| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/16/2011 | US20110143537 Method of fabricating semiconductor device and synchronous pulse plasma etching equipment for the same |
| 06/16/2011 | US20110143536 Method for Making an Aperture in a Carrier and Electrically Connecting Two Opposite Faces of the Carrier |
| 06/16/2011 | US20110143535 Production of tsv interconnection structures made up of an insulating contour and a conductive zone situated in the contour and disconnected from the contour |
| 06/16/2011 | US20110143534 Method for forming metallic materials comprising semi-conductors |
| 06/16/2011 | US20110143533 Poison-free and low ulk damage integration scheme for damascene interconnects |
| 06/16/2011 | US20110143532 Method of forming semiconductor cell structure, method of forming semiconductor device including the semiconductor cell structure, and method of forming semiconductor module including the semiconductor device |
| 06/16/2011 | US20110143531 Packaging conductive structure and method for manufacturing the same |
| 06/16/2011 | US20110143530 Semiconductor memory device and method of manufacturing the same |
| 06/16/2011 | US20110143529 Method of fabricating high-k/metal gate device |
| 06/16/2011 | US20110143528 Devices with Cavity-Defined Gates and Methods of Making the Same |
| 06/16/2011 | US20110143527 Techniques for generating uniform ion beam |
| 06/16/2011 | US20110143526 Method for manufacturing semiconductor wafer |
| 06/16/2011 | US20110143525 Nitride semiconductor substrate and manufacturing method thereof |
| 06/16/2011 | US20110143524 Methods of Manufacturing Rewriteable Three-Dimensional Semiconductor Memory Devices |
| 06/16/2011 | US20110143523 Semiconductor integrated device and manufacturing method for the same |
| 06/16/2011 | US20110143522 Relaxation of strained layers |
| 06/16/2011 | US20110143521 Apparatus and method for simultaneous treatment of multiple workpieces |
| 06/16/2011 | US20110143520 Two-chamber system and method for serial bonding and exfoliation of multiple workpieces |
| 06/16/2011 | US20110143519 Production of isolation trenches with different sidewall dopings |
| 06/16/2011 | US20110143518 Heterogeneous integration of low noise amplifiers with power amplifiers or switches |
| 06/16/2011 | US20110143517 III-Nitride Monolithic IC |
| 06/16/2011 | US20110143516 Self-aligned, planar phase change memory elements and devices, systems employing the same and method of forming the same |
| 06/16/2011 | US20110143515 Semiconductor device and method of manufacturing the same |
| 06/16/2011 | US20110143514 MRAM cell structure |
| 06/16/2011 | US20110143513 Methods of forming a shallow base region of a bipolar transistor |
| 06/16/2011 | US20110143512 Method for dual energy implantation for ultra-shallow junction formation of mos devices |
| 06/16/2011 | US20110143511 Method of fabricating n-channel metal-oxide semiconductor transistor |
| 06/16/2011 | US20110143510 Method of controlling gate thickness in forming finfet devices |
| 06/16/2011 | US20110143509 Method of forming a semiconductor device |
| 06/16/2011 | US20110143508 Method of fabricating vertical channel transistor |
| 06/16/2011 | US20110143507 Transistor of semiconductor device and method of fabricating the same |
| 06/16/2011 | US20110143506 Method for fabricating a semiconductor memory device |
| 06/16/2011 | US20110143505 Method for fabricating field effect transistor |
| 06/16/2011 | US20110143504 Thin film transistor substrate and method of manufacturing the same |
| 06/16/2011 | US20110143503 Semiconductor storage element and manufacturing method thereof |
| 06/16/2011 | US20110143502 Method for Low Stress Flip-Chip Assembly of Fine-Pitch Semiconductor Devices |
| 06/16/2011 | US20110143501 Manufacturing method for semiconductor device |
| 06/16/2011 | US20110143500 Semiconductor connection component |
| 06/16/2011 | US20110143499 Vertically packaged MOSFET and IC power devices as integrated module using 3D interconnected laminates |
| 06/16/2011 | US20110143498 Semiconductor package with a support structure and fabrication method thereof |
| 06/16/2011 | US20110143494 SCHOTTKY BARRIER DIODES FOR MILLIMETER WAVE SiGe BICMOS APPLICATIONS |
| 06/16/2011 | US20110143492 Method of p-type doping of cadmium telluride |
| 06/16/2011 | US20110143491 Vapor deposition apparatus and process for continuous deposition of a thin film layer on a substrate |
| 06/16/2011 | US20110143480 Microwave anneal of a thin lamina for use in a photovoltaic cell |
| 06/16/2011 | US20110143477 Method of manufacturing a phase change memory device using a cross patterning technique |
| 06/16/2011 | US20110143476 Electrical coupling of wafer structures |
| 06/16/2011 | US20110143471 Surface passivation techniques for chamber-split processing |
| 06/16/2011 | US20110143469 Method for manufacturing wiring, thin film transistor, light emitting device and liquid crystal display device, and droplet discharge apparatus for forming the same |
