Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2014
07/09/2014CN103915438A 具有低接触电阻率的互补金属氧化物半导体及其形成方法 With a low contact resistivity of complementary metal oxide semiconductor and method for forming
07/09/2014CN103915437A 半导体结构及其形成方法 And method of forming a semiconductor structure
07/09/2014CN103915435A 一种GaN基超薄势垒增强模式反相器、环振及其制作方法 One kind of GaN-based ultra-thin barrier enhanced mode inverter ring oscillator and its production method
07/09/2014CN103915434A 一种GaN基超薄势垒增强/耗尽模式反相器、环振及其制作方法 One kind of GaN-based ultra-thin barrier enhancement / depletion mode inverter ring oscillator and its production method
07/09/2014CN103915431A 一种tft阵列基板、显示装置及阵列基板制作方法 One kind tft array substrate, a display device and method of manufacturing the array substrate
07/09/2014CN103915422A 用于半导体结构的方法和装置 Method and apparatus for a semiconductor structure
07/09/2014CN103915421A 用于形成堆叠封装件的方法和装置 Method and apparatus for forming the stacked package
07/09/2014CN103915414A 倒装芯片晶片级封装及其方法 Flip chip and wafer level packaging method
07/09/2014CN103915410A 半导体器件和半导体器件的制作方法 Fabrication of a semiconductor device and a semiconductor device
07/09/2014CN103915409A 电化隔离元件及其制造方法 Galvanic isolation element and manufacturing method thereof
07/09/2014CN103915408A 半导体封装件及其制法 Semiconductor package Jiqizhifa
07/09/2014CN103915406A 信号路径和制造多重图案化的半导体器件的方法 Multiple signal paths and a method of manufacturing a semiconductor device patterning
07/09/2014CN103915405A 半导体器件和制造半导体器件的方法 The method of manufacturing a semiconductor device and a semiconductor device
07/09/2014CN103915401A 封装结构中的细长凸块结构 Package structure elongated bump structure
07/09/2014CN103915400A 半导体封装件及其制法 Semiconductor package Jiqizhifa
07/09/2014CN103915396A 层叠封装接合结构及其形成方法 Layered structure and method of forming the bonding package
07/09/2014CN103915395A 半导体封装件及其制法 Semiconductor package Jiqizhifa
07/09/2014CN103915394A 半导体封装结构及其制作方法 Semiconductor package and method of making
07/09/2014CN103915393A 光电封装体及其制造方法 Package and method for manufacturing the photoelectric
07/09/2014CN103915391A 半导体封装件及其制法 Semiconductor package Jiqizhifa
07/09/2014CN103915390A 具有公共栅极的光子器件和cmos器件及其制造方法 Cmos photonic devices and device and a manufacturing method having a common gate
07/09/2014CN103915389A 一种半导体存储器的制造方法及其半导体存储器 A method of manufacturing a semiconductor memory device and a semiconductor memory
07/09/2014CN103915388A 半导体结构的形成方法 The method of forming a semiconductor structure
07/09/2014CN103915387A Cmos晶体管的形成方法 The method of forming a transistor Cmos
07/09/2014CN103915386A Cmos晶体管及其形成方法 Cmos transistor and method of forming
07/09/2014CN103915385A Cmos晶体管及其形成方法、鳍式场效应晶体管及其形成方法 Cmos transistor and method of forming, fin-type field effect transistor and method of forming
07/09/2014CN103915384A 半导体结构及其形成方法 And method of forming a semiconductor structure
07/09/2014CN103915383A 一种在芯片中添加电容的方法以及添加电容的分布结构 An added in the chip capacitor capacitance method and add distribution structure
07/09/2014CN103915382A 通过替换栅极工艺形成的集成电路中的嵌入式多晶硅电阻器 IC replacement gate process through formation of the embedded polysilicon resistor
07/09/2014CN103915381A 具有荧光粉层的发光二极管晶片的制作方法 Method of preparing a phosphor layer of a light emitting diode wafer
07/09/2014CN103915380A 一种阵列基板的制作方法、阵列基板及显示装置 A method of manufacturing an array substrate, the array substrate and a display device
