Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2010
12/14/2010US7851280 Organic electroluminescent display and method of fabricating the same
12/14/2010US7851279 Manufacturing method of semiconductor device
12/14/2010US7851278 Semiconductor device and method for manufacturing the same
12/14/2010US7851277 Semiconductor device and method of manufacturing same
12/14/2010US7851276 Methods and structures for planar and multiple-gate transistors formed on SOI
12/14/2010US7851275 Pixel of image sensor and method for fabricating the same
12/14/2010US7851274 Processing technique to improve the turn-off gain of a silicon carbide gate turn-off thyristor
12/14/2010US7851273 Method of testing an integrated circuit die, and an integrated circuit die
12/14/2010US7851272 Multi-project wafer and method of making same
12/14/2010US7851271 Producing a flexible printed circuit board by hot-pressing a copper-clad laminate or copper foil and a prepreg or a heat-resistant film along with a mold-releasing film having a layer of a polyphenylene ether-based resin (> 50 wt %) more; heat resistance; shrinkage inhibition; colorfastness;
12/14/2010US7851270 Manufacturing process for a chip package structure
12/14/2010US7851269 Method of stiffening coreless package substrate
12/14/2010US7851268 Integrated circuit package system using heat slug
12/14/2010US7851267 Power semiconductor module method
12/14/2010US7851266 Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafers
12/14/2010US7851265 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
12/14/2010US7851264 Semiconductor device singulation method
12/14/2010US7851263 Semiconductor device and method of manufacturing the same
12/14/2010US7851262 Manufacturing process for a chip package structure
12/14/2010US7851261 Semiconductor package and method of assembling the same
12/14/2010US7851260 Method for manufacturing a semiconductor device
12/14/2010US7851259 Stack-type semiconductor package, method of forming the same and electronic system including the same
12/14/2010US7851258 Method of manufacturing an RFID tag
12/14/2010US7851257 Integrated circuit stacking system with integrated passive components
12/14/2010US7851255 Placement of an integrated circuit
12/14/2010US7851254 B-stageable die attach adhesives
12/14/2010US7851251 Portable optical detection chip and manufacturing method thereof
12/14/2010US7851250 Method for manufacturing semiconductor device and method for manufacturing display device
12/14/2010US7851248 Method for producing a micromechanical component having a thin-layer capping
12/14/2010US7851247 Method of fabricating micro-electromechanical system microphone structure
12/14/2010US7851245 Organic light-emitting display device and method of manufacturing the same
12/14/2010US7851244 Methods for forming metal layers for a MEMS device integrated circuit
12/14/2010US7851243 Nitride based semiconductor optical device, epitaxial wafer for nitride based semiconductor optical device, and method of fabricating semiconductor light-emitting device
12/14/2010US7851242 Monolithic white and full-color light emitting diodes using optically pumped multiple quantum wells
12/14/2010US7851241 Method for severing brittle material substrate and severing apparatus using the method
12/14/2010US7851240 Method of forming diffraction grating and method of fabricating distributed feedback laser diode
12/14/2010US7851239 Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices
12/14/2010US7851238 Method for fabricating self-aligning electrode
12/14/2010US7851237 Semiconductor device test structures and methods
12/14/2010US7851236 Film thickness prediction method, layout design method, mask pattern design method of exposure mask, and fabrication method of semiconductor integrated circuit
12/14/2010US7851233 E-chuck for automated clamped force adjustment and calibration
12/14/2010US7851232 UV treatment for carbon-containing low-k dielectric repair in semiconductor processing
12/14/2010US7851231 Method of fabricating field emission array type light emitting unit
12/14/2010US7851124 Composition for forming wiring protective film and uses thereof
12/14/2010US7851108 Mask blank glass substrate manufacturing method, mask blank manufacturing method, mask manufacturing method, mask blank glass substrate, mask blank, and mask
12/14/2010US7851076 Method of fabricating silicon substrate for magnetic recording media, and magnetic recording medium
12/14/2010US7851020 allows making the unevenness of the functional liquids less conspicuous over the entire substrate
12/14/2010US7850866 Peroxide (H2O2) to oxidize molydenum and copper, sulfuric acid to react with cupric oxide,and a peroxide stabilizer; concurrent etching a the multilayer to form the molybdenum layer extending outwardly from underneath an edge of the copperline; thin film transistor liquid crystal-displays
