B3 Verfahren zur Herstellung einer integrierten Schaltung mit vergrabenem Kanal und integrierte Schaltung mit vergrabenem Kanal A method of fabricating an integrated circuit with buried channel and integrated circuit with buried channel
07/09/2009DE102007058972A1 Verfahren zur Metallisierung von Solarzellen, Hotmelt-Aerosol-Tinte und Aerosol-Jet-Drucksystem A process for the metallization of solar cells, hotmelt aerosol and aerosol ink-jet printing system
07/09/2009DE102007054710B3 Verfahren zur Herstellung einer Halbleiterbaugruppe A process for producing a semiconductor package
07/09/2009DE102007054485A1 Siliziumoberflächen-Strukturierungs-Verfahren Silicon surface texturing process
07/09/2009DE102007042779B4 Kalibrationssubstrat und -verfahren Calibration substrate and method
07/09/2009DE102007026372B4 Verfahren zur Ausbildung einer Mikrostruktur in einer Halbleitervorrichtung A process for forming a fine pattern in a semiconductor device
07/09/2009DE102006033699B4 Drahtsäge mit kontrollierbarem Drahtfeld Wire saw with controllable pitch wire
07/09/2009DE102006028109B4 Walzendruckverfahren, Walzendruckvorrichtung und Verwendung der Walzendruckvorrichtung zur Herstellung einer Flüssigkristallanzeigevorrichtung Roller printing method, roll printing apparatus and use of the roll pressure device for manufacturing a liquid crystal display device
07/09/2009DE102005039804B4 Laterales Halbleiterbauelement mit Driftstrecke und Potentialverteilungsstruktur, Verwendung des Halbleiterbauelements sowie Verfahren zur Herstellung desselben Thereof Lateral semiconductor component with the drift path and potential distribution structure, use of the semiconductor device and methods for preparing
07/09/2009DE10044463B4 Plättchenschneidverfahren Dicing process
07/09/2009CA2704707A1 Formation of a hybrid integrated circuit device
07/08/2009EP2077703A1 Printed circuit board and method of manufacturing printed circuit board
07/08/2009EP2077578A1 Dicing device for electronic component separation
07/08/2009EP2077577A1 Silicon structure with opening having high aspect ratio, method for manufacturing the silicon structure, apparatus for manufacturing the silicon structure, program for manufacturing the silicon structure, and method for manufacturing etching mask for the silicon structure
07/08/2009EP2077576A1 Process for preparing cleaned substrates suitable for epitaxial growth
07/08/2009EP2077345A1 Method for manufacturing gallium nitride single crystalline substrate using self-split
07/08/2009EP2077291A1 Bis(aminophenol) derivative, process for producing the same, polyamide resin, positive photosensitive resin compositions, protective film, interlayer dielectric, semiconductor device, and display element
07/08/2009EP2076924A1 Memory element and method for manufacturing the same, and semiconductor device
07/08/2009EP2076923A1 Semiconductor device including storage device and method for driving the same
07/08/2009EP2076921A2 One-time-programmable logic bit with multiple logic elements
07/08/2009EP2076920A1 Methods of fabricating glass-based substrates and apparatus employing same
07/08/2009EP2076919A1 Local collector implant structure for heterojunction bipolar transistors and method of forming the same
07/08/2009EP2076918A1 Compound semiconductor substrate and control for electrical property thereof
07/08/2009EP2076910A2 Ferroelectric varactor with improved tuning range
07/08/2009EP1961037A4 Reciprocating aperture mask system and method
07/08/2009EP1866963A4 Multilayer, multicomponent high-k films and methods for depositing the same
07/08/2009EP1805792A4 Substrate processing apparatus
07/08/2009EP1784868B1 Lateral field effect transistor and its fabrication comprisng a spacer layer above and below the channel layer