Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2014
07/09/2014CN103913944A 半色调掩膜版、阵列基板及其制作方法、显示装置 Halftone mask, array substrate and method of manufacturing the display device
07/09/2014CN103913916A 一种阵列基板及其制造方法、液晶显示屏 An arrayed substrate and manufacturing method, a liquid crystal display
07/09/2014CN103913913A 一种阵列基板及其制备方法、显示面板和显示装置 One kind of array substrate and its preparation method, the display panel and a display device
07/09/2014CN103911616A 刻蚀剂组合物、金属图案的形成方法和阵列基板的制法 Method etchant composition, method of forming a metal pattern and an array substrate
07/09/2014CN103911614A 用于含铜金属层的蚀刻剂组合物及制造阵列基板的方法 Method etchant compositions for producing copper-containing metal layer and the array substrate
07/09/2014CN103911613A 用于含铜金属层的蚀刻剂组合物及制造阵列基板的方法 Method etchant compositions for producing copper-containing metal layer and the array substrate
07/09/2014CN103911159A 至少包含铟和镓的氧化物的蚀刻液以及蚀刻方法 Comprising at least an etching solution and etching method of an oxide of indium and gallium
07/09/2014CN103910885A 制备间隙填充剂的方法、用其制备的间隙填充剂和使用间隙填充剂制造半导体电容器的方法 The method of preparation of the gap-fillers method, with the gap-fillers and their preparation using a gap filler for fabricating a semiconductor capacitor
07/09/2014CN103909072A 电子元件清洗装置及其应用的作业设备 Electronic components and equipment cleaning operations equipment applications
07/09/2014CN103026398B 基板及其制造方法、显示装置 Substrate and manufacturing method, a display device
07/09/2014CN102819192B 抗蚀剂下层组合物及利用其制造集成电路器件的方法 The resist underlayer composition and use of integrated circuit device manufacturing method thereof
07/09/2014CN102810514B 高压金属栅互补金属氧化物半导体的制作方法和系统 High-pressure metal gate complementary metal oxide semiconductor manufacturing method and system
07/09/2014CN102804619B 信号传输装置 Signal transmitting means
07/09/2014CN102723293B 芯片倒装单面三维线路先蚀后封制造方法及其封装结构 Flip-chip single line after the first three letters etched manufacturing method and package structure
07/09/2014CN102723280B 单面三维线路芯片倒装先蚀后封制造方法 After the one-sided first three lines of flip chip seal erosion manufacturing method
07/09/2014CN102709157B 一种二极管清洗工艺及其清洗设备 To a diode cleaning process and cleaning equipment
07/09/2014CN102681276B 阵列基板及其制造方法以及包括该阵列基板的显示装置 Array substrate and manufacturing method thereof and a display device including the array substrate,
07/09/2014CN102651325B 一种二维排布方式的无芯转接板封装方法 An arrangement way coreless adapter plate encapsulation method of two-dimensional
07/09/2014CN102629559B 叠栅SiC-MIS电容的制作方法 Stacked gate SiC-MIS capacitor production methods
07/09/2014CN102623376B Qfn封装工艺的塑封料上料架 Qfn packaging process on plastic materials rack
07/09/2014CN102610535B 植球装置、焊球拾取方法以及焊球安装方法 Bumping device, method, and solder balls picked installation methods
07/09/2014CN102610500B N型重掺杂碳化硅薄膜外延制备方法 SiC epitaxial thin films prepared N-type heavily doped
07/09/2014CN102592980B 铂金属硅化物的形成方法 The method for forming platinum silicide
07/09/2014CN102575201B 用于制造平面显示器的基板的清洗液组合物 A substrate cleaning liquid composition used for the manufacture of flat panel displays
07/09/2014CN102544119B BiCMOS工艺中的PN结变容器及制造方法 BiCMOS process container and manufacturing method of the PN junction becomes
07/09/2014CN102544079B 锗硅异质结npn晶体管及制造方法 SiGe heterojunction npn transistor and method of manufacture
07/09/2014CN102522374B 一种具有柱状底电极相变化存储装置及其制造方法 A bottom electrode having a columnar phase change memory device and manufacturing method thereof
07/09/2014CN102522321B 化学机械研磨中的清洗系统的清洗方法 The chemical mechanical polishing cleaning method of cleaning system
07/09/2014CN102505132B 封装基板表面电镀方法 Package substrate surface plating method
07/09/2014CN102483574B 放射线敏感性树脂组合物和化合物 The radiation-sensitive resin composition and the compound
07/09/2014CN102482533B 可光图案化介电材料和配制剂及使用方法 Photopatternable dielectric material and the preparation methods used agent