12/14/2010US7850836 reduce the effective aspect ratio of the via and determine the magnitudes of the forward and reverse pulse currents of the subsequent pulse current cycle; forming copper vertically interconnected on 3-D wafer stacking; improve the hydrophilicity of the through-hole via towards an electrolyte
12/14/2010US7850819 Plasma reactor with high productivity
12/14/2010US7850818 Method of manufacturing semiconductor device and cleaning apparatus
12/14/2010US7850817 Polishing device and substrate processing device
12/14/2010US7850779 Apparatus and process for plasma-enhanced atomic layer deposition
12/14/2010US7850509 Substrate holding apparatus
12/14/2010US7850501 Light-emitting device and method for manufacturing light-emitting device
12/14/2010US7850174 Plasma processing apparatus and focus ring
12/14/2010US7850009 Clean container having elastic positioning structure
12/14/2010US7849815 Plasma processing apparatus
12/14/2010US7849814 Plasma generating device
12/14/2010CA2579751C Process for producing semiconductor substrate, semiconductor substrate for solar application and etching solution
12/09/2010WO2010141942A2 Mems switch with latch mechanism
12/09/2010WO2010141836A2 Silicon pen nanolithography
12/09/2010WO2010141708A1 Apparatus and method to fabricate an electronic device
12/09/2010WO2010141668A2 Methods of forming strontium titanate films
12/09/2010WO2010141652A2 Polishing composition for nickel-phosphorous memory disks
12/09/2010WO2010141610A1 Integrated optoelectrochemical sensor for nitrogen oxides in gaseous samples
12/09/2010WO2010141519A1 Encapsulation process and structure for electronic devices
12/09/2010WO2010141464A2 Corrosion-resistant cmp conditioning tools and methods for making and using same
12/09/2010WO2010141394A1 Process for selectively forming a self aligned local interconnect to gate
12/09/2010WO2010141351A2 Wafer bonding technique in nitride semiconductors
12/09/2010WO2010141311A1 Compliant printed circuit area array semiconductor device package
12/09/2010WO2010141266A1 Compliant printed circuit peripheral lead semiconductor package
12/09/2010WO2010141257A2 Method and apparatus for etching
12/09/2010WO2010141115A2 Directed material assembly
12/09/2010WO2010140870A2 Method for forming fine pattern in semiconductor device
12/09/2010WO2010140814A2 Wafer probe station capable of actively controlling tilt of chuck and controlling method thereof
12/09/2010WO2010140788A2 Chemical-mechanical polishing slurry composition comprising nonionized heat-activated nanocatalyst, and polishing method using same
12/09/2010WO2010140778A2 Showerhead for film depositing vacuum equipment
12/09/2010WO2010140766A2 Substrate-supporting unit and substrate-processing apparatus comprising same
12/09/2010WO2010140725A1 Method for forming a thin film metal conductive line
12/09/2010WO2010140709A1 Method of forming pattern using actinic-ray- or radiation-sensitive resin composition, and pattern
12/09/2010WO2010140684A1 Fixed-abrasive-grain machining apparatus, fixed-abrasive-grain machining method, and semiconductor-wafer manufacturing method
12/09/2010WO2010140671A1 Silicon wafer polishing method and silicon wafer
12/09/2010WO2010140666A1 Semiconductor substrate, method for manufacturing semiconductor substrate, semiconductor device, and method for manufacturing semiconductor device
12/09/2010WO2010140649A1 Charged particle beam device and evaluation method using the charged particle beam device
12/09/2010WO2010140643A1 Test unit and test system
12/09/2010WO2010140642A1 Probe card
12/09/2010WO2010140637A1 Radiation-sensitive resin composition, polymer and method for forming resist pattern
12/09/2010WO2010140615A1 Semiconductor storage device
12/09/2010WO2010140604A1 Submount, optical module provided therewith, and submount manufacturing method
12/09/2010WO2010140592A1 Surface treatment composition, surface treatment method, and method for manufacturing semiconductor device
12/09/2010WO2010140581A1 Method for supplying hydroxyl radical-containing water and apparatus for supplying hydroxyl radical-containing water
12/09/2010WO2010140577A1 Defect image processing apparatus, defect image processing method, semiconductor defect classifying apparatus, and semiconductor defect classifying method
12/09/2010WO2010140569A1 Adhesive sheet and method for grinding back surface of semiconductor wafer
12/09/2010WO2010140564A1 Nitride semiconductor crystal and method for manufacturing same
12/09/2010WO2010140548A1 Oxide sintered body, method for producing same, and starting material powder for producing oxide sintered body
12/09/2010WO2010140529A1 Starting material for use in forming silicone oxide film and method for forming silicone oxide film using same
12/09/2010WO2010140526A1 Plasma processing apparatus and power feeding method for plasma processing apparatus
12/09/2010WO2010140511A1 Surface observation device and surface observation method
12/09/2010WO2010140510A1 Method of improving crystal quality of paste-together substrate having sandblast processing implemented