Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2014
08/07/2014US20140216337 Plasma activated conformal dielectric film deposition
08/07/2014US20140216336 Metal and silicon containing capping layers for interconnects
08/07/2014US20140216332 Vacuum treatment device
08/07/2014DE112012004718T5 Hybride Photoresistzusammensetzung sowie musterbildendes Verfahren unter Verwendung derselben Hybrid photoresist composition and pattern forming method using the same
08/07/2014DE112012004541T5 Halbleitervorrichtung Semiconductor device
08/07/2014DE112012003829T5 Vorrichtung zum Einfüllen von Metall An apparatus for filling with metal
08/07/2014DE112012003823T5 Mikrostrukturmodifikation in Kupferverbindungsstrukturen Microstructure modification in copper interconnect structures
08/07/2014DE112006003788B4 Elektronisches Bauteil mit Leadframe mit nichtleitenden Verbindungsstegen und Verfahren zur Herstellung des elektronischen Bauteils An electronic part having lead frame with non-conductive tie bars and processes for making the electronic component
08/07/2014DE102014201625A1 Verfahren zum Bilden von Stegen für eine FinFET-Halbleitervorrichtung unter Verwendung eines Dornoxidationsprozesses A method for forming webs of a FinFET semiconductor device using a mandrel oxidation process
08/07/2014DE102014201227A1 Halbleitervorrichtung und verfahren zum herstellen derselben A semiconductor device and method of manufacturing the same
08/07/2014DE102014101552A1 Elektrisches verbindungselement und verfahren zum herstellen desselben An electrical connection element of the same and methods for making
08/07/2014DE102014101475A1 Ätzen von porösem Metall Etching of porous metal
08/07/2014DE102014101430A1 Verfahren zum Herstellen eines Halbleiterbauelements mit einer vertikalen Dielektrikumsschicht A method of manufacturing a semiconductor device with a vertical dielectric layer
08/07/2014DE102014101283A1 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
08/07/2014DE102014101261A1 Leistungstransistoranordnung und Verfahren zu deren Herstellung Output transistor arrangement and methods for their preparation
08/07/2014DE102014101239A1 Bipolarer halbleiterschalter und ein herstellungsverfahren dafür Bipolar semiconductor switch and a manufacturing method for
08/07/2014DE102014100931A1 Bauelement, das einen Halbleiterchip und Drähte beinhaltet Component that includes a semiconductor chip and wires
08/07/2014DE102013225863A1 Verfahren der Herstellung von Nanokegel-Textur bzw. -Struktur auf Glas und transparenten Leitern A method of manufacturing nano-conical texture or structure on glass and transparent conductors
08/07/2014DE102013225135A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation
08/07/2014DE102013219959A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
08/07/2014DE102013202028A1 Verfahren zum Herstellen von Wafern, insbesondere von Wafern für Solarzellen, und Vorrichtung zum Herstellen von Wafern A method of producing wafers, in particular of wafers for solar cells, and apparatus for producing wafers
08/07/2014DE102013201932A1 Vorrichtung und Verfahren zum Bearbeiten eines Werkstücks Apparatus and method for machining a workpiece
08/07/2014DE102013201926A1 Verfahren zum elektrischen Kontaktieren eines Bauteils und Bauteilverbund A method for electrically contacting a component and composite component
08/07/2014DE102013200868A1 Verfahren zur Herstellung einer stoffschlüssigen Verbindung und einer elektrischen Verbindung A process for producing a material-locking connection and an electrical connection
08/07/2014DE102013200756A1 Läuferscheibe für die beidseitige Politur von Scheiben aus Halbleitermaterial Rotor disc for the two-sided polishing of wafers of semiconductor material
08/07/2014DE102013105803A1 Träger zur Halterung von Halbleitersubstraten und Prober zu deren Testung Carrier for supporting semiconductor substrates and prober to the testing
08/07/2014DE102013104663A1 Haltestruktur für eine Barrierenschicht einer Halbleitervorrichtung Support structure for a barrier layer of a semiconductor device
08/07/2014DE102013100576A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device
08/07/2014DE102013001967A1 Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten Träger zu einem zweiten Träger Apparatus and method for transferring electronic components from a first carrier to a second carrier
08/07/2014DE102011089759B4 Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement A process for producing a semiconductor device and semiconductor device
08/07/2014DE102008035911B4 Verfahren zum Herstellen eines integrierten Schaltungsmoduls A method of manufacturing an integrated circuit module
08/07/2014DE102004037817B4 Elektrisches Bauelement in Flip-Chip-Bauweise The electrical component in flip-chip-type
08/07/2014DE10014455B4 Pegelschieber Level shifter
08/06/2014EP2763307A1 Semiconductor drive circuit and power conversion apparatus using same
08/06/2014EP2763181A1 Semiconductor device and method for producing semiconductor device
08/06/2014EP2763178A1 Igbt and manufacturing method therefor
08/06/2014EP2763177A1 Method of manufacturing a MOS transistor with air spacers
08/06/2014EP2763176A1 Silicon carbide semiconductor device fabrication method
08/06/2014EP2763162A1 Preventing metal contamination of a component in semi-conductors
08/06/2014EP2763161A1 Transport system
08/06/2014EP2763160A1 Semiconductor device
08/06/2014EP2763159A1 Improved low resistance contacts for semiconductor devices
