Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2014
08/06/2014CN203760426U 封装热压板 Packaging hot plate
08/06/2014CN203760425U 一种刻蚀机 One kind etcher
08/06/2014CN103975450A 在太阳能电池中产生二维图式掺杂的方法 Two-dimensional map type doping method in the solar cell generation
08/06/2014CN103975441A 薄膜晶体管和图像显示装置 A thin film transistor and an image display apparatus
08/06/2014CN103975439A 用于降低的电流拥挤的双极性结型晶体管结构及制造其的方法 Reduce current crowding bipolar junction transistor structure and method for manufacturing thereof
08/06/2014CN103975428A 具有增强型热管理的半导体裸片组合件、包含所述半导体裸片组合件的半导体装置及相关方法 Semiconductor die assembly having enhanced thermal management, comprising the semiconductor die assembly of the semiconductor device and related method
08/06/2014CN103975426A 打线装置 Wire device
08/06/2014CN103975425A 粘片机装置 Die Bonder device
08/06/2014CN103975424A 用于非平面晶体管的夹层电介质 Interlayer dielectric for non-planar transistor
08/06/2014CN103975423A 形成半导体器件的方法 The method of forming a semiconductor device
08/06/2014CN103975422A 树脂封装型半导体装置的制造方法以及树脂封装型半导体装置 The method of manufacturing a resin-molded semiconductor device and a resin-molded semiconductor device
08/06/2014CN103975421A 半导体晶片加工用粘合片及使用了该粘合片的半导体晶片的加工方法 Adhesive sheet for semiconductor wafer processing and the use of the semiconductor wafer processing method of the adhesive sheet
08/06/2014CN103975420A 使用改良型摩擦测量的基板抛光端点检测的系统与方法 System and method for using the modified friction measurements substrate polishing endpoint detection
08/06/2014CN103975419A 等离子体活化保形电介质膜沉积 Plasma activated deposition of a conformal dielectric film
08/06/2014CN103975418A 用于平版印刷加工的旋涂碳组合物 Spin-coated carbon composition for lithographic processing
08/06/2014CN103975417A 用于半导体晶体材料形成的系统 System for forming a semiconductor crystal material
08/06/2014CN103975416A 黄光室系统 Yellow Room System
08/06/2014CN103975415A 使用有机平面化掩膜切割多条栅极线 An organic planarization mask cutting a plurality of gate lines
08/06/2014CN103975276A 旋转显影方法及装置 Rotary developing method and apparatus
08/06/2014CN103975037A 研磨用组合物以及使用其的研磨方法及基板的制造方法 The polishing composition and the production method thereof and a substrate polishing method
08/06/2014CN103974560A 用于制造半导体模块装置的方法 The method for manufacturing a semiconductor device module
08/06/2014CN103974539A 集成电路贴片及其制造方法 IC placement and manufacturing method thereof
08/06/2014CN103972789A 氮化物非对称型回音壁模式光学微腔器件及制备方法 Nitride asymmetric whispering gallery mode optical microcavity devices and preparation methods
08/06/2014CN103972381A 装置结构及其制造方法 Device structure and manufacturing method
08/06/2014CN103972374A 多垂直led封装结构 More vertical structure led package
08/06/2014CN103972327A 用于高效钝化硅太阳能电池的原位硅表面预清洗 Situ silicon surface passivation of silicon solar cells for efficient precleaning
08/06/2014CN103972306A 一种具有非连续沟槽设计的肖特基器件结构及其制作方法 Schottky devices having a structure and method of making a non-continuous groove design
08/06/2014CN103972305A 用于低压瞬态电压抑制二极管芯片的制造方法 For low-voltage transient voltage suppression diode chip manufacturing method
08/06/2014CN103972303A 二极管、esd保护电路及其制造方法 Diodes, esd protection circuit and its manufacturing method
08/06/2014CN103972302A 一种jfet器件及其制造方法 One kind jfet device and manufacturing method thereof
08/06/2014CN103972301A 半导体器件、集成电路和制造集成电路的方法 Semiconductor devices, integrated circuits and methods of manufacturing integrated circuits
08/06/2014CN103972299A 一种薄膜晶体管及其制作方法、显示基板、显示装置 A thin film transistor and its manufacturing method, display board, a display device
08/06/2014CN103972298A 薄膜晶体管及其制造方法 A thin film transistor and manufacturing method thereof
08/06/2014CN103972295A 一种jfet器件及其制造方法 One kind jfet device and manufacturing method thereof
