Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2014
07/03/2014WO2014105828A1 Method for low temperature layer transfer in the preparation of multilayer semiconductor devices
07/03/2014WO2014105792A1 High productivity combinatorial techniques for titanium nitride etching
07/03/2014WO2014105765A1 Improved control over hydrogen fluoride levels in oxide etchant
07/03/2014WO2014105734A1 Thin film silicon nitride barrier layers on flexible substrate
07/03/2014WO2014105711A1 METHOD AND APPARATUS FOR FORMING COPPER(Cu) OR ANTIMONY(Sb) DOPED ZINC TELLURIDE AND CADMIUM ZINC TELLURIDE LAYERS IN A PHOTOVOLTAIC DEVICE
07/03/2014WO2014105709A1 Method and apparatus for forming a cadmium zinc telluride layer in a photovoltaic device
07/03/2014WO2014105652A1 Short pulse fiber laser for ltps crystallization
07/03/2014WO2014105582A1 Coat formation method, coat formation device, and method for producing semiconductor chip
07/03/2014WO2014105557A1 Method and system for in-line real-time measurements of layers of multilayered front contacts of photovoltaic devices and calculation of opto-electronic properties and layer thicknesses thereof
07/03/2014WO2014105477A1 Cobalt based interconnects and methods of fabrication thereof
07/03/2014WO2014105372A1 Semiconductor devices having reduced electric field at a gate oxide layer
07/03/2014WO2014105233A2 Processes for multi-layer devices utilizing layer transfer
07/03/2014WO2014105085A1 Multi-crystal diamond body
07/03/2014WO2014105044A1 Methods for post - epitaxial warp prediction and control
07/03/2014WO2014104973A1 A semiconductor device for high-power applications
07/03/2014WO2014104895A1 Semiconductor processing assembly and facility
07/03/2014WO2014104846A1 Method for forming conductive pattern, conductive film, conductive pattern, and transparent conductive film
07/03/2014WO2014104782A1 Test socket and socket body
07/03/2014WO2014104751A1 Substrate processing apparatus
07/03/2014WO2014104708A1 Thin-film transistor, method of manufacturing the same, and display device including the thin-film transistor
07/03/2014WO2014104621A1 Process for depositing epitaxial zno on iii-nitride-based light emitting diode and light emitting diode including epitaxial zno
07/03/2014WO2014104602A1 Substrate separation method and method for manufacturing semiconductor device using mask pattern
07/03/2014WO2014104552A1 Method for treating defects at junction area of semiconductor device using germanium
07/03/2014WO2014104551A1 Deposition apparatus using vertical-type plate heater
07/03/2014WO2014104504A1 Cmp slurry composition for polishing copper, and polishing method using same
07/03/2014WO2014104358A1 Group 5 metal oxo-alkoxo complex, method for producing same, and method for manufacturing group 5 metal oxide film
07/03/2014WO2014104296A1 Thin-film transistor and manufacturing method therefor
07/03/2014WO2014104290A1 Dry etching method
07/03/2014WO2014104276A1 Substrate for mask blank, substrate with multilayer reflective film, reflective type mask blank, reflective type mask, manufacturing method of substrate for mask blank and manufacturing method of substrate with multilayer reflective film as well as manufacturing method of semiconductor device
07/03/2014WO2014104267A1 Semiconductor device
07/03/2014WO2014104266A1 Power storage device and power storage system
07/03/2014WO2014104265A1 Semiconductor device and manufacturing method thereof
07/03/2014WO2014104229A1 Thin-film transistor and manufacturing method therefor
07/03/2014WO2014104218A1 Method for manufacturing circuit board to which electronic component is joined
07/03/2014WO2014104194A1 Inspection apparatus, inspection method, exposure system, exposure method, and device manufacturing method
07/03/2014WO2014104192A1 Resist-removing liquid and resist-stripping method
07/03/2014WO2014104189A1 Expansion method, method for manufacturing semiconductor devices, and semiconductor device
07/03/2014WO2014104159A1 Liquid-immersion member and exposure device
07/03/2014WO2014104139A1 Liquid-immersion member and exposure device
07/03/2014WO2014104126A1 Novolak resin containing hexafluoroisopropanol group, method for producing same, and composition of same
07/03/2014WO2014104107A1 Exposure device, exposure method, device production method, program, and recording medium
07/03/2014WO2014104100A1 Semiconductor device
07/03/2014WO2014104090A1 Energy-sensitive resin composition
07/03/2014WO2014104074A1 Curable resin composition, resin mold for imprinting, light imprinting method, production method for semiconductor integrated circuit, and production method for micro-optical element
07/03/2014WO2014104060A1 Temporary bonding layer for manufacturing semiconductor devices, layered product, and method for manufacturing semiconductor devices
