Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2010
04/06/2010CA2459416C Structures and methods for selectively applying a well bias to portions of a programmable device
04/01/2010WO2010037074A1 Method for forming ruthenium metal cap layers
04/01/2010WO2010037036A1 Methods for fabricating mos devices having highly stressed channels
04/01/2010WO2010036999A2 Substrate processing chamber with off-center gas delivery funnel
04/01/2010WO2010036942A2 Power mosfet having a strained channel in a semiconductor heterostructure on metal substrate
04/01/2010WO2010036807A1 Arrays of ultrathin silicon solar microcells
04/01/2010WO2010036707A2 Adjustable thermal contact between an electrostatic chuck and a hot edge ring by clocking a coupling ring
04/01/2010WO2010036657A2 Methods for fabricating faceplate of semiconductor apparatus
04/01/2010WO2010036623A1 High-electrical-current wafer level packaging, high-electrical-current wlp electronic devices, and methods of manufacture thereof
04/01/2010WO2010036622A1 Methods of forming relaxed layers of semiconductor materials, semiconductor structures, devices and engineered substrates including same
04/01/2010WO2010036621A2 Defect-free junction formation using octadecaborane self-amorphizing implants
04/01/2010WO2010036602A1 Method of forming a composite laser substrate
04/01/2010WO2010036575A2 Methods and systems for preventing feature collapse during microelectronic topography fabrication
04/01/2010WO2010036496A1 Printed circuit board for harsh environments
04/01/2010WO2010036489A2 Microwave plasma containment shield shaping
04/01/2010WO2010036396A1 Methods for producing carbon nanotubes with controlled chirality and diameter and products therefrom
04/01/2010WO2010036383A1 Applications and methods for alkali silicate glass
04/01/2010WO2010036358A1 Abrasive compositions for chemical mechanical polishing and methods for using same
04/01/2010WO2010036356A1 Glass-ceramic-based semiconductor-on-insulator structures and method for making the same
04/01/2010WO2010036327A2 Low cost die placement
04/01/2010WO2010036324A2 Low cost die release wafer
04/01/2010WO2010036307A2 Thermal barrier layer for integrated circuit manufacture
04/01/2010WO2010036306A2 Solvent softening to allow die placement
04/01/2010WO2010036305A1 Method for assembling integrated circuits involving a release member.
04/01/2010WO2010036304A2 Laser ablation to create pocket for die placement
04/01/2010WO2010036235A1 Removing piezoelectric material using electromagnetic radiation
04/01/2010WO2010036210A1 Graphene memory cell and fabrication methods thereof
04/01/2010WO2010036051A2 Structure and manufacture method for multi-row lead frame and semiconductor package
04/01/2010WO2010036049A2 Polyimide film
04/01/2010WO2010035998A2 Apparatus and method for supplying slurry for a semiconductor
04/01/2010WO2010035991A2 Apparatus and method for manufacturing light-emitting diode
04/01/2010WO2010035980A2 Nonvolatile memory device and methods for recording and reading information on nonvolatile memory device
04/01/2010WO2010035909A1 Positive photosensitive composition and pattern forming method using the same
04/01/2010WO2010035908A1 Pattern forming method
04/01/2010WO2010035894A1 Positive resist composition for immersion exposure and pattern forming method
04/01/2010WO2010035848A1 Method for manufacturing semiconductor device
04/01/2010WO2010035799A1 Polymer brush composite and method for producing same
04/01/2010WO2010035786A1 Suction sheet
04/01/2010WO2010035783A1 Method for concave and convex pattern formation and apparatus for manufacturing concave and convex pattern
04/01/2010WO2010035773A1 Film formation device and substrate processing apparatus
04/01/2010WO2010035771A1 Rotary processing device, rotary processing system, and rotary processing method
04/01/2010WO2010035743A1 Mold for nanoimprint
04/01/2010WO2010035713A1 Semiconductor device, semiconductor manufacturing method, semiconductor manufacturing device, and display device
04/01/2010WO2010035703A1 Semiconductor member manufacturing method and adhesive tape
04/01/2010WO2010035689A1 Electrostatic chuck
04/01/2010WO2010035647A1 Film forming method and film forming apparatus
04/01/2010WO2010035627A1 Semiconductor device
04/01/2010WO2010035626A1 Semiconductor device
04/01/2010WO2010035625A1 Semi conductor device
04/01/2010WO2010035622A1 Method for forming wiring and apparatus for forming wiring
