Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2009
07/09/2009US20090176361 Semiconductor device preventing electrical short and method of manufacturing the same
07/09/2009US20090176360 Methods for processing a substrate with a flow controlled meniscus
07/09/2009US20090176359 Semiconductor device and method for fabricating the same
07/09/2009US20090176358 Discrete Trap Memory (DTM) Mediated by Fullerenes
07/09/2009US20090176357 Semiconductor device and method of manufacturing the same
07/09/2009US20090176356 Methods for fabricating semiconductor devices using thermal gradient-inducing films
07/09/2009US20090176355 Plasma Doping Method and Plasma Processing Device
07/09/2009US20090176354 Method for fabrication of single crystal diodes for resistive memories
07/09/2009US20090176353 Crystalline-type device and approach therefor
07/09/2009US20090176352 Semiconductor device, method of manufacturing the same, and substrate for manufacturing the same
07/09/2009US20090176351 Structure and method to improve mosfet reliability
07/09/2009US20090176350 Integration of ion gettering material in dielectric
07/09/2009US20090176349 Method and Device for Machining a Wafer, in Addition to a Wafer Comprising a Separation Layer and a Support Layer
07/09/2009US20090176348 Removable layer manufacturing method
07/09/2009US20090176347 Hybrid orientation substrate compatible deep trench capacitor embedded dram
07/09/2009US20090176346 Monitor pattern of semiconductor device and method of manufacturing semiconductor device
07/09/2009US20090176345 Process for producing thin-film capacitor
07/09/2009US20090176344 MOS Devices with Corner Spacers
07/09/2009US20090176343 P-channel MOS transistor and fabrication process thereof
07/09/2009US20090176342 Method of fabricating semiconductor device having deifferential gate dielectric layer and related device
07/09/2009US20090176341 Power electronic device of multi-drain type integrated on a semiconductor substrate and relative manufacturing process
07/09/2009US20090176340 Manufacturing Method Of Semiconductor Device
07/09/2009US20090176339 Method of multi-port memory fabrication with parallel connected trench capacitors in a cell
07/09/2009US20090176338 Fully-depleted (fd)(soi) mosfet access transistor and method of fabrication
07/09/2009US20090176337 Negative photoresist composition and method of manufacturing array substrate using the same
07/09/2009US20090176335 Method of manufacturing a semiconductor device
07/09/2009US20090176334 Method for forming a die-attach layer during semiconductor packaging processes
07/09/2009US20090176333 Method of manufacturing semiconductor device
07/09/2009US20090176332 Multi-chip device and method for manufacturing the same
07/09/2009US20090176331 Method for processing a base
07/09/2009US20090176329 Phase-change memory device and method of manufacturing the same
07/09/2009US20090176327 Photodiode and method for fabricating same
07/09/2009US20090176326 System for displaying images and method for fabricating the same
07/09/2009US20090176324 Method for encapsulating a substrate and method for fabricating a light emitting diode device
07/09/2009US20090176323 Process for producing light-emitting semiconductor device
07/09/2009US20090176322 Method for fabricating an ink jetting device
07/09/2009US20090176321 Template for forming solder bumps, method of manufacturing the template and method of inspecting solder bumps using the template
07/09/2009US20090176320 Method for fabrication of floating gate in semiconductor device
07/09/2009US20090176181 System and method of improved pressure control in horizontal diffusion furnace scavenger system for controlling silicon oxide growth
07/09/2009US20090176064 Membrane Structure Element and Method for Manufacturing Same
07/09/2009US20090175777 Single crystal diamond prepared by cvd
07/09/2009US20090175709 Contained object transfer system
07/09/2009US20090175707 Controlled deflection of large area semiconductor substrates for shipping and manufacturing containers
07/09/2009US20090175706 Method and apparatus for detecting a wafer pod
07/09/2009US20090175705 Substrate transfer apparatus and vertical heat processing apparatus
07/09/2009US20090175606 Method and structure to control thermal gradients in semiconductor wafers during rapid thermal processing
07/09/2009US20090175503 Surface Position Measuring Method and Apparatus
07/09/2009US20090175307 Optical connection device and method of fabricating the same
07/09/2009US20090175108 Integrated Circuit, Cell Arrangement, Method for Manufacturing an Integrated Circuit and for Reading a Memory Cell Status, Memory Module
07/09/2009US20090175104 Three dimensional structure memory