07/09/2014CN103915379A 一种氧化物薄膜晶体管阵列基板的制造方法 A method of producing an oxide thin film transistor array substrate
07/09/2014CN103915378A 一种改进接触孔线宽均一性的刻蚀方法 A line width of the contact hole etching method for improving homogeneity
07/09/2014CN103915377A 具有减小的应力的隔离线结构、制造的方法和设计结构 Isolated line structure having a reduced stress, and the design of the structure produced by the method
07/09/2014CN103915376A 具有自对准气隙的半导体器件及其制造方法 Semiconductor device and manufacturing method thereof having a self-aligned air gap
07/09/2014CN103915375A 用于先进后端工艺线互连的组合大马士革和减薄金属刻蚀的系统及方法 Back-end technology for advanced interconnect line combinations Damascus and thinning systems and metal etching method
07/09/2014CN103915374A 钝化后互连结构及其形成方法 Interconnect structure and method of forming passivation
07/09/2014CN103915373A 图案化的线端空间 Patterned line end space
07/09/2014CN103915372A 半导体器件的形成方法 The method of forming a semiconductor device
07/09/2014CN103915371A 通孔和沟槽的形成方法 The method for forming through holes and grooves
07/09/2014CN103915370A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
07/09/2014CN103915369A 沟槽填充方法 Trench fill method
07/09/2014CN103915368A 一种芯片拾放装置 A chip pick and place unit
07/09/2014CN103915367A 刻蚀清洗工艺中的硅片搬送方法及设备 Silicon etch cleaning process transfer method and apparatus
07/09/2014CN103915366A 一种用于密封石英管的改进型石英管帽 Improved quartz tube cap for sealing a quartz tube
07/09/2014CN103915365A 贴合装置和贴合处理方法 Bonding means bonding and processing method
07/09/2014CN103915364A 基板处理装置以及基板处理方法 Substrate processing apparatus and substrate processing method
07/09/2014CN103915363A 基板处理设备 The substrate processing apparatus
07/09/2014CN103915362A 转动装置及其允交检测方法 Device and allow cross-rotation detection method
07/09/2014CN103915361A 芯片缺陷的检测方法 Chip defect detection method
07/09/2014CN103915360A 检测晶体管重叠电容的方法、消除晶体管重叠电容的方法 Sensing transistor overlap capacitance method, a method to eliminate overlap capacitance of transistor
07/09/2014CN103915359A 硅基芯片位错缺陷的快速统计监控方法 Fast statistical monitoring method silicon chip dislocation defects
07/09/2014CN103915358A 一种工艺角自动检测装置及方法 A process angle automatic detection device and method
07/09/2014CN103915357A 一种超细间距微凸点的制备方法 A process for producing ultra-fine pitch convex point
07/09/2014CN103915356A 一种芯片的封装方法 A method of chip packaging
07/09/2014CN103915355A 封装结构的形成方法 The method of forming a package structure
07/09/2014CN103915354A 用于bot层压封装件的改进的焊料掩模形状 Bot laminate package for improving the shape of the solder mask
07/09/2014CN103915353A 半导体器件以及使用标准化载体形成嵌入式晶片级芯片尺寸封装的方法 Semiconductor device and method of forming a carrier using standardized embedded wafer level chip size package
07/09/2014CN103915352A 树脂封装装置及树脂封装方法 Resin encapsulation apparatus and the resin encapsulation method
07/09/2014CN103915351A 半导体封装件的制法 The semiconductor package manufacturing method
07/09/2014CN103915350A Igbt模块的安装方法 Igbt module installation method
07/09/2014CN103915349A 用于制造半导体芯片的承载板 For manufacturing a semiconductor chip carrier sheet
07/09/2014CN103915348A 一种制备石墨烯纳米线器件的方法 A graphene nanowire devices prepared
07/09/2014CN103915347A 薄膜晶体管及其形成方法 Thin film transistor and method of forming
07/09/2014CN103915346A 薄膜晶体管及其制作方法与液晶显示面板 Thin film transistor and method of making liquid crystal display panel