07/09/2014CN102473699B 具有降低的编程电压的鳍片反熔丝 Fins with reduced programming voltage antifuse
07/09/2014CN102473667B 面板平行度调整装置及具备该装置的面板附着装置 Parallelism adjusting means and the panel having a panel attachment means of the apparatus
07/09/2014CN102473452B 半导体存储装置 The semiconductor memory device
07/09/2014CN102468134B 利用冗余图形填充来调整芯片图形密度的方法 The use of redundancy to adjust the graphics chip pattern density padding method
07/09/2014CN102468132B 一种半导体器件的制作方法及器件结构 Method of manufacturing a semiconductor device and device structures
07/09/2014CN102449763B 非易失性存储元件以及其制造方法 Non-volatile storage element and a manufacturing method thereof
07/09/2014CN102449553B 曝光装置 Exposure device
07/09/2014CN102446928B 提高写入速度的浮体动态随机存储器单元及其制作方法 Improve writing speed floating body dynamic random access memory cell and its production method
07/09/2014CN102439701B 蚀刻装置 Etching equipment
07/09/2014CN102437041B 一种形成高介电常数k和t型金属栅极的形成方法 A method of forming a high dielectric constant k and t-type metal gate electrode is formed
07/09/2014CN102422438B 半导体装置及其制造方法以及太阳能电池 Semiconductor device and manufacturing method, and a solar cell
07/09/2014CN102422409B 保护带粘贴方法 Protection method with paste
07/09/2014CN102422406B 用于玻璃基片的支承件 The glass substrate supporting member
07/09/2014CN102420227B 一种抑制漏极感应势垒降低效应的后栅极工艺cmos器件及其制备方法 A method of inhibiting the drain induced barrier lowering effect after gate process cmos device and its preparation method
07/09/2014CN102420118B 一种金属硅化物栅极的形成方法 Of a metal silicide gate electrode forming method
07/09/2014CN102412260B 超级结半导体器件的终端保护结构及制作方法 Super Junction terminal protection structure and fabrication of a semiconductor device
07/09/2014CN102412183B 提高半导体器件中空穴迁移率的方法 Enhance hole mobility in semiconductor devices method
07/09/2014CN102386100B 制造碳化硅半导体器件的方法 The method of manufacturing a silicon carbide semiconductor device
07/09/2014CN102365723B 部件的布置方法 Layout of components
07/09/2014CN102349148B 应变材料层的晶格参数的调节 Adjusting the strained material layer lattice parameters
07/09/2014CN102349143B 用于测试膜封装的探测卡 Film-packaged for testing probe card
07/09/2014CN102348621B 基板搬运处理系统及基板搬运处理方法、以及部件安装装置及方法 Substrate handling system and a substrate transfer processing method, and a component mounting apparatus and method
07/09/2014CN102347371B 非易失性半导体存储器晶体管及非易失性半导体存储器的制造方法 The method of manufacturing a nonvolatile semiconductor memory transistor and a nonvolatile semiconductor memory
07/09/2014CN102306633B 热敏感缓冲材料 Heat-sensitive buffer material
07/09/2014CN102271859B 激光加工装置 The laser processing apparatus
07/09/2014CN102270641B 半导体器件 Semiconductor devices
07/09/2014CN102263087B 半导体元件及其制作方法 Semiconductor device and manufacturing method thereof
07/09/2014CN102254819B 低栅容金属氧化物半导体pn 结二极管结构及其制作方法 Low gate capacitance of metal-oxide-semiconductor pn junction diode structure and manufacturing method thereof
07/09/2014CN102237314B 具有多层级架构的快闪存储器 Flash memory has a multi-level architecture
07/09/2014CN102232242B Cmp用研磨液以及使用该研磨液的研磨方法 Cmp polishing liquid and the polishing solution using the polishing method
07/09/2014CN102222633B 热固型芯片接合薄膜、切割/芯片接合薄膜及半导体装置的制造方法 Thermosetting type die-bonding film, cutting / manufacturing a thin film semiconductor device and the die-bonding
07/09/2014CN102217058B 半导体集成电路装置 The semiconductor integrated circuit device
07/09/2014CN102210013B 研磨用组合物和半导体集成电路装置的制造方法 The polishing composition and method of manufacturing a semiconductor integrated circuit device
07/09/2014CN102200552B 硅片的方块电阻的测试方法及设备 Silicon sheet resistance testing methods and apparatus
07/09/2014CN102193342B 涂覆-显影装置和显影方法 Coating - the developing device and a developing method
07/09/2014CN102187277B 喷涂用正型感光性树脂组合物及使用该组合物的贯通电极的制造方法 Spray coating the positive photosensitive resin composition and a production method of the composition through electrode