07/09/2009US20090175073 Nanostructure-Based Memory
07/09/2009US20090175062 Feedback structure for an sram cell
07/09/2009US20090175035 Light source module and method for manufacturing same
07/09/2009US20090175019 Circuit-board module and manufacturing method
07/09/2009US20090174983 Electrostatic chuck assembly with dielectric material and/or cavity having varying thickness, profile and/or shape, method of use and apparatus incorporating same
07/09/2009US20090174928 Display substrate, electrophoretic display device with the same and method for manufacturing the same
07/09/2009US20090174852 Liquid crystal display device and process for manufacturing the same
07/09/2009US20090174835 Liquid crystal display and method of fabricating the same to have tft's with pixel electrodes integrally extending from one of the source/drain electrodes
07/09/2009US20090174468 Thermal Sensing Circuit Using Bandgap Voltage Reference Generators Without Trimming Circuitry
07/09/2009US20090174464 Apparatus and method for improved leakage current of silicon on insulator transistors using a forward biased diode
07/09/2009US20090174322 Organic light-emitting device and method for forming the same
07/09/2009US20090174085 Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
07/09/2009US20090174082 Three dimensional structure memory
07/09/2009US20090174077 Method for Structuring a Substrate
07/09/2009US20090174076 Semiconductor device and the method of manufacturing the same
07/09/2009US20090174075 Simultaneous grain modulation for beol applications
07/09/2009US20090174073 Substrate for semiconductor package having coating film and method for manufacturing the same
07/09/2009US20090174072 Semiconductor system having bga package with radially ball-depopulated substrate zones and board with radial via zones
07/09/2009US20090174071 Semiconductor device including electrically conductive bump and method of manufacturing the same
07/09/2009US20090174070 Three-dimensional stacked substrate arrangements
07/09/2009US20090174068 Semiconductor device, circuit board, and electronic instrument
07/09/2009US20090174067 Airgap-containing interconnect structure with patternable low-k material and method of fabricating
07/09/2009US20090174065 Semiconductor device and method of manufacturing the same
07/09/2009US20090174059 Method and manufacture of silicon based package and devices manufactured thereby
07/09/2009US20090174057 Semiconductor device and programming method
07/09/2009US20090174055 Leadless Semiconductor Packages
07/09/2009US20090174054 Module with Flat Construction and Method for Placing Components
07/09/2009US20090174053 Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device
07/09/2009US20090174050 In-plane silicon heat spreader and method therefor
07/09/2009US20090174049 Ultra thin image sensor package structure and method for fabrication
07/09/2009US20090174048 Die package including substrate with molded device
07/09/2009US20090174047 Semiconductor Die Packages Having Overlapping Dice, System Using the Same, and Methods of Making the Same
07/09/2009US20090174046 Semiconductor package with an embedded printed circuit board and stacked die
07/09/2009US20090174045 Bump Pad Metallurgy Employing An Electrolytic Cu / Electorlytic Ni / Electrolytic Cu Stack
07/09/2009US20090174044 Multi-chip package
07/09/2009US20090174043 Flexible contactless wire bonding structure and methodology for semiconductor device
07/09/2009US20090174042 Radio frequency over-molded leadframe package
07/09/2009US20090174041 Ultraviolet blocking structure and method for semiconductor device
07/09/2009US20090174040 Sacrificial pillar dielectric platform
07/09/2009US20090174038 Production of single-crystal semiconductor material using a nanostructure template
07/09/2009US20090174037 Semiconductor substrate, method of fabricating the same, method of fabricating semiconductor device, and method of fabricating image sensor
07/09/2009US20090174034 Semiconductor device and method of manufacturing such a device
07/09/2009US20090174033 Adjustible resistor for use in a resistive divider circuit and method for manufacturing
07/09/2009US20090174031 Dram having deep trench capacitors with lightly doped buried plates
07/09/2009US20090174030 Linearity capacitor structure and method
07/09/2009US20090174028 Fuse in a Semiconductor Device and Method for Forming the Same
07/09/2009US20090174027 Integrated circuit including isolation regions substantially through substrate
07/09/2009US20090174025 Image Sensor and Method for Manufacturing the Same
07/09/2009US20090174024 Image sensor and method for manufacturing the same
07/09/2009US20090174023 Semiconductor device and method of manufacturing semiconductor device