08/06/2014CN103972294A 横向双重扩散式金属氧化物半导体晶体管及其制造方法 Lateral double diffused metal oxide semiconductor transistor and its manufacturing method
08/06/2014CN103972293A 侧墙结构、侧墙结构的制备方法、cmos器件 Preparation sidewall structure, side wall structure, cmos devices
08/06/2014CN103972292A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
08/06/2014CN103972291A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/06/2014CN103972290A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/06/2014CN103972289A 半导体装置及制造半导体装置的方法 Semiconductor device and method for manufacturing a semiconductor device
08/06/2014CN103972288A 超结沟槽式金属氧化物半导体场效应晶体管及其制备方法 Superjunction trench metal oxide semiconductor field effect transistor and its preparation method
08/06/2014CN103972286A 具有p顶层与n能阶的半导体装置及其制造方法 Having a p top layer of the semiconductor device and manufacturing method thereof capable of order n
08/06/2014CN103972285A 半导体元件及其制作方法 Semiconductor device and manufacturing method thereof
08/06/2014CN103972284A 半导体器件 Semiconductor devices
08/06/2014CN103972283A 半导体器件 Semiconductor devices
08/06/2014CN103972282A 反向阻断半导体器件和制造反向阻断半导体器件的方法 Reverse blocking semiconductor device and manufacturing method of a semiconductor device reverse blocking
08/06/2014CN103972281A 包括边缘区域的半导体器件和制造半导体器件的方法 And a method of manufacturing a semiconductor device including a semiconductor device edge region
08/06/2014CN103972280A 一种具有场截止结构的igbt及其制造方法 A method of manufacturing the field stop igbt structure having
08/06/2014CN103972279A 双极型纵向平面式晶体管及其制造方法 Longitudinal bipolar transistor and method for manufacturing a planar-type
08/06/2014CN103972278A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/06/2014CN103972277A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
08/06/2014CN103972276A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
08/06/2014CN103972275A 半导体装置及用以制造半导体装置的方法 Semiconductor device and method for manufacturing a semiconductor device
08/06/2014CN103972263A 显示单元及其制造方法和电子设备 The display unit manufacturing method thereof and electronic equipment
08/06/2014CN103972262A 一种有机发光显示装置及其制造方法 An organic light emitting display device and manufacturing method thereof
08/06/2014CN103972261A 有机发光显示器及其制造方法 The organic light emitting display and method of manufacturing
08/06/2014CN103972255A 晶圆封装方法 Wafer packaging method
08/06/2014CN103972250A 界面的润湿性差异产生的自对准 The difference in wettability interface generated self-aligned
08/06/2014CN103972245A 像素结构与其制造方法 Pixel structure and its manufacturing method
08/06/2014CN103972244A 显示面板及其制作方法 Display panel and manufacturing method thereof
08/06/2014CN103972243A 一种阵列基板及其制作方法、显示装置 One kind of array substrate and method of manufacturing the display device
08/06/2014CN103972242A 一种阵列基板、显示装置及阵列基板的制作方法 An array substrate, the display device and method of manufacturing the array substrate
08/06/2014CN103972241A 电子纸的阵列基板及其制造方法和电子纸 Electronic paper array substrate and manufacturing method, and electronic paper
08/06/2014CN103972236A 包含鳍式场效电晶体装置的集成电路及其制造方法 IC and its manufacturing method includes a fin field effect transistor device
08/06/2014CN103972235A 电子器件及其形成方法 Electronic device and method for forming
08/06/2014CN103972234A 集成电路、半导体器件和制造半导体器件的方法 An integrated circuit, semiconductor device, and manufacturing a semiconductor device
08/06/2014CN103972232A 一种阵列基板及其制作方法、显示装置 One kind of array substrate and method of manufacturing the display device
08/06/2014CN103972227A 在标准单元结构中形成具有金属化电阻器的集成电路的方法及装置 The method of forming an integrated circuit having a metallized resistor in the standard cell structure and means
08/06/2014CN103972224A 具有有源内插器的集成电路封装 Integrated circuit package having an active interpolator
