Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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07/14/2009 | US7560313 SOI wafer and method for producing the same |
07/14/2009 | US7560312 Void formation for semiconductor junction capacitance reduction |
07/14/2009 | US7560311 Robust leaded molded packages and methods for forming the same |
07/14/2009 | US7560310 Semiconductor constructions and semiconductor device fabrication methods |
07/14/2009 | US7560309 Drop-in heat sink and exposed die-back for molded flip die package |
07/14/2009 | US7560308 Method for manufacturing bonded substrates and substrates for use in the bonded substrates |
07/14/2009 | US7560307 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same |
07/14/2009 | US7560306 Manufacturing process for chip package without core |
07/14/2009 | US7560305 Apparatus and method for high density multi-chip structures |
07/14/2009 | US7560304 Method of making a semiconductor device having multiple die redistribution layer |
07/14/2009 | US7560303 Method and apparatus for linear die transfer |
07/14/2009 | US7560302 Semiconductor device fabricating method |
07/14/2009 | US7560300 Method of manufacturing image sensor |
07/14/2009 | US7560299 Systems and methods of actuating MEMS display elements |
07/14/2009 | US7560298 Methods for producing a tunable vertical cavity surface emitting laser |
07/14/2009 | US7560297 Active matrix substrate, manufacturing method thereof, electro-optical device, and electronic apparatus |
07/14/2009 | US7560296 Process for producing an epitalixal layer of galium nitride |
07/14/2009 | US7560295 Methods for creating gapless inner microlenses, arrays of microlenses, and imagers having same |
07/14/2009 | US7560294 Light emitting element and method of making same |
07/14/2009 | US7560293 Evaluation method using a TEG, a method of manufacturing a semiconductor device having the TEG, an element substrate and a panel having the TEG, a program for controlling dosage and a computer-readable recording medium recording the program |
07/14/2009 | US7560220 Resist material and nanofabrication method |
07/14/2009 | US7560200 Overcoming conventional disadvantage, so that dimension correction for gate structures with different conductivity types can be incorporated into optical simulation in generating mask data for semiconductor integrated circuit device including dual gate structures different in conductivity types |
07/14/2009 | US7560198 Exposure blocking pattern is configured to prevent the density correcting pattern from being transcribed to a wafer; provide a photo-mask having a mask pattern whose line width has a high degree of uniformity |
07/14/2009 | US7560196 Mask for exposing an alignment mark, and method and computer program for designing the mask |
07/14/2009 | US7560172 Low voltage CMOS structure with dynamic threshold voltage |
07/14/2009 | US7560083 Method for removing water molecules from vacuum chamber, program for executing the method, and storage medium storing the program |
07/14/2009 | US7560042 An electronic device including a ferroelectric thin film with solid solution of bismuth silicate, Bi2SiO5, and lead zirconate titanate or lanthanum-containing lead zirconate titanate; stabilized precursor hydrolyzates; integrated, non-volatile memory devices |
07/14/2009 | US7560007 In-situ wafer temperature measurement and control |
07/14/2009 | US7559970 Method for producing metal nanoparticles and metal nanoparticles produced thereby |
07/14/2009 | US7559827 Dresser and apparatus for chemical mechanical polishing and method of dressing polishing pad |
07/14/2009 | US7559824 Chemical mechanical polishing devices, pad conditioner assembly and polishing pad conditioning method thereof |
07/14/2009 | US7559823 Substrate processing apparatus and substrate processing method |
07/14/2009 | US7559730 Cassette device for accepting substrates |
07/14/2009 | US7559455 Diebond strip |
07/14/2009 | US7559350 Apparatus and method for applying a material to an object |
07/14/2009 | US7559155 Method and system for drying semiconductor wafers in a spin coating process |
07/14/2009 | CA2648536A1 Methods for removing a stabilizer from a metal nanoparticle using a destabilizer |
07/09/2009 | WO2009086517A2 Heavily doped region in double-diffused source mosfet (ldmos) transistor and a method of fabricating the same |
07/09/2009 | WO2009086433A2 Non-volatile memory cell with charge storage layer in u-shaped groove |
07/09/2009 | WO2009086337A1 Buffer bilayers for electronic devices |
07/09/2009 | WO2009086299A1 Thermal interface with non-tacky surface |
07/09/2009 | WO2009086247A1 Complementary metal oxide semiconductor device with an electroplated metal replacement gate |
07/09/2009 | WO2009086231A2 Post-deposition cleaning methods and formulations for substrates with cap layers |
07/09/2009 | WO2009086164A2 Systems and methods for calibrating end effector alignment using at least a light source |
07/09/2009 | WO2009086157A1 Memory device comprising a silicon nitride charge storage layer doped with boron |
07/09/2009 | WO2009086109A2 Systems and methods for dynamic alignment beam calibration |
