Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2014
08/06/2014CN103972167A 一种阵列基板的制造方法 A method of manufacturing an array substrate
08/06/2014CN103972166A 用于使用半导体工艺产生多个半导体装置的方法 A method for using a semiconductor process generating a plurality of semiconductor devices
08/06/2014CN103972165A 一种实现硅通孔叠层芯片互连的方法 A method for implementing silicon vias stacked chip interconnects
08/06/2014CN103972164A 铜互连大马士革工艺方法 Copper interconnect process for Damascus
08/06/2014CN103972163A 通过二次曝光解决连接孔钨栓粘合层剥落缺陷的方法 By double-exposure method to solve the tungsten plug connection hole peeling the adhesive layer defects
08/06/2014CN103972162A 一种无铜籽晶互连用碳化钼掺杂钌基合金扩散阻挡层制备工艺 A non-copper seed interconnection prepare ruthenium-based alloy technology diffusion barrier layer doped with molybdenum carbide
08/06/2014CN103972161A 一种用于硅通孔形貌修正的SiCoNi蚀刻方法 A method of etching silicon vias SiCoNi corrected for topography
08/06/2014CN103972160A 一种降低在线wat测试对铜互连可靠性影响的方法 A method of reducing the impact of online wat reliability test method for copper interconnects
08/06/2014CN103972159A 三维封装结构及其形成方法 Package structure and method of forming a three-dimensional
08/06/2014CN103972158A 用于半导体器件的互连结构及其制造方法和半导体器件 Interconnect structure for a semiconductor device and its manufacturing method and a semiconductor device
08/06/2014CN103972157A 用于多重图案化技术的导线布线 Conductor routing for multiple patterning techniques
08/06/2014CN103972156A 半导体互连结构及其制作方法 Semiconductor interconnect structure and fabrication method thereof
08/06/2014CN103972155A 一种在硅基底刻蚀通孔的方法 A silicon substrate is etched through holes method
08/06/2014CN103972154A 插塞的形成方法 A method for forming a plug
08/06/2014CN103972153A 接触孔插塞的制造方法 Contact-hole plug manufacturing method
08/06/2014CN103972152A 钨金属互连线的制作方法 The method of making tungsten metal interconnect lines
08/06/2014CN103972151A 连接叠层结构的导电层的中间连接件的形成方法 Connecting conductive layer forming method of the laminated structure of the intermediate connecting member
08/06/2014CN103972150A 一种刻蚀熔丝结构两侧氧化层的方法和系统 A fuse structure on both sides of the oxide layer etching method and system
08/06/2014CN103972149A 金属填充沟槽的方法 Metal-filled trench method
08/06/2014CN103972148A 一种超薄绝缘体上材料的制备方法 Method for preparing thin insulator material
08/06/2014CN103972147A 一种窄沟槽制作方法 A narrow trench method of making
08/06/2014CN103972146A 沟槽隔离结构的形成方法 The method of forming a trench isolation structure
08/06/2014CN103972145A Goi硅片制作方法、goi硅片及goi检测方法 Goi silicon production methods, goi goi silicon and detection methods
08/06/2014CN103972144A 用于晶圆密封环的方法和装置 Method and apparatus for wafer seal ring
08/06/2014CN103972143A 一种电池片石英吸笔 A battery slice quartz wand
08/06/2014CN103972142A 基板的剥离装置和剥离方法以及电子器件的制造方法 Peeling apparatus and a peeling method of a substrate and a manufacturing method of an electronic device
08/06/2014CN103972141A 膜层结构以及软性电子装置制作方法 Film structure and method of making flexible electronic devices
08/06/2014CN103972140A 封装方法及封装半导体器件 Packaging method and packaging a semiconductor device
08/06/2014CN103972139A 一种改善晶圆尖峰退火均一性的校准方法 A method for improving the uniformity of the wafer spike anneal calibration method
08/06/2014CN103972138A 用于拾取，放置和压迫半导体元件的装置 Means for picking, placing and oppression of the semiconductor element
08/06/2014CN103972137A 交接位置示教方法、交接位置示教装置及基板处理装置 Transfer position teaching method, transfer position display device and substrate processing apparatus to teach
08/06/2014CN103972136A 晶圆搬运机器人 Wafer handling robot
