| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/22/2011 | EP1186025B1 Tungsten-filled deep trenches |
| 06/22/2011 | EP1142023B1 Peripheral structure for monolithic power device |
| 06/22/2011 | EP1032030B1 Flip chip bump bonding |
| 06/22/2011 | DE112009001954T5 Plasma-Dotierungsverfahren und Verfahren zur Herstellung eines Halbleiterbauelementes Plasma doping method and process for producing a semiconductor device |
| 06/22/2011 | DE112009001843T5 Verfahren zur Steuerung eines Überführungsroboters Method for controlling a transfer robot |
| 06/22/2011 | DE112009001195T5 Doppelseiten-Schleifvorrichtung und Verfahren zur Herstellung von Wafern The double-side grinding apparatus and method for the production of wafers |
| 06/22/2011 | DE10216633B4 Halbleiteranordnung und Verfahren zur Herstellung der Halbleiteranordnung A semiconductor device and method of manufacturing the semiconductor device |
| 06/22/2011 | DE102010063455A1 Flansch für Halbleiterchip Flange for semiconductor chip |
| 06/22/2011 | DE102010063271A1 Halbleiterbauelement mit einer Oxidschicht A semiconductor device having an oxide layer |
| 06/22/2011 | DE102010063159A1 Halbleitervorrichtung und ihr Herstellungsverfahren A semiconductor device and its manufacturing method |
| 06/22/2011 | DE102010061295A1 Halbleitervorrichtung mit metallischem Träger und Herstellungsverfahren hierfür A semiconductor device comprising a metallic substrate and manufacturing method thereof |
| 06/22/2011 | DE102010061189A1 Semiconductor device e.g. trench type MOSFET has source metal contact that is deposited above to form electrical contact with electrically conductive layers positioned in peripheral region of semiconductor substrate |
| 06/22/2011 | DE102010060801A1 Halbleitervorrichtung mit vorstehendem Bauteilabschnitt und Verfahren zum Verpacken desselben Of the same semiconductor device with the above component section and method of packaging |
| 06/22/2011 | DE102010060591A1 Plasmagenerator Plasma generator |
| 06/22/2011 | DE102010037736A1 Tunnel-Feldeffekttransistoren Tunnel field-effect transistors |
| 06/22/2011 | DE102010006269A1 Verfahren zur Erzeugung leitender oder halbleitender metalloxidischer Schichten auf Substraten und auf diese Weise hergestellte Substrate A method for producing conductive or semi-conductive metal-oxide layers on substrates and substrates prepared in this way |
| 06/22/2011 | DE102009059193A1 Anlage und Verfahren zur Dotierung von Halbleitermaterialien System and method for doping semiconductor materials |
| 06/22/2011 | DE102009058786A1 Verfahren zur Herstellung lokal strukturierter Halbleiterschichten A process for the preparation of locally structured semiconductor layers |
| 06/22/2011 | DE102009055089A1 Circuit arrangement for use in controller of motor vehicle, has electrical switch partially provided with covering layer, perylene layer partially formed under covering layer, and base layer partially provided below perylene layer |
| 06/22/2011 | DE102009054784A1 Halbleiterchip und Verfahren zum Herstellen eines Halbleiterchips Semiconductor chip and method of manufacturing a semiconductor chip |
| 06/22/2011 | DE102009004550B4 Verfahren zur Bildung von Zwischenverbindungen A process for the formation of intermediate compounds |
| 06/22/2011 | DE102008062609B4 Verfahren zur Herstellung eines Transistors und Transistor A method of manufacturing a transistor and transistor |
| 06/22/2011 | DE102008045036B4 Verringern kritischer Abmessungen von Kontaktdurchführungen und Kontakten über der Bauteilebene von Halbleiterbauelementen Decreasing critical dimensions of vias and contacts on the device layer of semiconductor devices |
| 06/22/2011 | DE102008044646B4 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer |
| 06/22/2011 | DE102008020458B4 Verfahren und Vorrichtung zum Herstellen eines Solarzellenstrings Method and apparatus for manufacturing a solar cell strings |
| 06/22/2011 | DE102007027112B4 Verfahren zur Reinigung, Trocknung und Hydrophilierung einer Halbleiterscheibe A method for cleaning, drying and hydrophilization of a semiconductor wafer |