04/01/2010WO2010035609A1 Non-volatile semiconductor storage device
04/01/2010WO2010035608A1 Semiconductor device and manufacturing method thereof
04/01/2010WO2010035588A1 Data processing device, data processing method, and check work support system using the same
04/01/2010WO2010035583A1 Apparatus and method for mounting electronic component
04/01/2010WO2010035582A1 Apparatus and method for mounting electronic component
04/01/2010WO2010035551A1 Substrate module and method for manufacturing the same
04/01/2010WO2010035543A1 Circuit substrate and display device
04/01/2010WO2010035522A1 Method and apparatus for etching silicon-containing film
04/01/2010WO2010035510A1 Silicon wafer and method for manufacturing same
04/01/2010WO2010035509A1 Lead frame substrate manufacturing method and semiconductor device
04/01/2010WO2010035499A1 Leadframe substrate, method for manufacturing same, and semiconductor device
04/01/2010WO2010035481A1 Semiconductor device and semiconductor device manufacturing method
04/01/2010WO2010035463A1 Thin-film transistor and intermediate of thin-film transistor
04/01/2010WO2010035429A1 Surface treatment nozzle device
04/01/2010WO2010035409A1 Process for producing silicon epitaxial wafer
04/01/2010WO2010035404A1 Chemical mechanical polishing apparatus, chemical mechanical polishing method, and control program
04/01/2010WO2010035401A1 Electronic device and method for manufacturing same
04/01/2010WO2010035396A1 Method for cleaning substrate and apparatus for cleaning substrate
04/01/2010WO2010035385A1 Vacuum processing apparatus and vacuum transfer apparatus
04/01/2010WO2010035379A1 Semiconductor device and a method of fabricating the same
04/01/2010WO2010035377A1 Semiconductor device and method for manufacturing same
04/01/2010WO2010035375A1 Semiconductor device and method for manufacturing the same
04/01/2010WO2010035374A1 Semiconductor integrated circuit
04/01/2010WO2010035348A1 Semiconductor manufacturing apparatus
04/01/2010WO2010035335A1 Test part unit and test head
04/01/2010WO2010035258A2 Discrete metallic copper nanoparticles
04/01/2010WO2010035197A1 Flexible all solid state battery with enhanced deposition freedom
04/01/2010WO2010034995A1 Method and apparatus for forming an interconnection through a substrate
04/01/2010WO2010034824A2 Method for performing parallel stochastic assembly
04/01/2010WO2010034733A1 Shadow mask held magnetically on a substrate support
04/01/2010WO2010034725A2 Method for the production of a semiconductor component, in particular a solar cell, on the basis of a thin silicon layer
04/01/2010WO2010034696A1 Process for locally dissolving the oxide layer in a semiconductor-on-insulator type structure
04/01/2010WO2010017000A3 In-situ performance prediction of pad conditioning disk by closed loop torque monitoring
04/01/2010WO2010016869A3 Phase change memory structures and methods
04/01/2010WO2010014553A3 Concrete vacuum chamber
04/01/2010WO2010009050A3 Substrate lift pin sensor
04/01/2010WO2010005759A3 Performance improvements of ofets through use of field oxide to control ink flow
04/01/2010WO2010002702A3 Substrate fins with different heights
04/01/2010WO2009158507A3 Chemical mechanical planarization pad conditioner and method of forming
04/01/2010WO2009148819A3 Techniques for changing temperature of a platen
04/01/2010WO2009140371A3 Method and apparatus for pulsed plasma processing using a time resolved tuning scheme for rf power delivery
04/01/2010WO2009140172A3 Selective inductive double patterning
04/01/2010WO2009140153A3 Apparatus for etching semiconductor wafers
04/01/2010WO2009139826A3 Substrate processing systems and related methods
04/01/2010WO2009131845A3 Junction formation on wafer substrates using group iv nanoparticles
04/01/2010WO2009120967A3 Method of manufacturing a substrate for a microelectronic device, and substrate formed thereby
04/01/2010WO2009003552A9 Treatment system for flat substrates
04/01/2010US20100082144 Method of calculating pattern-failure-occurrence-region, computer program product, pattern-layout evaluating method, and semiconductor-device manufacturing method
04/01/2010US20100081395 Dram having stacked capacitors of different capacitances
04/01/2010US20100081361 Dressing method, method of determining dressing conditions, program for determining dressing conditions, and polishing apparatus