08/06/2014CN103972135A 一种硅片精确定位传输装置及定位方法 Silicon wafers pinpoint transmission device and positioning method
08/06/2014CN103972134A 减压处理装置 Decompression processing unit
08/06/2014CN103972133A 基板的剥离装置和剥离方法以及电子器件的制造方法 Peeling apparatus and a peeling method of a substrate and a manufacturing method of an electronic device
08/06/2014CN103972132A 基板处理装置和载置台 Substrate processing apparatus and the stage
08/06/2014CN103972131A 结合装置和结合方法 Combining devices and combination methods
08/06/2014CN103972130A 等离子处理装置以及试料台 Plasma processing apparatus and sample stage
08/06/2014CN103972129A 工艺控制方法、系统和半导体设备 Process control methods, systems, and semiconductor device
08/06/2014CN103972128A 一种肖特基接触孔制备过程中可测试性的图形监控方法 One kind of preparation Schottky contact hole pattern testability monitoring method
08/06/2014CN103972127A 一种监控电子显微镜化学油污污染的方法 An electron microscope methods of chemical oil pollution monitoring
08/06/2014CN103972126A 预防硅片破片的方法 Silicon fragments prevention methods
08/06/2014CN103972125A 提前监控并预防连接孔钨栓粘合层剥落缺陷的方法 Early monitoring and method of connecting bolt hole tungsten adhesive layer peeling defect prevention
08/06/2014CN103972124A 图案化晶圆缺点检测系统及其方法 The patterned wafer inspection system and method drawback
08/06/2014CN103972123A 监控生产工艺的方法及生产工艺监控装置 Monitoring of the production process and production process monitoring device method
08/06/2014CN103972122A 一种晶圆针测方法及装置 One kind of method and apparatus for measuring wafer needle
08/06/2014CN103972121A 晶圆未断灰阶检测方法 Grayscale is not broken wafer detection method
08/06/2014CN103972120A 晶圆劈裂位置测定方法及系统 Wafer split location determination method and system
08/06/2014CN103972119A 一种测试装置和使用该测试装置测量对准偏差的方法 A test apparatus and method of use of the test device for measuring misalignment
08/06/2014CN103972118A 一种晶圆级铜柱凸块结构的金属帽的形成方法 A method of forming a metal cap wafer level of copper pillar bump structure
08/06/2014CN103972117A 一种柔性自动植球装置及植球方法 A flexible device and automatic bumping bumping method
08/06/2014CN103972116A 导线键合机和校准导线键合机的方法 Wire bonding machine and wire bonding machine calibration method
08/06/2014CN103972115A 半导体器件以及制造半导体器件的方法 A semiconductor device and a method of manufacturing a semiconductor device
08/06/2014CN103972114A 半导体封装制造过程及其结构 The semiconductor package manufacturing process and its structure
08/06/2014CN103972113A 封装方法 Encapsulation method
08/06/2014CN103972112A 半导体封装件的制法 The semiconductor package manufacturing method
08/06/2014CN103972111A 引线框架结构的形成方法 The method for forming the leadframe structure
08/06/2014CN103972110A 薄膜晶体管及其制备方法、阵列基板、显示装置 Thin film transistor and its preparation method, the array substrate, display device
08/06/2014CN103972109A 减小负偏压温度不稳定性的mos器件制作方法 Reducing the negative bias temperature instability mos device fabrication method
08/06/2014CN103972108A Pmos源漏区离子注入方法、pmos的制备方法 Pmos source and drain region ion implantation method, pmos preparation
08/06/2014CN103972107A 具有SiGe源漏的FinFET及其形成方法 FinFET with a SiGe source and drain and method of forming
08/06/2014CN103972106A 具有SiGe源漏的MOSFET及其形成方法 SiGe source and drain of the MOSFET has its forming method
08/06/2014CN103972105A 具有SiGe沟道的MOSFET及其形成方法 SiGe channel MOSFET with a method of forming
08/06/2014CN103972104A 具有SiGe沟道的鳍式场效应晶体管及其形成方法 With a SiGe channel FinFET and method of forming
08/06/2014CN103972103A 增加光刻对准的栅极分离方法 Increase in the gate lithography alignment separation method
08/06/2014CN103972102A 超浅结的形成方法及半导体器件的形成方法 The method for forming ultra-shallow junction formation method and a semiconductor device