| 06/22/2011 | DE102007016897B4 Verbesserter Verspannungsübertragungsmechanismus in einem Zwischenschichtdielektrikum unter Anwendung einer zusätzlichen Verspannungsschicht über einer Doppelverspannungsbeschichtung in einem Halbleiterbauelement Improved stress transfer mechanism in an interlayer dielectric using an additional strain layer on a double stress coating in a semiconductor device |
| 06/22/2011 | DE102006030707B4 Verfahren zur Herstellung eines Kondensators in einem Halbleiterbauelement A method for manufacturing a capacitor in a semiconductor device |
| 06/22/2011 | DE102006019424B4 Herstellungsverfahren für eine integrierte Halbleiterkontaktstruktur mit einer verbesserten Aluminiumfüllung Manufacturing method of a semiconductor integrated contact structure having an improved aluminum filling |
| 06/22/2011 | DE102006014580B4 Vertikales Hochvolt-Halbleiterbauelement und Verfahren zur Herstellung eines Randabschlusses für einen IGBT Vertical high-voltage semiconductor device and method of manufacturing a junction termination for an IGBT |
| 06/22/2011 | DE102005054219B4 Verfahren zum Herstellen eines Feldeffekttransistors und Feldeffekttransistor A method of manufacturing a field effect transistor and the field effect transistor |
| 06/22/2011 | DE102005043270B4 Vorrichtung zur Temperaturüberwachung von planaren Feldeffekttransistoren sowie zugehöriges Herstellungsverfahren Temperature monitoring device of planar field-effect transistors and manufacturing method thereof |
| 06/22/2011 | DE102004053336B4 Wässrige Ätzmittellösung für Nickel, Chrom, Nickel-Chrom-Legierungen und/oder Palladium sowie Verwendung zur Herstellung von Leiterplatten Aqueous etchant for nickel, chromium, nickel-chromium alloys, and / or palladium as well as use for the preparation of printed circuit boards |
| 06/22/2011 | CN201877435U Silicon bilateral transient voltage suppression diode |
| 06/22/2011 | CN201877431U Semiconductor device having improved terminal |
| 06/22/2011 | CN201877414U Special clamp for integrated circuit packaging mold |
| 06/22/2011 | CN201877413U Mechanical arm for fetching silicon wafer |
| 06/22/2011 | CN201877412U Wafer transfer supporting device |
| 06/22/2011 | CN201877411U Tool for transferring silicon chips |
| 06/22/2011 | CN201877410U Tool for transferring silicon chip |
| 06/22/2011 | CN201877409U Tool for transferring quartz boat |
| 06/22/2011 | CN201877408U Flat plate grabbing and releasing component |
| 06/22/2011 | CN201877407U Pressing mechanism for buffering belt |
| 06/22/2011 | CN201871459U Silver paste curdling device |
| 06/22/2011 | CN201871456U Heat-conduction silicone grease coating device for IGBT (Insulated Gate Bipolar Transistor) |
| 06/22/2011 | CN1983748B Nitride semiconductor light emitting device and method of fabricating nitride semiconductor laser device |
| 06/22/2011 | CN1943989B Carrier head with multiple chambers |
| 06/22/2011 | CN1926660B Template layer formation |
| 06/22/2011 | CN1900195B Adhesive agent for circuit member connection, circuit board and its producing method |
| 06/22/2011 | CN1638014B Ion beam monitoring arrangement |
| 06/22/2011 | CN1612263B Heating MRAM cells to ease state switching |
| 06/22/2011 | CN1589980B Cleaning sheet, carrying member with a cleaning function and method of cleaning substrate processing equipment |
| 06/22/2011 | CN102106193A Plasma processing device and method for monitoring state of discharge in plasma processing device |
| 06/22/2011 | CN102106192A Field enhanced inductively coupled plasma (FE-ICP) reactor |
| 06/22/2011 | CN102106191A Workpiece support for a plasma reactor with controlled apportionment of RF power to a process kit ring |
| 06/22/2011 | CN102105987A Organic transistor and method for manufacturing the same |
| 06/22/2011 | CN102105981A Semiconductor package with integrated interference shielding and method of manufacture therof |
| 06/22/2011 | CN102105978A 半导体存储器件 The semiconductor memory device |