07/09/2014CN102170080B 多线径元器件导线成型装置及其控制方法 Multi-diameter wire components forming apparatus and control method
07/09/2014CN102165596B 薄膜晶体管及薄膜晶体管中间体 A thin film transistor and a thin film transistor intermediates
07/09/2014CN102165575B 剪刀式升举传送自动控制仪器 Scissor lift transfer robot
07/09/2014CN102163627B 具有肖特基势垒二极管的碳化硅半导体装置及其制造方法 Schottky barrier diode having a silicon carbide semiconductor device and manufacturing method thereof
07/09/2014CN102160184B 显示装置 Display device
07/09/2014CN102142488B 半导体元件及其制造方法 Semiconductor device and manufacturing method
07/09/2014CN102131953B 由InGaO<sub>3</sub>(ZnO)结晶相形成的氧化物半导体用溅射靶材及其制造方法 An oxide semiconductor by InGaO <sub> 3 </ sub> (ZnO) crystal phase is formed by the sputtering target and its manufacturing method
07/09/2014CN102084458B 湿法处理晶片状物品的外围区域的装置和工艺 A wet treatment apparatus and process of the wafer-shaped article peripheral area
07/09/2014CN102082077B 制造多晶硅层的方法、薄膜晶体管、显示装置及制造方法 The method of fabricating a polysilicon layer, a thin film transistor, a display device and manufacturing method
07/09/2014CN102076774B 辐射敏感树脂组合物、叠层体及其制造方法、以及半导体器件 The radiation-sensitive resin composition, laminate and manufacturing method thereof, and a semiconductor device
07/09/2014CN102037549B 安装结构体的制造方法、以及安装结构体 The method of manufacturing the mounting structure, and the mounting structure
07/09/2014CN102034727B 基板处理装置 Substrate processing apparatus
07/09/2014CN102033979B 优化半导体器件的偏置点 Optimize the bias point of the semiconductor device
07/09/2014CN102020114B 运送系统 Delivery system
07/09/2014CN101958283B 获得交替排列的p型和n型半导体薄层结构的方法及结构 Obtained alternately arranged p-type and n-type semiconductor layer structure of the method and structure
07/09/2014CN101882595B 阻挡层的去除方法和装置 The method of removing the barrier layer and means
07/09/2014CN101796424B 具有减小的电流泄漏的半导体器件测试系统 The semiconductor device testing system with a reduced current leakage
07/09/2014CN101794737B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
07/09/2014CN101752272B 半导体器件的制造方法 The method of manufacturing a semiconductor device
07/09/2014CN101724354B 树脂组合物及采用该树脂组合物制作的半导体装置 The resin composition and semiconductor device using the resin composition prepared
07/09/2014CN101568611B 粘合片以及使用其的半导体装置的制造方法 Adhesive sheet and method for manufacturing a semiconductor device using the same
07/09/2014CN101515094B 液晶显示设备及其制造方法 The liquid crystal display device and manufacturing method thereof
07/09/2014CN101449341B 超导薄膜材料及其制造方法 Superconducting thin film material and manufacturing method thereof
07/09/2014CN101268547B 包含交替有源区材料的结构及其形成方法 Contains alternating active region material structure and method of forming
07/08/2014USRE44995 Method for producing a semiconductor component and a semiconductor component produced according to the method
07/08/2014US8774582 Etch-selective bonding layer for hybrid photonic devices
07/08/2014US8774493 Apparatus for forming image for pattern matching
07/08/2014US8773670 Polishing monitoring method, polishing method, and polishing monitoring apparatus
07/08/2014US8773657 Method to determine the value of process parameters based on scatterometry data
07/08/2014US8773628 Thin film transistor, thin film transistor substrate, processes for producing the same, liquid crystal display using the same, and related devices and processes; and sputtering target, transparent electroconductive film formed by use of this, transparent electrode, and related devices and processes
07/08/2014US8773561 Solid-state image pickup apparatus and electronic apparatus
07/08/2014US8773559 Solid-state imaging device and method of manufacturing the same, and imaging apparatus
07/08/2014US8772953 Semiconductor device and programming method
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