08/06/2014CN103972101A 用于产生具有垂直电介质层的半导体器件的方法 The method for producing a semiconductor device having a dielectric layer of a vertical
08/06/2014CN103972100A 使用心轴氧化工艺形成鳍式场效应晶体管半导体设备的鳍部的方法 Method uses a mandrel to form oxidation process FinFET fin of semiconductor devices
08/06/2014CN103972099A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/06/2014CN103972098A 用于在体半导体晶片上形成finfet/三栅极器件的方法 A method for forming on a bulk semiconductor wafer finfet / tri-gate device
08/06/2014CN103972097A 制造FinFET器件的方法 FinFET device manufacturing method
08/06/2014CN103972096A 半导体功率器件的制作方法 The method of making a semiconductor power device
08/06/2014CN103972095A 金属氧化物薄膜场效应晶体管的制备方法 Methods for preparing metal oxide thin film field effect transistor
08/06/2014CN103972094A 半导体结构的形成方法 The method of forming a semiconductor structure
08/06/2014CN103972093A 鳍式场效应晶体管牺牲栅极的制作方法 Sacrificial gate FinFET fabrication method
08/06/2014CN103972092A 晶体管的制作方法和确定栅极周围侧墙厚度的方法 The method of making a transistor and determining the thickness of the gate sidewall spacer surrounding Method
08/06/2014CN103972091A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/06/2014CN103972090A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/06/2014CN103972089A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/06/2014CN103972088A 半导体器件制造方法 The semiconductor device manufacturing method
08/06/2014CN103972087A 半导体器件制造方法 The semiconductor device manufacturing method
08/06/2014CN103972086A 一种mos栅控晶闸管的制造方法 One kind mos manufacturing method gated thyristor
08/06/2014CN103972085A 一种形成高压igbt的fs层的方法及igbt器件 A method of high-pressure igbt igbt fs layer and devices
08/06/2014CN103972084A 埋型纵向齐纳二极管的制造方法 Buried type longitudinally Zener diode manufacturing method
08/06/2014CN103972083A 晶圆表面金属尖突结构的制造工艺 Manufacturing process wafer surface metal cusp structure
08/06/2014CN103972082A 一种防止图案缺失的方法及其晶圆制造方法 A method and pattern missing wafer fabrication method for preventing
08/06/2014CN103972081A 一种内介电层的制备方法 Method for preparing the dielectric layer
08/06/2014CN103972080A Ono结构及ono电容的制作方法 Ono ono capacitor structure and method of making
08/06/2014CN103972079A 一种三维空间分布有序硅量子点的制备方法 Preparation of a three-dimensional spatial distribution of the ordered silicon quantum dots
08/06/2014CN103972078A 一种自对准双层图形的形成方法 The method for forming a self-aligned double-figure
08/06/2014CN103972077A 一种自对准双层图形的形成方法 The method for forming a self-aligned double-figure
08/06/2014CN103972076A 一种自对准双层图形的形成方法 The method for forming a self-aligned double-figure
08/06/2014CN103972075A 一种刻蚀方法和阵列基板 One kind of etching method and array substrate
08/06/2014CN103972074A 一种去除晶圆背面掩膜层的方法 A method of removing the mask layer method backside
08/06/2014CN103972073A 芯片背面及侧面涂布保护材料的方法 The method of coating the back side of the chip and the protective material
08/06/2014CN103972072A 半导体器件和用于制造半导体器件的方法 A semiconductor device and a method for manufacturing a semiconductor device
08/06/2014CN103972071A 含氮栅极氧化层的制作方法 The method of making a nitrogen-containing gate oxide layer
08/06/2014CN103972070A 栅氧化层的制造方法 The method of manufacturing a gate oxide layer
08/06/2014CN103972069A AlGaN-GaN异质结欧姆接触制作方法 AlGaN-GaN heterojunction method of making ohmic contacts
08/06/2014CN103972068A 降低多晶硅栅极与活化区镍硅化物厚度比的方法 Method of reducing the activation region and polysilicon gate nickel silicide thickness ratio
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