Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2014
08/12/2014US8803209 Photo detector device, photo sensor and spectrum sensor
08/12/2014US8803208 Method for fabricating contact electrode and semiconductor device
08/12/2014US8803204 Manufacturing method of solid-state image pickup device and solid-state image pickup device
08/12/2014US8803200 Access transistor with a buried gate
08/12/2014US8803195 Nanomembrane structures having mixed crystalline orientations and compositions
08/12/2014US8803194 Zirconium and hafnium boride alloy templates on silicon for nitride integration applications
08/12/2014US8803160 Lightly doped silicon carbide wafer and use thereof in high power devices
08/12/2014US8803146 Semiconductor device and manufacturing method thereof
08/12/2014US8803144 Thin film transistor susbtrate including oxide semiconductor
08/12/2014US8803141 Hydrazine-free solution deposition of chalcogenide films
08/12/2014US8803129 Patterning contacts in carbon nanotube devices
08/12/2014US8803127 Superlattice quantum well infrared detector
08/12/2014US8803121 Resistive memory element and related control method
08/12/2014US8803110 Methods for beam current modulation by ion source parameter modulation
08/12/2014US8802990 Self-aligned nano-scale device with parallel plate electrodes
08/12/2014US8802776 Epoxy resin composition, method for producing composite unit using the epoxy resin composition, and composite unit
08/12/2014US8802763 Curable organopolysiloxane composition and semiconductor device
08/12/2014US8802609 Nitrile and amidoxime compounds and methods of preparation for semiconductor processing
08/12/2014US8802608 Composition for cleaning and rust prevention and process for producing semiconductor element or display element
08/12/2014US8802580 Systems and methods for the crystallization of thin films
08/12/2014US8802579 Semiconductor structure and fabrication method thereof
08/12/2014US8802578 Method for forming tin by PVD
08/12/2014US8802577 Method for manufacturing a semiconductor device using a nitrogen containing oxide layer
08/12/2014US8802576 Semiconductor device and method of manufacturing the same
08/12/2014US8802575 Method for forming the gate insulator of a MOS transistor
08/12/2014US8802574 Methods of making jogged layout routings double patterning compliant
08/12/2014US8802573 Methods of etching trenches into silicon of a semiconductor substrate, methods of forming trench isolation in silicon of a semiconductor substrate, and methods of forming a plurality of diodes
08/12/2014US8802572 Method of patterning a low-k dielectric film
08/12/2014US8802571 Method of hard mask CD control by Ar sputtering
08/12/2014US8802570 Pattern forming method
08/12/2014US8802569 Method of fabricating a semiconductor device
08/12/2014US8802568 Method for manufacturing chemical sensor with multiple sensor cells
08/12/2014US8802567 Plasma processing method
08/12/2014US8802566 Method for producing semiconductor components on a substrate, and substrate comprising semiconductor components
08/12/2014US8802565 Semiconductor plural gate lengths
08/12/2014US8802564 Method of manufacturing a semiconductor component
08/12/2014US8802563 Surface repair structure and process for interconnect applications
08/12/2014US8802562 Semiconductor device including copper wiring and via wiring having length longer than width thereof and method of manufacturing the same
08/12/2014US8802561 Method of inhibiting wire collapse
08/12/2014US8802560 Method of fabricating an semiconductor interconnect structure
08/12/2014US8802559 Interconnect structure with an electromigration and stress migration enhancement liner
08/12/2014US8802558 Copper interconnect structures and methods of making same
08/12/2014US8802557 Micro bump and method for forming the same
08/12/2014US8802556 Barrier layer on bump and non-wettable coating on trace
08/12/2014US8802555 Integrated circuit packaging system with interconnects and method of manufacture thereof
08/12/2014US8802554 Patterns of passivation material on bond pads and methods of manufacture thereof
08/12/2014US8802553 Method for mounting a semiconductor chip on a carrier
08/12/2014US8802552 Method for manufacturing semiconductor device
08/12/2014US8802551 Methods of fabricating a semiconductor device using voids in a sacrificial layer