07/03/2014WO2014104055A1 Pattern shape evaluation method, semiconductor device manufacturing method, and pattern shape evaluation device
07/03/2014WO2014104022A1 Measurement method and measurement device for energy of electrons excited by sunlight
07/03/2014WO2014104009A1 Mask blank substrate processing device, mask blank substrate processing method, mask blank substrate fabrication method, mask blank fabrication method, and transfer mask fabrication method
07/03/2014WO2014104001A1 Spatial light modulator and method for driving same, and exposure method and device
07/03/2014WO2014103996A1 Temporary adhesive for manufacturing semiconductor devices, adhesive support using same, and method for manufacturing semiconductor devices
07/03/2014WO2014103993A1 Semiconductor device manufacturing method
07/03/2014WO2014103955A1 Power module
07/03/2014WO2014103934A1 Power module
07/03/2014WO2014103928A1 Coating solution of multi-component oxide semiconductor precursor and process for manufacturing multi-component oxide semiconductor film using said coating solution
07/03/2014WO2014103902A1 Conductive structure, method for producing conductive structure, and display device
07/03/2014WO2014103901A1 Semiconductor device and method for manufacturing the same
07/03/2014WO2014103900A1 Semiconductor device
07/03/2014WO2014103896A1 Electrode forming paste
07/03/2014WO2014103875A1 Phase shift mask and method for producing same
07/03/2014WO2014103868A1 Nanostructure and method for producing same
07/03/2014WO2014103867A1 Phase shift mask and method for producing same
07/03/2014WO2014103808A1 Box for accommodating plate body
07/03/2014WO2014103734A1 Semiconductor device manufacturing method
07/03/2014WO2014103728A1 Film-forming device
07/03/2014WO2014103727A1 SiC-FILM FORMATION DEVICE AND METHOD FOR PRODUCING SiC FILM
07/03/2014WO2014103725A1 Aqueous dispersion for chemical mechanical polishing, and chemical mechanical polishing method
07/03/2014WO2014103714A1 Attachment member and attachment device using the same
07/03/2014WO2014103657A1 Eccentricity evaluation method and method for manufacturing epitaxial wafer
07/03/2014WO2014103644A1 Actinic-ray-sensitive or radiation-sensitive resin composition, resist film formed using said composition, method for forming pattern using said composition, process for producing electronic device, and electronic device
07/03/2014WO2014103640A1 Circular polishing pad
07/03/2014WO2014103637A1 Adhesive agent, adhesive film, and semiconductor device and method for manufacturing same
07/03/2014WO2014103615A1 Method for producing nanoimprint mold
07/03/2014WO2014103611A1 Defect observation method and defect observation device
07/03/2014WO2014103588A1 Aluminum compound, thin film-forming raw material, and method for producing thin film
07/03/2014WO2014103525A1 Temperature control device
07/03/2014WO2014103524A1 Circulating cooling/heating device
07/03/2014WO2014103523A1 Treatment device, exhaust switching device therefor, exhaust switching unit and switching valve box
07/03/2014WO2014103516A1 Photosensitive resin composition, photosensitive film, and method for forming resist pattern
07/03/2014WO2014103494A1 Polishing composition
07/03/2014WO2014103484A1 Method for producing layered polishing pads
07/03/2014WO2014103483A1 Polishing pad production method
07/03/2014WO2014103468A1 Dicing-sheet substrate film and dicing sheet
07/03/2014WO2014103467A1 Dicing-sheet substrate film and dicing sheet
07/03/2014WO2014103463A1 Wire bonding apparatus
07/03/2014WO2014103300A1 End-effector device
07/03/2014WO2014103299A1 End effector
07/03/2014WO2014103262A1 Paste transfer unit, electronic component mounting device, and transferred film thickness measuring method
07/03/2014WO2014103257A1 Silicon-carbide semiconductor device and manufacturing method therefor
07/03/2014WO2014103256A1 Silicon-carbide semiconductor device and manufacturing method therefor
07/03/2014WO2014103186A1 Silicon carbide semiconductor device and method for manufacturing same
07/03/2014WO2014103133A1 Semiconductor device
07/03/2014WO2014103126A1 Surge protection element and semiconductor device
07/03/2014WO2014103125A1 Nitride semiconductor device and nitride semiconductor substrate
07/03/2014WO2014102994A1 Silicon-carbide semiconductor device and manufacturing method therefor
07/03/2014WO2014102979A1 Semiconductor device and method for manufacturing same
07/03/2014WO2014102887A1 Sealing structure and conveyance robot provided with same
07/03/2014WO2014102881A1 Semiconductor device, mis transistor, and multilayer wiring substrate
07/03/2014WO2014102880A1 Semiconductor device, mis transistor, and multilayer wiring substrate
07/03/2014WO2014102625A1 Thin film transistor with a current-induced channel
07/03/2014WO2014102601A1 Group iii-v substrate material with thin buffer layer and methods of making