07/09/2009 | WO2009086105A1 Method to create solar cell using multilayer high speed inkjet printing |
07/09/2009 | WO2009086084A1 Field-emitter-based memory array with phase-change storage devices |
07/09/2009 | WO2009086042A2 Arrangements and methods for determining positions and offsets |
07/09/2009 | WO2009086027A2 Systems and methods for calibrating end effector alignment in a plasma processing system |
07/09/2009 | WO2009086020A2 Method and apparatus for managing test result data generated by a semiconductor test system |
07/09/2009 | WO2009086013A2 Method and apparatus for controlling temperature of a substrate |
07/09/2009 | WO2009085992A2 Thermal reactor with improved gas flow distribution |
07/09/2009 | WO2009085974A2 Low wet etch rate silicon nitride film |
07/09/2009 | WO2009085965A1 Removal of surface dopants from a substrate |
07/09/2009 | WO2009085962A1 Hafnium oxide ald process |
07/09/2009 | WO2009085958A2 Passivation layer formation by plasma clean process to reduce native oxide growth |
07/09/2009 | WO2009085954A2 Rf electron source for ionizing gas clusters |
07/09/2009 | WO2009085939A1 Improved high tilt implant angle performance using in-axis tilt |
07/09/2009 | WO2009085866A2 Gas transport delay resolution for short etch recipes |
07/09/2009 | WO2009085840A2 Wafer carrier drive apparatus and method for operating the same |
07/09/2009 | WO2009085810A1 Dual zone gas injection nozzle |
07/09/2009 | WO2009085808A2 Apparatus and method for processing a substrate using inductively coupled plasma technology |
07/09/2009 | WO2009085709A1 Apparatus and method for controlling edge performance in an inductively coupled plasma chamber |
07/09/2009 | WO2009085708A1 Method of correcting baseline skew by a novel motorized source coil assembly |
07/09/2009 | WO2009085703A2 Method for treating semiconductor processing components and components formed thereby |
07/09/2009 | WO2009085701A1 Structure and method for forming shielded gate trench fet with multiple channels |
07/09/2009 | WO2009085694A2 Protective layer for implant photoresist |
07/09/2009 | WO2009085672A2 Fabrication of a silicon structure and deep silicon etch with profile control |
07/09/2009 | WO2009085626A1 Method to pattern metallized substrates using a high intensity light source |
07/09/2009 | WO2009085609A2 3-d semiconductor die structure with containing feature and method |
07/09/2009 | WO2009085598A2 Photoresist double patterning |
07/09/2009 | WO2009085597A2 Cd bias loading control with arc layer open |
07/09/2009 | WO2009085564A2 Etch with high etch rate resist mask |
07/09/2009 | WO2009085561A2 Methods for in-situ chamber cleaning process for high volume manufacture of semiconductor materials |
07/09/2009 | WO2009085533A2 Method and system for fabricating three-dimensional structures with sub-micron and micron features |
07/09/2009 | WO2009085520A2 Transistor having raised source/drain self-aligned contacts and method of forming same |
07/09/2009 | WO2009085509A1 Selective electroless plating for electronic substrates |
07/09/2009 | WO2009085506A1 Air-gap ild with unlanded vias |
07/09/2009 | WO2009085488A2 Device with asymmetric spacers |
07/09/2009 | WO2009085483A1 Full-contact ring for a large wafer |
07/09/2009 | WO2009085423A2 A heat sink and method of forming a heatsink using a wedge-lock system |
07/09/2009 | WO2009085409A1 In-situ cavity integrated circuit package |
07/09/2009 | WO2009085374A2 Formation of a hybrid integrated circuit device |
07/09/2009 | WO2009085337A2 Wafer fixture for wet process applications |
07/09/2009 | WO2009085250A2 Methods of configuring a proximity head that provides uniform fluid flow relative to a wafer |
07/09/2009 | WO2009085240A2 Self-powered lithography method and apparatus using radioactive thin films |
07/09/2009 | WO2009085238A1 Copper discoloration prevention following bevel etch process |
07/09/2009 | WO2009085167A1 Devices with graphene layers |
07/09/2009 | WO2009085163A1 A composite showerhead electrode assembly for a plasma processing apparatus |
07/09/2009 | WO2009085157A1 Prediction and compensation of erosion in a magnetron sputtering target |
07/09/2009 | WO2009085117A2 Erosion resistant yttrium comprising metal with oxidized coating for plasma chamber components |
07/09/2009 | WO2009085098A1 Vapor phase repair and pore sealing of low-k dielectric materials |
07/09/2009 | WO2009085092A2 Fabrication of metallic hollow nanoparticles |
07/09/2009 | WO2009085087A1 A cmp system and method using individually controlled temperature zones |
07/09/2009 | WO2009085077A1 Method of making a pillar pattern using triple or quadruple exposure |
07/09/2009 | WO2009085072A1 Composition comprising chelating agents containing amidoxime compounds |
07/09/2009 | WO2009084906A2 The proble pin composed in one body and the method of making it |
07/09/2009 | WO2009084901A2 Method for controlling plasma density distribution in plasma chamber |
07/09/2009 | WO2009084850A2 Method of patterning transparent conductive oxide of a conductive glass and conductive glass prepared thereby |