08/06/2014CN103972218A 集成无源器件扇出型晶圆级封装结构及制作方法 Integrated passives fan-out wafer level package structure and method of making
08/06/2014CN103972217A 集成无源电容扇出型晶圆级封装结构及制作方法 Integrated passive capacitors fan-out wafer level package structure and method of making
08/06/2014CN103972216A 一种可控自形成MnSi<sub>x</sub>O<sub>y</sub>/Cu<sub>3</sub>Ge双层扩散阻挡层制备工艺 Since the formation of a controlled MnSi <sub> x </ sub> O <sub> y </ sub> / Cu <sub> 3 </ sub> Ge double diffusion barrier layer preparation process
08/06/2014CN103972214A 具有低应力薄膜间隙的贯穿硅穿孔装置及其形成方法 Through perforation device has a low-stress silicon thin film and method of forming the gap
08/06/2014CN103972213A 具有多级互连的半导体器件及其形成方法 Semiconductor device having a multi-level interconnect and method of forming
08/06/2014CN103972212A 用于封装件中的传输线的方法和装置 Method and device package of the transmission line for
08/06/2014CN103972210A 半导体装置、半导体装置的制造方法 The method of manufacturing a semiconductor device, a semiconductor device
08/06/2014CN103972207A 堆叠管芯之间的螺旋形螺旋电感器 Spiral spiral inductors between stacked die
08/06/2014CN103972204A 封装基板、半导体封装件及其制法 Package substrate, a semiconductor package Jiqizhifa
08/06/2014CN103972203A 嵌埋有电子组件的线路板结构及其制法 There are board structure embedded electronic components Jiqizhifa
08/06/2014CN103972199A 线键合方法和结构 Wire bonding method and structure
08/06/2014CN103972198A 半导体装置及半导体装置的制造方法 Semiconductor device and manufacturing method of a semiconductor device
08/06/2014CN103972197A 半导体器件及其制造方法、引线和制作该引线的方法 Semiconductor device and manufacturing method thereof, and methods of making the leads of the lead
08/06/2014CN103972193A 功率晶体管装置和用于制造功率晶体管装置的方法 Power transistor device and a method of manufacturing apparatus for power transistors
08/06/2014CN103972190A 一种大电流半导体器件及其封装方法 One kind of high-current semiconductor device and packaging method
08/06/2014CN103972189A 半导体器件、其制造方法及半导体器件封装 Semiconductor device, manufacturing method thereof and a semiconductor device package
08/06/2014CN103972187A 芯片封装及其制造方法 Chip package and manufacturing method thereof
08/06/2014CN103972185A 集成器件及其制造方法 Integrated device and manufacturing method thereof
08/06/2014CN103972181A 内含表面包覆玻璃层的硅晶片的封装器件及其封装方法 Packaged device and packaging method containing glass layer coated silicon wafer
08/06/2014CN103972179A 一种提高B4-Flash器件耐久性的方法 A way to improve the durability of B4-Flash device method
08/06/2014CN103972178A 用于加工载体的方法和用于制作电荷储存存储基元的方法 A method for processing vectors and methods for making the charge storage element of the storage group
08/06/2014CN103972177A 半导体器件的制造方法 The method of manufacturing a semiconductor device
08/06/2014CN103972176A 半导体器件的制备方法 The method for preparing a semiconductor device
08/06/2014CN103972175A Nand闪存的镶嵌结构的制造方法 Nand flash memory manufacturing method mosaic structure
08/06/2014CN103972174A SiGe体区纵向1T-DRAM器件及其制造方法 1T-DRAM device and a manufacturing method for a longitudinal SiGe body region
08/06/2014CN103972173A Cmos晶体管的形成方法 The method of forming a transistor Cmos
08/06/2014CN103972172A 一种二极管选择元件阵列结构及制造方法 Selecting element to a diode array structure and method of manufacture
08/06/2014CN103972171A 基于液体硅印刷的不锈钢基底的芯片切割工艺 Liquid silicone based printing stainless steel substrate chip cutting process
08/06/2014CN103972170A 半导体器件及其生产方法 Semiconductor device and production method thereof
08/06/2014CN103972169A 一种ltps工艺 One kind ltps process
08/06/2014CN103972168A 在集成电路中生成电能的方法、相应集成电路及制造方法 The method of generating electrical energy in an integrated circuit, an integrated circuit and a corresponding method for producing
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