07/09/2014CN103915345A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
07/09/2014CN103915344A 半导体器件及其形成方法 Semiconductor device and method for forming
07/09/2014CN103915343A 晶体管及其形成方法 Transistor and method of forming
07/09/2014CN103915342A 无结晶体管和互补无结晶体管的形成方法 No method of forming a junction transistors and complementary non-junction transistor
07/09/2014CN103915341A 晶体管及其形成方法 Transistor and method of forming
07/09/2014CN103915340A 一种功率器件分压环的制作方法 A power device manufacturing method of the partial pressure of the ring
07/09/2014CN103915339A Ldmos及其形成方法 Ldmos and forming method
07/09/2014CN103915338A 一种金刚石器件的制备方法 Method for preparing a diamond device
07/09/2014CN103915337A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
07/09/2014CN103915336A 三维量子阱晶体管及其形成方法 Three-dimensional quantum well transistors and method of forming
07/09/2014CN103915335A 半导体器件的形成方法 The method of forming a semiconductor device
07/09/2014CN103915334A 高性能双层多晶硅双极型晶体管的制造方法 The method of manufacturing high performance double poly bipolar transistors
07/09/2014CN103915333A 一种像素表面平整度实现方法 PIXEL surface flatness implementation
07/09/2014CN103915332A 图案的形成方法 The method of forming a pattern of
07/09/2014CN103915331A 离子注入方法 Ion implantation method
07/09/2014CN103915330A 基片刻蚀方法 Moment method based eclipse
07/09/2014CN103915329A 一种单晶硅电池丝网印刷前的非正常片的处理方法 One kind of monocrystalline screen-printed cells before treatment abnormal pieces
07/09/2014CN103915328A 利用石墨烯带电在石墨烯上生长高k介质的方法 Graphene charged graphene growth on high-k dielectric Method
07/09/2014CN103915327A 利用岛状石墨烯片在石墨烯上生长高k介质的方法 Utilizing island graphene sheets grown on the high-k dielectric graphene Method
07/09/2014CN103915326A 自对准金属硅化物的形成方法和半导体器件 Self-aligned method of forming a semiconductor device and the metal silicide
07/09/2014CN103915325A 使用沟道自对准硅化物布线层的方法 Use channel salicide layer wiring method
07/09/2014CN103915324A 堆叠纳米线制造方法 Stacked nanowire fabrication method
07/09/2014CN103915323A 晶体管的制作方法 Production methods transistor
07/09/2014CN103915322A 半导体器件的制备方法 The method for preparing a semiconductor device
07/09/2014CN103915321A 半导体结构及其制造方法 Semiconductor structure and manufacturing method
07/09/2014CN103915320A 一种通过化学处理缓冲层提高晶体质量的方法 A method of improving the crystal quality of the buffer layer by chemical treatment
07/09/2014CN103915319A 一种转移cvd石墨烯制备石墨烯器件的方法 A method for the preparation of graphene graphene device cvd transfer
07/09/2014CN103915318A 激光退火设备、多晶硅薄膜及其制作方法 Laser annealing equipment, polycrystalline silicon thin film and its production method
07/09/2014CN103915317A 应变层的生长方法以及带有应变层的衬底 Strained layer growth method and a substrate with a strained layer
07/09/2014CN103915316A 堆叠纳米线制造方法 Stacked nanowire fabrication method
07/09/2014CN103915315A Mim电容及其形成方法 Mim capacitor and method for forming
07/09/2014CN103915314A 晶圆边缘清洗方法 Wafer edge cleaning method
07/09/2014CN103915309A 等离子体处理腔室及其静电夹盘以及基片温度控制方法 The plasma processing chamber and the electrostatic chuck and substrate temperature control method
07/09/2014CN103915306A 微电子工艺处理设备和用于其的反应腔室 Process equipment for microelectronics and its reaction chamber
07/09/2014CN103913946A 光刻胶图案修剪方法 Photoresist pattern pruning method
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