Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2010
02/16/2010US7662022 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
02/16/2010US7661919 Discontinuous conveyor system
02/16/2010US7661576 Wire bonding method
02/16/2010US7661388 Plasma reactor for the treatment of large size substrates
02/16/2010US7661386 Film forming device
02/16/2010US7661385 Device for spin-coating substrates
02/16/2010US7661315 Method and apparatus for ultrasonic scanning of a fabrication wafer
02/16/2010CA2452053C Stripping and cleaning compositions for microelectronics
02/16/2010CA2334339C Methods of fabricating silicon carbide power devices by controlled annealing
02/11/2010WO2010017512A2 Enhanced reliability for semiconductor devices using dielectric encasement
02/11/2010WO2010017426A1 A memory cell that includes a carbon-based memory element and methods of forming the same
02/11/2010WO2010017340A2 Magnetic pad for end-effectors
02/11/2010WO2010017259A2 Method for ultra-uniform sputter deposition using simultaneous rf and dc power on target
02/11/2010WO2010017207A2 Roll-to-roll continuous thin film pv manufacturing process and equipment with real time online iv measurement
02/11/2010WO2010017185A1 Plasma source and methods for depositing thin film coatings using plasma enhanced chemical vapor deposition
02/11/2010WO2010017162A1 Through silicon via and method of fabricating same
02/11/2010WO2010017160A2 Environmentally friendly polymer stripping compositions
02/11/2010WO2010017142A2 Closed loop control of pad profile based on metrology feedback
02/11/2010WO2010017124A2 A reacted particle deposition (rpd) method for forming a compound semi-conductor thin-film
02/11/2010WO2010017123A2 Methods for forming doped regions in a semiconductor material
02/11/2010WO2010017114A2 An ion source and a method for in-situ cleaning thereof
02/11/2010WO2010017088A1 Hybrid dielectric material for thin film transistors
02/11/2010WO2010017031A1 Through wafer via and method of making same
02/11/2010WO2010017010A1 Ic having viabar interconnection and related method
02/11/2010WO2010017000A2 In-situ performance prediction of pad conditioning disk by closed loop torque monitoring
02/11/2010WO2010016993A1 Polishing systems and methods for removing conductive material from microelectronic substrates
02/11/2010WO2010016964A2 Susceptor ring
02/11/2010WO2010016958A1 Interconnect structure with metal cap self-aligned to a surface of an embedded conductive material
02/11/2010WO2010016956A1 Crystalline silicon substrates with improved minority carrier lifetime
02/11/2010WO2010016869A2 Phase change memory structures and methods
02/11/2010WO2010016663A2 Flat plate folding type coil spring, pogo pin using the same, and manufacturing method thereof
02/11/2010WO2010016650A1 Substrate-processing apparatus and method of transferring substrate in the same
02/11/2010WO2010016649A1 Substrate-processing apparatus and method of transferring substrate in the same
02/11/2010WO2010016648A1 Method for manufacturing an instant pulse filter using anodic oxidation and instant pulse filter manufactured by said method
02/11/2010WO2010016642A2 Apparatus measuring pressure of z-axis for wafer prober
02/11/2010WO2010016608A1 Electric contact member and contact probe
02/11/2010WO2010016588A1 Board holding device, board holding method, and method of manufacturing laminated glass
02/11/2010WO2010016586A1 Method for manufacturing semiconductor wafer
02/11/2010WO2010016570A1 Bonding device, bonding device correction amount calculation method, and bonding method
02/11/2010WO2010016564A1 Semiconductor device
02/11/2010WO2010016550A1 A substrate treating method, a substrate treating apparatus, an exposure method, and a device manufacturing method
02/11/2010WO2010016532A1 Group iii nitride semiconductor laminate structure and method for manufacturing the group iii nitride semiconductor laminate structure
02/11/2010WO2010016510A1 Method for manufacturing a semiconductor wafer
02/11/2010WO2010016505A1 Sample conveying mechanism
02/11/2010WO2010016504A1 Inspection device
02/11/2010WO2010016500A1 Raw material recovery method and trapping mechanism for recovering raw material
02/11/2010WO2010016499A1 Placing table structure
02/11/2010WO2010016486A1 Polishing pad and method for manufacturing the polishing pad
02/11/2010WO2010016484A1 Vacuum treatment apparatus and vacuum treatment method
02/11/2010WO2010016459A1 Gan semiconductor optical element, method for manufacturing gan semiconductor optical element, epitaxial wafer and method for growing gan semiconductor film
02/11/2010WO2010016457A1 Epitaxial silicon wafer and method for production thereof
