Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2014
08/07/2014US20140220773 Fabrication of graphene nanoribbons and nanowires
08/07/2014US20140220772 Doping Control of Metal Nitride Films
08/07/2014US20140220771 Worm memory device and process of manufacturing the same
08/07/2014US20140220770 Methods of Fabricating Semiconductor Devices and Structures Thereof
08/07/2014US20140220769 Integrated circuits including ild structure, systems, and fabrication methods thereof
08/07/2014US20140220768 Method of laser irradiation, laser irradiation apparatus, and method of manufacturing a semiconductor device
08/07/2014US20140220767 Double-pattern gate formation processing with critical dimension control
08/07/2014US20140220766 Planar semiconductor growth on iii-v material
08/07/2014US20140220765 Method for separating support substrate from solid-phase bonded wafer and method for manufacturing semiconductor device
08/07/2014US20140220764 Thin film wafer transfer and structure for electronic devices
08/07/2014US20140220763 Memory Devices and Formation Methods
08/07/2014US20140220762 Method of manufacturing isolation structure
08/07/2014US20140220761 Reduction of polysilicon residue in a trench for polysilicon trench filling processes
08/07/2014US20140220760 Integration of shallow trench isolation and through-substrate vias into integrated circuit designs
08/07/2014US20140220759 Methods for fabricating integrated circuits having gate to active and gate to gate interconnects
08/07/2014US20140220757 Pinch-off control of gate edge dislocation
08/07/2014US20140220755 Semiconductor Structures Employing Strained Material Layers with Defined Impurity Gradients and Methods for Fabricating Same
08/07/2014US20140220753 Apparatus and Method for FinFETs
08/07/2014US20140220748 Method for fabricating complementary tunneling field effect transistor based on standard cmos ic process
08/07/2014US20140220745 Laminating system
08/07/2014US20140220744 Method of making wire bond vias and microelectronic package having wire bond vias
08/07/2014US20140220742 Method for forming a thin semiconductor device
08/07/2014US20140220741 Stacked structures and methods of forming stacked structures
08/07/2014US20140220740 Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure
08/07/2014US20140220739 Semiconductor device manufacturing method
08/07/2014US20140220738 Lead frame array package with flip chip die attach
08/07/2014US20140220735 Method and Apparatus for a Wafer Seal Ring
08/07/2014US20140220734 Method for controlling concentration of donor in ga2o3-based single crystal
08/07/2014US20140220728 Methods of forming semiconductor films including i2-ii-iv-vi4 and i2-(ii,iv)-iv-vi4 semiconductor films and electronic devices including the semiconductor films
08/07/2014US20140220714 Method for manufacturing semiconductor light-emitting element
08/07/2014US20140220712 Imaging Device, Semiconductor Manufacturing Apparatus, and Semiconductor Manufacturing Method
08/07/2014US20140220711 Apparatus, method and program for manufacturing nitride film
08/07/2014US20140220710 System for non radial temperature control for rotating substrates
08/07/2014US20140220709 Controlling cd and cd uniformity with trim time and temperature on a wafer by wafer basis
08/07/2014US20140220503 Heat treatment method and heat treatment apparatus
08/07/2014US20140220257 Method of processing a substrate
08/07/2014US20140219904 Geothermal energization of a non-combustion chemical reactor and associated systems and methods
08/07/2014US20140219764 Centering guide for wafers of different sizes
08/07/2014US20140219750 Semiconductor cleaner systems and methods
08/07/2014US20140219749 Substrate processing apparatus and robot controller
08/07/2014US20140219302 Thermal management in laser diode device
08/07/2014US20140218927 Desktop Item with LED Means Has USB-unit(s) or USB-Module to Charge Other Electric or Digital Data Device(s)
08/07/2014US20140218885 Device Including a Semiconductor Chip and Wires
08/07/2014US20140218723 Surface inspection apparatus and method thereof
08/07/2014US20140218652 Semiconductor device and manufacturing method thereof
08/07/2014US20140217665 Substrate support with controlled sealing gap
08/07/2014US20140217622 Semiconductor Package Resin Composition and Usage Method Thereof
08/07/2014US20140217621 Encapsulation film
08/07/2014US20140217619 Microelectronic package having wire bond vias and stiffening layer
08/07/2014US20140217618 Method for making electronic device with liquid crystal polymer and related devices