08/06/2014EP2763158A1 Reflective mask blank, reflective mask, and methods for manufacturing reflective mask blank and reflective mask
08/06/2014EP2763157A1 Mask blank for reflection-type exposure, and mask for reflection-type exposure
08/06/2014EP2763138A2 Ambient temperature wire bonding method, as well as the device obtained thereby
08/06/2014EP2762976A1 Use of immersion liquids
08/06/2014EP2762897A1 Probe card for power device
08/06/2014EP2762840A1 Portable electronic device with sensors chip and through-silicon vias
08/06/2014EP2762615A2 Substrate, substrate with thin film, semiconductor device, and method of manufacturing semiconductor device
08/06/2014EP2762513A1 Resin having fluorene structure and underlayer film-forming material for lithography
08/06/2014EP2761666A1 Method for decreasing an excess carrier induced degradation in a silicon substrate
08/06/2014EP2761664A1 Capping dielectric structure for transistor gates
08/06/2014EP2761663A1 Electropositive metal containing layers for semiconductor applications
08/06/2014EP2761662A1 Tungsten gates for non-planar transistors
08/06/2014EP2761661A2 Mct device with base-width-determined latching and non-latching states
08/06/2014EP2761660A1 Bipolar junction transistor with spacer layer and method of manufacturing the same
08/06/2014EP2761656A1 Circuit that selects eproms individually and in parallel
08/06/2014EP2761655A1 Interlayer communications for 3d integrated circuit stack
08/06/2014EP2761653A1 Reconstituted wafer package with high voltage discrete active dice and integrated field plate for high temperature leakage current stability
08/06/2014EP2761652A1 Method for producing a solder joint
08/06/2014EP2761651A1 Method for handling very thin device wafers
08/06/2014EP2761650A2 Layer composite for connecting electronic components comprising a compensation layer, linking layers and connection layers
08/06/2014EP2761649A1 Structure having monolithic heterogeneous integration of compound semiconductors with elemental semiconductor
08/06/2014EP2761648A1 Non-planar transitor fin fabrication
08/06/2014EP2761647A1 Non-planar transistors and methods of fabrication thereof
08/06/2014EP2761646A1 Methods of forming through-substrate vias
08/06/2014EP2761645A2 Group iii-v substrate material with particular crystallographic features and methods of making
08/06/2014EP2761416A1 Contactless user interface having organic semiconductor components
08/06/2014EP2761415A1 Contactless user interface
08/06/2014EP2761374A1 Pattern forming method, electron beam-sensitive or extreme ultraviolet-sensitive composition, resist film, method for manufacturing electronic device using the same, and electronic device
08/06/2014EP2761373A1 Pattern-forming method, electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition, resist film, manufacturing method of electronic device using them and electronic device
08/06/2014EP2761372A1 Pattern-forming method, electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition, resist film, manufacturing method of electronic device using them and electronic device
08/06/2014EP2761059A1 Methods of continuously wet etching a patterned substrate
08/06/2014EP2761056A2 Layered composite of a substrate film and of a layer assembly comprising a sinterable layer made of at least one metal powder and a solder layer
08/06/2014EP2760894A1 Photo-curable composition and patterning method using the same
08/06/2014EP2760808A1 Calibration and normalization systems and methods for radiopharmaceutical synthesizers
08/06/2014CN203760502U 具有流量测算功能的多晶制绒机补液管道 Polycrystalline Texturing machine fluid pipes with flow calculation function
08/06/2014CN203760464U 一种通用预封装基板结构、封装结构 A universal pre-packaged substrate structure, package structure
08/06/2014CN203760448U 基板翻转装置 Board turning device
08/06/2014CN203760447U 一种晶片固定器 A wafer holder
08/06/2014CN203760446U 一种半导体晶片同步对中机构 A semiconductor wafer for the synchronization mechanism
08/06/2014CN203760445U 定位装置 Positioning device
08/06/2014CN203760444U 用于对准基板的装置和太阳能电池生产装置 And means for producing a solar cell device alignment substrate
08/06/2014CN203760443U 图案化蓝宝石基板的蚀刻制程用承载盘 Etching process using a patterned sapphire substrate carrier plate of
08/06/2014CN203760442U 碳化硅舟的保护装置 SiC boat protection device
08/06/2014CN203760441U 晶圆清洗机 Wafer cleaning machine
08/06/2014CN203760440U 一种二极管腐蚀模具 Corrosion to a diode die
08/06/2014CN203760439U 用于在晶圆的端子面上生产接触金属的设备 Surface of the wafer for the production of contact metal terminal equipment
08/06/2014CN203760438U 一种喷淋系统及湿法刻蚀装置 One kind of sprinkler system and wet etching equipment
08/06/2014CN203760437U 用于PoP封装的自动夹爪机构 PoP package for automatic gripper mechanism
08/06/2014CN203760436U 一种自动晶体管散热片装配装置 An automatic transistor heatsink assembly unit
08/06/2014CN203760435U 湿法刻蚀绝缘清洗机水膜保护装置 Wet etching the insulating film of water cleaning machine protection device
08/06/2014CN203760434U 干法刻蚀机夹具座 Dry etching machine holders
08/06/2014CN203760433U 湿法刻蚀绝缘清洗槽改造装置 Wet etching cleaning tank insulation reconstruction device
08/06/2014CN203760432U 一种湿法刻蚀设备 One kind of wet etching equipment
08/06/2014CN203760431U 新型整平机 The new leveler
08/06/2014CN203760430U 晶圆刻号自动识别系统 Wafer engraved No. Automatic Identification System
08/06/2014CN203760429U 可更换式吸料段的晶粒吸料轨道 Replaceable suction segment grain suction track
08/06/2014CN203760428U 一种用于硅微芯片电学特性检测的圆片级测试装置 Wafer-level testing device for electrical properties of silicon microchip for detection
08/06/2014CN203760427U 内嵌式多晶片封装的测试治具 Embedded multi-chip package test fixture
1 ... 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 ... 6590