| 06/22/2011 | CN102105977A Performance enhancement in PMOS and NMOS transistors on the basis of silicon/carbon material |
| 06/22/2011 | CN102105976A Improved multilayer electrostatic chuck wafer platen |
| 06/22/2011 | CN102105975A Action monitoring system for treating device |
| 06/22/2011 | CN102105974A Method and device for transporting objects |
| 06/22/2011 | CN102105973A Fixture drying apparatus and method |
| 06/22/2011 | CN102105972A Method and system for detecting micro-cracks in wafers |
| 06/22/2011 | CN102105971A Method for mounting semiconductor package component, and structure having semiconductor package component mounted therein |
| 06/22/2011 | CN102105970A Method and apparatus for achieving low resistance contact to a metal based thin film solar cell |
| 06/22/2011 | CN102105969A Semiconductor device |
| 06/22/2011 | CN102105968A Chemical liquid feeding device |
| 06/22/2011 | CN102105967A Single substrate processing head for particle removal using low viscosity fluid |
| 06/22/2011 | CN102105966A Techniques for providing a multimode ion source |
| 06/22/2011 | CN102105965A Transistor with embedded SI/GE material having enhanced boron confinement |
| 06/22/2011 | CN102105964A Deposition methods for releasing stress buildup |
| 06/22/2011 | CN102105963A A method of growing a thin film, a method of forming a structure and a device |
| 06/22/2011 | CN102105817A Photoelectronic sensor and photoelectronic sensor system |
| 06/22/2011 | CN102105619A Sputtering target for oxide thin film and process for producing the sputtering target |
| 06/22/2011 | CN102105375A Apparatus and method for transferring board-like work |
| 06/22/2011 | CN102105282A Method for compression-molding electronic component and die apparatus |
| 06/22/2011 | CN102105266A Aluminum oxide particle and polishing composition containing the same |
| 06/22/2011 | CN102105259A Laser scribing system for structuring substrates for thin-layer solar modules |
| 06/22/2011 | CN102104109A Packaging fixture for light-emitting diode |
| 06/22/2011 | CN102104091A Hard substrate-based LED chip separation method |
| 06/22/2011 | CN102104074A Semiconductor device and manufacturing method thereof |
| 06/22/2011 | CN102104073A Lateral super junction device with high substrate-gate breakdown and built-in avalanche clamp diode |
| 06/22/2011 | CN102104072A Transistor, method of manufacturing transistor, and electronic device including transistor |
| 06/22/2011 | CN102104071A Power metal-oxide-semiconductor field effect transistor (MOSFET) and manufacturing method thereof |
| 06/22/2011 | CN102104070A Semiconductor structure and forming method thereof |
| 06/22/2011 | CN102104069A Fin-type transistor structure and manufacturing method thereof |
| 06/22/2011 | CN102104068A Structure of power MOS (Metal Oxide Semiconductor) transistor and preparation method thereof |
| 06/22/2011 | CN102104067A Transistor epitaxially growing source/drain region and manufacturing method thereof |
| 06/22/2011 | CN102104065A Parasitic lateral PNP triode in SiGe heterojunction bipolar transistor process |
| 06/22/2011 | CN102104064A Parasitic lateral PNP triode in SiGe heterojunction bipolar transistor process and manufacturing method thereof |
| 06/22/2011 | CN102104063A SOI (Silicon On Insulator) longitudinal bipolar transistor and manufacturing method thereof |
| 06/22/2011 | CN102104062A Bipolar transistor |
| 06/22/2011 | CN102104061A Metal gate structure of a field effect transistor and field effect transistor |
| 06/22/2011 | CN102104060A Semiconductor structure and forming method thereof |
| 06/22/2011 | CN102104059A MOS transistor including extended NLDD source-drain region for improving durability |
| 06/22/2011 | CN102104058A Semiconductor material fin |
| 06/22/2011 | CN102104050A Thin film transistor substrate and method for fabricating the same |
| 06/22/2011 | CN102104049A Thin film transistor substrate and the method thereof |
| 06/22/2011 | CN102104048A MOS (Metal Oxide Semiconductor) type ESD (Electro-Static Discharge) protection structure for silicon on insulator technology and manufacturing method thereof |