08/07/2014US20140217613 Integrated device and fabrication process thereof
08/07/2014US20140217609 Semiconductor Device and Method of Forming Conductive Vias with Trench in Saw Street
08/07/2014US20140217605 Interconnection structure for package and fabrication method thereof
08/07/2014US20140217598 Semiconductor memory device and method for manufacturing same
08/07/2014US20140217597 Semiconductor Device and Method of Forming Stress Relieving Vias for Improved Fan-Out WLCSP Package
08/07/2014US20140217596 Power transistor arrangement and method for manufacturing the same
08/07/2014US20140217590 Through silicon via metallization
08/07/2014US20140217589 Support structure for barrier layer of semiconductor device
08/07/2014US20140217588 Methods of forming copper-based nitride liner/passivation layers for conductive copper structures and the resulting device
08/07/2014US20140217579 High density package interconnects
08/07/2014US20140217577 Semiconductor Device and Method for Manufacturing a Semiconductor Device
08/07/2014US20140217575 3DIC Package Comprising Perforated Foil Sheet
08/07/2014US20140217567 Semiconductor device and manufacturing method of the same
08/07/2014US20140217563 Multifunction semiconductor package structure and method of manufacturing the same
08/07/2014US20140217556 Methods for dicing a compound semiconductor wafer, and diced wafers and die obtained thereby
08/07/2014US20140217555 Semiconductor device and manufacturing method thereof
08/07/2014US20140217554 Crystal laminate structure and method for producing same
08/07/2014US20140217553 Template layers for heteroepitaxial deposition of iii nitride semiconductor materials using hvpe processes
08/07/2014US20140217546 Helical spiral inductor between stacking die
08/07/2014US20140217544 Methods of forming a transistor device on a bulk substrate and the resulting device
08/07/2014US20140217520 Air-spacer mos transistor
08/07/2014US20140217517 Integrated circuits including finfet devices with lower contact resistance and reduced parasitic capacitance and methods for fabricating the same
08/07/2014US20140217516 CMOS Image Sensor
08/07/2014US20140217515 Semiconductor integrated circuit
08/07/2014US20140217504 Finfet structure and method to adjust threshold voltage in a finfet structure
08/07/2014US20140217503 Silicon-on-insulator radio-frequency device and method of forming the same
08/07/2014US20140217500 Semiconductor Device with Low On Resistance and High Breakdown Voltage
08/07/2014US20140217491 Dense arrays and charge storage devices
08/07/2014US20140217484 One-time programmable memory and method for making the same
08/07/2014US20140217473 Device comprising nanostructures and method of manufacturing thereof
08/07/2014US20140217472 Method for fabricating mesa sidewall with spin coated dielectric material and semiconductor element thereof
08/07/2014US20140217468 Planar semiconductor growth on iii-v material
08/07/2014US20140217467 Methods of forming substrates comprised of different semiconductor materials and the resulting device
08/07/2014US20140217462 Vertical power component
08/07/2014US20140217420 Methods and structures for preparing single crystal silicon wafers for use as substrates for epitaxial arowth of crack-free aallium nitride fi ms and devices
08/07/2014US20140217410 Array Substrate, Display Device and Manufacturing Method Thereof
08/07/2014US20140217407 Semiconductor device and method of manufacturing semiconductor device
08/07/2014US20140217406 Apparatus and Method for Non-Intrusive Random Memory Failure Emulation Within an Integrated Circuit
08/07/2014US20140217287 Semiconductor Device and Method of Driving the Same
08/07/2014US20140217066 Silicon substrate processing method, element embedded substrate, and channel forming substrate
08/07/2014US20140216941 Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion
08/07/2014US20140216940 Methods and apparatus for uniformly metallization on substrates
08/07/2014US20140216658 Vacuum processing device
08/07/2014US20140216657 Plasma processing apparatus and sample stage thereof
08/07/2014US20140216541 Silicon substrate with texture structure and forming method thereof
08/07/2014US20140216506 Substrate processing apparatus
08/07/2014US20140216505 Substrate cleaning apparatus and substrate cleaning method
08/07/2014US20140216500 Single Wafer Cleaning Tool with H2SO4 Recycling
08/07/2014US20140216342 Processing system for combined metal deposition and reflow anneal for forming interconnect structures
08/07/2014US20140216341 Chemical vapor deposition reactor