Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2011
06/16/2011DE102010029738A1 Elektrisch löschbarer programmierbarer Nurlesespeicher und Herstellungsverfahren dafür Electrically erasable programmable read-only memory and manufacturing method thereof
06/16/2011DE102009058764A1 Verfahren zur Herstellung einer elektronischen Baugruppe und elektronische Baugruppe A process for preparing an electronic assembly and electronic assembly
06/16/2011DE102009057881A1 Method for laser structuring of silicon oxide layer transparent for laser radiation for producing solar cell, involves etching silicon oxide layer by etching medium while layer is temporarily protected against effect of etching medium
06/16/2011DE102009057593A1 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer
06/16/2011DE102009057590A1 Method for thermal treatment of silicon wafer, involves regulating parameter of treatment of workpiece such that determined value approximates to threshold value to obtain desired characteristic of workpiece
06/16/2011DE102009057566A1 Vorrichtung für ein Laserabhebeverfahren und Laserabhebeverfahren Device for a Laserabhebeverfahren and Laserabhebeverfahren
06/16/2011DE102009056894A1 Method for producing microsensor that is utilized for measuring storage of unwanted materials during production of fiber reinforced plastic component, involves separating individual sensor structures from each other
06/16/2011DE102009054659A1 Herstellung eines Bauelements Manufacturing a device
06/16/2011DE102009054567A1 Single event effect permissive circuit designing method, involves producing two logic element network data sheets, and providing synchronization line between error permissive memory circuit models of data sheets
06/16/2011DE102009042349B4 Semipolare wurtzitische Gruppe-III-Nitrid basierte Halbleiterschichten und darauf basierende Halbleiterbauelemente Semi-polar wurtzite-type group III nitride based semiconductor layers that form the basis semiconductor devices
06/16/2011DE102005003183B4 Verfahren zur Herstellung von Halbleiterstrukturen auf einem Wafer A process for producing semiconductor structures on a wafer
06/16/2011DE102004060188B4 Prozess-Heizkammer und Verwendung derselben Process heating chamber and using the same
06/16/2011DE10196115B4 Verfahren zum Polieren eines Halbleiterwafers A method of polishing a semiconductor wafer
06/16/2011DE10136078B4 Wässrige Lösung zum kontinuierlichen Mikroätzen von Kupfer oder Kupferlegierung Aqueous solution for continuously microetching of copper or copper alloy
06/16/2011DE10106006B4 SJ-Halbleiterbauelement und Verfahren zu dessen Herstellung SJ-semiconductor device and process for its preparation
06/16/2011DE10009346B4 Integrierte Schreib-/Leseschaltung zur Auswertung von zumindest einer Bitline in einem DRAM Speicher Integrated read / write circuit for evaluating at least one bitline in a DRAM memory
06/16/2011CA2780459A1 Methods of making semiconductor devices having implanted sidewalls and devices made thereby
06/15/2011EP2333848A1 Light emitting device and light emitting device package
06/15/2011EP2333847A1 Semiconductor optical element array and manufacturing method therefore
06/15/2011EP2333846A2 Supporting substrate for manufacturing vertically-structured semiconductor light emitting device and semiconductor light emitting device using the supporting substrate
06/15/2011EP2333845A2 Supporting substrate for manufacturing vertically-structured semiconductor light emitting device and semiconductor light emitting device using the supporting substrate
06/15/2011EP2333840A1 Display panel and display device using the same
06/15/2011EP2333839A1 Insulated gate bipolar transistor and method of making the same
06/15/2011EP2333838A2 Flash memory cell on SeOI
06/15/2011EP2333831A1 Packaging an electronic device
06/15/2011EP2333827A2 Monolithic integrated composite group III-V and group IV semiconductor device and method for fabricating same
06/15/2011EP2333826A1 Magnetic memory element and storage device using same
06/15/2011EP2333825A2 Microelectronic device integrated with crosslinks
06/15/2011EP2333824A1 Manufacture of thin SOI devices
06/15/2011EP2333823A2 Highly conductive source/drain contacts in lll- nitride transistors
06/15/2011EP2333822A2 High voltage durability III-nitride semiconductor device
06/15/2011EP2333821A1 Plasma etching method, plasma etching device and photonic crystal manufacturing method
06/15/2011EP2333820A2 Method for forming metal materials comprising semi-conductors
06/15/2011EP2333819A1 Method for fabricating p-type gallium nitride-based semiconductor, method for fabricating nitride-based semiconductor element, and method for fabricating epitaxial wafer
06/15/2011EP2333818A2 Transparent conductive film, and transparent electrode comprising same
06/15/2011EP2333817A2 Method for preparing compound semiconductor substrate