08/12/2014US8802550 Heat treatment method for heating substrate by irradiating substrate with flash of light
08/12/2014US8802549 Semiconductor surface modification
08/12/2014US8802547 Method and apparatus for forming amorphous silicon film
08/12/2014US8802546 Method for manufacturing silicon carbide semiconductor device
08/12/2014US8802545 Method and apparatus for plasma dicing a semi-conductor wafer
08/12/2014US8802544 Method for manufacturing chip including a functional device formed on a substrate
08/12/2014US8802543 Laser processing method
08/12/2014US8802542 Combination of a substrate and a wafer
08/12/2014US8802541 Method for low temperature wafer bonding and bonded structure
08/12/2014US8802540 Method of manufacturing bonded wafer
08/12/2014US8802539 Charge reservoir structure
08/12/2014US8802538 Methods for hybrid wafer bonding
08/12/2014US8802537 System and method for improving reliability in a semiconductor device
08/12/2014US8802535 Doped core trigate FET structure and method
08/12/2014US8802534 Method for forming SOI substrate and apparatus for forming the same
08/12/2014US8802533 Semiconductor device and method of manufacturing the same
08/12/2014US8802531 Split-channel transistor and methods for forming the same
08/12/2014US8802530 MOSFET with improved performance through induced net charge region in thick bottom insulator
08/12/2014US8802528 Vertical PMOS field effect transistor and manufacturing method thereof
08/12/2014US8802527 Gate electrode optimized for low voltage operation
08/12/2014US8802526 Methods of forming reverse mode non-volatile memory cell structures
08/12/2014US8802525 Methods of forming charge storage structures including etching diffused regions to form recesses
08/12/2014US8802524 Method of manufacturing semiconductor device having metal gates
08/12/2014US8802523 CMOS device and fabrication method
08/12/2014US8802521 Semiconductor fin-shaped structure and manufacturing process thereof
08/12/2014US8802520 Method of forming a field effect transistor having source/drain material over insulative material
08/12/2014US8802519 Work function adjustment with the implant of lanthanides
08/12/2014US8802518 Semiconducor device and method for manufacturing the same
08/12/2014US8802517 Extreme high mobility CMOS logic
08/12/2014US8802516 Normally-off gallium nitride-based semiconductor devices
08/12/2014US8802515 Semiconductor device and method for manufacturing the same
08/12/2014US8802514 Graphene and nanotube/nanowire transistor with a self-aligned gate structure on transparent substrates and method of making same
08/12/2014US8802513 Fin field effect transistors having a nitride containing spacer to reduce lateral growth of epitaxially deposited semiconductor materials
08/12/2014US8802512 Overlap capacitance nanowire
08/12/2014US8802511 Display device
08/12/2014US8802510 Methods for controlling line dimensions in spacer alignment double patterning semiconductor processing
08/12/2014US8802509 Configuration of gate to drain (GD) clamp and ESD protection circuit for power device breakdown protection
08/12/2014US8802508 Semiconductor device package
08/12/2014US8802507 Fabrication method of semiconductor package device, and fabrication method of semiconductor package structure
08/12/2014US8802506 Method of manufacturing a semiconductor device and a semiconductor device produced thereby
08/12/2014US8802505 Semiconductor device and method of forming a protective layer on a backside of the wafer
08/12/2014US8802504 3D packages and methods for forming the same
08/12/2014US8802502 TSOP with impedance control
08/12/2014US8802501 Integrated circuit packaging system with island terminals and method of manufacture thereof
08/12/2014US8802500 Integrated circuit packaging system with leads and method of manufacture thereof
08/12/2014US8802499 Methods for temporary wafer molding for chip-on-wafer assembly
08/12/2014US8802498 Method of manufacturing semiconductor package having no chip pad
08/12/2014US8802497 Forming semiconductor chip connections
08/12/2014US8802496 Substrate for semiconductor package and method of manufacturing thereof
08/12/2014US8802495 Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same
08/12/2014US8802494 Method of fabricating a semiconductor device having an interposer
1 ... 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 ... 6590