02/11/2010WO2010016424A1 Reaction device and reaction method
02/11/2010WO2010016423A1 Dielectric window, dielectric window manufacturing method, and plasma treatment apparatus
02/11/2010WO2010016417A1 Plasma processing apparatus
02/11/2010WO2010016414A1 Microwave plasma generation device and microwave plasma processing device
02/11/2010WO2010016390A1 Polishing solution for cmp, and method for polishing substrate using the polishing solution for cmp
02/11/2010WO2010016388A1 Schottky barrier diode and method for manufacturing schottky barrier diode
02/11/2010WO2010016351A1 Method for manufacturing semiconductor device
02/11/2010WO2010016350A1 Residue removing liquid composition and method for cleaning semiconductor element using same
02/11/2010WO2010016331A1 Method for producing device
02/11/2010WO2010016330A1 Silicon substrate etching method
02/11/2010WO2010016306A1 Aluminum ribbon for ultrasonic bonding
02/11/2010WO2010016305A1 Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device
02/11/2010WO2010016288A1 Illumination optical system, exposure apparatus, and device manufacturing method
02/11/2010WO2010016260A1 Semiconductor device
02/11/2010WO2010016249A1 Manufacturing method for semiconductor device, and plasma etching device
02/11/2010WO2010016223A1 Method for compression-molding electronic component and die apparatus
02/11/2010WO2010016213A1 Field effect transistor
02/11/2010WO2010016212A1 Field effect transistor manufacturing method
02/11/2010WO2010016207A1 Flexible semiconductor device and method for manufacturing same
02/11/2010WO2010016206A1 Method for manufacturing flexible semiconductor device
02/11/2010WO2010016191A1 Semiconductor device and method for manufacturing same
02/11/2010WO2010016188A1 Connector incorporating electronic component, method for manufacturing connector incorporating electronic component, and apparatus for manufacturing connector incorporating electronic component
02/11/2010WO2010016171A1 Manufacturing method of dielectric thin-film capacitor and dielectric thin-film capacitor
02/11/2010WO2010016170A1 Compression bonding device, compression bonding method, package, and pressing plate
02/11/2010WO2010015942A2 Method and device for producing photovoltaic modules
02/11/2010WO2010015878A2 Process for modifying a substrate
02/11/2010WO2010015678A2 Improving solder bump connections in semiconductor devices
02/11/2010WO2010015470A1 Method of making multiple implantations in a substrate
02/11/2010WO2010015467A1 Method for making a structure comprising a step for implanting ions in order to stabilize the adhesive bonding interface
02/11/2010WO2010015401A2 Relaxation of strained layers
02/11/2010WO2010015302A2 Relaxation and transfer of strained layers
02/11/2010WO2010015301A1 Passivation of etched semiconductor structures
02/11/2010WO2009145798A3 Methods for modifying features of a workpiece using a gas cluster ion beam
02/11/2010WO2009136725A3 Super-resolution digital lithography
02/11/2010WO2009134089A3 Capacitor-less memory device
02/11/2010WO2009134080A3 Method for depositing polysilicon thin film with ultra-fine crystal grains
02/11/2010WO2009131724A3 Insulated nanogap devices and methods of use thereof
02/11/2010WO2009120974A3 System for selectively filling pin holes, weak shunts and/or scribe lines in photovoltaic devices and photovoltaic cells made thereby
02/11/2010US20100037199 Recording medium storing original data generation program, original data generation method, original fabricating method, exposure method, and device manufacturing method
02/11/2010US20100036523 Vacuum processing apparatus
02/11/2010US20100035785 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
02/11/2010US20100035526 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
02/11/2010US20100035523 Semiconductor device fabricating method, and semiconductor fabricating device
02/11/2010US20100035440 Substrate processing apparatus and method of manufacturing semiconductor device
02/11/2010US20100035439 Film forming method and film forming apparatus
02/11/2010US20100035438 Method for manufacturing semiconductor device, and polishing apparatus
02/11/2010US20100035437 Substrate processing apparatus and method of manufacturing semiconductor device
02/11/2010US20100035436 Composition for etching silicon oxide layer, method for etching semiconductor device using the same, and composition for etching semiconductor device
02/11/2010US20100035435 Composition and Method for Improved Adhesion of Polymeric Materials to Copper or Copper Alloy Surfaces
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