06/15/2011EP2333815A1 Process for removing the edge of a bevelled substrate
06/15/2011EP2333814A2 Auto-sequencing multi-directional inline processing apparatus
06/15/2011EP2333813A2 Auto-sequencing inline processing apparatus
06/15/2011EP2333610A1 Negative resist composition and patterning process
06/15/2011EP2333607A2 A pellicle for lithography
06/15/2011EP2332687A1 Laser beam machining method using pulsed laser beam and expanded tape for cutting a machining target
06/15/2011EP2332171A1 Process for fabricating a semiconductor structure with a buried ground plane
06/15/2011EP2332170A1 Glass-ceramic-based semiconductor-on-insulator structures and method for making the same
06/15/2011EP2332169A2 Bonding on silicon substrate having a groove
06/15/2011EP2332168A1 Dislocation engineering using a scanned laser
06/15/2011EP2332162A2 High accuracy beam placement for local area navigation
06/15/2011EP2332095A1 Surface sensor
06/15/2011EP2331726A1 Method for electron beam induced deposition of conductive material
06/15/2011EP2331649A2 Methods and compositions for polishing silicon-containing substrates
06/15/2011EP2331454A1 Process of fabricating microfluidic device chips and chips formed thereby
06/15/2011EP2331437A1 Method and device for temporarily storing glass plates for photovoltaic modules
06/15/2011EP2331294A1 Method for measuring the thickness of a discoidal workpiece
06/15/2011EP2080221B1 A susceptor and method of forming a led device using such susceptor
06/15/2011EP1878041B1 Transporting device, in particular for transporting sheet-like substrates through a coating installation
06/15/2011EP1715996B1 Hot pressing ceramic distortion control
06/15/2011EP1646075B1 Exposure apparatus and device manufacturing method
06/15/2011EP1644974B1 Method of forming pecvd silicon-rich oxide layer for reduced uv charging in an eeprom
06/15/2011EP1642171B1 Method of designing an exposure mask, exposure method, pattern forming method and device manufacturing method
06/15/2011EP1498215B1 Laser processing method
06/15/2011EP1477048B1 Method for embedding a component in a base
06/15/2011EP1468450B1 Wide bandgap bipolar transistors
06/15/2011EP1434272B1 Production method for semiconductor device
06/15/2011CN201868434U Magnetically sensitive Darlington transistor
06/15/2011CN201868408U Absorbing wafer device
06/15/2011CN201868407U Modified silicon chip carrier
06/15/2011CN201868406U Substrate aligning device, substrate delivery platform and substrate delivery system
06/15/2011CN201868405U Transparent positioning plate for marking positions of chip sets on wafer
06/15/2011CN201868404U Chip unloading device for semiconductor encapsulating process
06/15/2011CN201868403U Chip unloading device used in semiconductor encapsulating process
06/15/2011CN201868402U Quartz boat
06/15/2011CN201868401U Tool for sucking crystal grains
06/15/2011CN201868400U Collision prevention alarm of wafer transfer table
06/15/2011CN201868399U Optical detecting device
06/15/2011CN201868398U Right claw of bonding machine
06/15/2011CN201868397U Jig for semiconductor curing
06/15/2011CN201868396U Insulated pull rod of power semiconductor and pressing device thereof
06/15/2011CN201868395U Testing, printing and braiding machine and carrier belt driving unit
06/15/2011CN201868394U All-in-one machine for testing, printing and braiding and mobility compression bar module
06/15/2011CN201868393U Chip picking device of electronic tag packaging machine
06/15/2011CN201868392U Clamp for pressing and cutting diode
06/15/2011CN201868391U Cleaning machine platform of semiconductor packaging product
06/15/2011CN201868390U Etching machine and uncovering device
06/15/2011CN201868389U Etching device for effective controlling critical size of edge part of wafer
06/15/2011CN201868388U Foreign particle clearing device
06/15/2011CN201868387U Control device of silicon chip washing device
06/15/2011CN201868386U 晶圆清洗设备 Wafer cleaning equipment
06/15/2011CN201864780U Etching equipment of electronic soft label
06/15/2011CN201862609U Slice cleaning device of single crystal silicon
06/15/2011CN201862594U Wafer cleaning device
06/15/2011CN1992151B Method of manufacturing semiconductor device
06/15/2011CN1976851B Conveying apparatus
06/15/2011CN1975580B System and method to increase surface tension and contact angle in immersion lithography
06/15/2011CN1970172B Condenser type ultrasonic transducing device and its making method
06/15/2011CN1935480B Alignment method for wafer
06/15/2011CN1929927B Thin film of condensed polycyclc aromatic compound, and method for preparing thin film of condensed polycyclc aromatic compound
06/15/2011CN1918583B Electronic device
06/15/2011CN1898572B Conductive contact holder, conductive contact unit and process for producing conductive contact holder
06/15/2011CN1855467B Semiconductor device and method of manufacturing same
06/15/2011CN1783337B Magnetic random access memory