| 06/16/2011 | US20110143466 Method of forming vertical structure light emitting diode with heat exhaustion structure |
| 06/16/2011 | US20110143463 Vapor deposition method and vapor deposition apparatus |
| 06/16/2011 | US20110143462 Adjusting substrate temperature to improve cd uniformity |
| 06/16/2011 | US20110143461 In vacuum optical wafer heater for cryogenic processing |
| 06/16/2011 | US20110143460 Method of manufacturing magnetoresistance element and storage medium used in the manufacturing method |
| 06/16/2011 | US20110143459 Semiconductor substrate and method of fabricating semiconductor device |
| 06/16/2011 | US20110143268 Scattering Bar OPC Application Method for Sub-Half Wavelength Lithography Patterning |
| 06/16/2011 | US20110143266 Negative resist composition and patterning process |
| 06/16/2011 | US20110143150 Method of room temperature covalent bonding |
| 06/16/2011 | US20110143149 Resist underlayer film forming composition containing silicone having onium group |
| 06/16/2011 | US20110142579 Transfer device and target object processing apparatus including same |
| 06/16/2011 | US20110142578 Sample conveying mechanism |
| 06/16/2011 | US20110142577 Semiconductor manufacturing plant |
| 06/16/2011 | US20110142575 Elevator-based tool loading and buffering system |
| 06/16/2011 | US20110142573 Auto-sequencing multi-directional inline processing apparatus |
| 06/16/2011 | US20110142572 Auto-sequencing inline processing apparatus |
| 06/16/2011 | US20110142090 Laser diode and method of manufacturing laser diode |
| 06/16/2011 | US20110142089 Semiconductor laser device and method of manufacturing the device |
| 06/16/2011 | US20110142088 Photon pair source and method for its production |
| 06/16/2011 | US20110141806 Flash Memory Device and Method for Manufacturing Flash Memory Device |
| 06/16/2011 | US20110141803 Magnetic tunnel junction devices, electronic devices including a magnetic tunneling junction device and methods of fabricating the same |
| 06/16/2011 | US20110141796 Magnetic Tunnel Junction Device and Fabrication |
| 06/16/2011 | US20110141696 Thermal matching in semiconductor devices using heat distribution structures |
| 06/16/2011 | US20110141650 Electrostatic chuck device and method for determining attracted state of wafer |
| 06/16/2011 | US20110141448 Substrate carrier device, substrate carrying method, substrate supporting member, substrate holding device, exposure apparatus, exposure method and device manufacturing method |
| 06/16/2011 | US20110141197 Substrate for liquid-ejection head, liquid ejection head, method for manufacturing substrate for liquid-ejection head, and method for manufacturing liquid ejection head |
| 06/16/2011 | US20110141100 Thin film transistor and method of forming the same |
| 06/16/2011 | US20110141076 Semiconductor device, method for manufacturing semiconductor device, transistor substrate, light emitting device and display device |
| 06/16/2011 | US20110140744 Flexible electronic circuits and displays |
| 06/16/2011 | US20110140288 Systems and Methods Employing a Physically Asymmetric Semiconductor Device Having Symmetrical Electrical Behavior |
| 06/16/2011 | US20110140287 Integrated circuit packaging system with bond wire pads and method of manufacture thereof |
| 06/16/2011 | US20110140283 Integrated circuit packaging system with a stackable package and method of manufacture thereof |
| 06/16/2011 | US20110140282 Semiconductor device and semiconductor device manufacturing method |
| 06/16/2011 | US20110140281 Substrate for electronic device, stack for electronic device, electronic device, and method for manufacturing the same |
| 06/16/2011 | US20110140279 Semiconductor structure incorporating multiple nitride layers to improve thermal dissipation away from a device and a method of forming the structure |
| 06/16/2011 | US20110140278 Optical proximity correction aware integrated circuit design optimization |
| 06/16/2011 | US20110140277 Semiconductor device |
| 06/16/2011 | US20110140276 Interlayer insulating film, interconnection structure, and methods of manufacturing the same |
| 06/16/2011 | US20110140271 integrated circuit chip with pyramid or cone-shaped conductive pads for flexible c4 connections and a method of forming the integrated circuit chip |
| 06/16/2011 | US20110140269 Semiconductor device and method for manufacturing the same |
| 06/16/2011 | US20110140268 High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same |
| 06/16/2011 | US20110140267 Electronic device package and method for fabricating the same |
| 06/16/2011 | US20110140266 Electrostatic capacitance-type input device and method of manufacturing thereof |
| 06/16/2011 | US20110140263 Semiconductor Device and Method of Forming PIP with Inner Known Good Die Interconnected with Conductive Bumps |
| 06/16/2011 | US20110140262 Module package with embedded substrate and leadframe |
| 06/16/2011 | US20110140261 Integrated circuit packaging system with interconnect and method of manufacture thereof |
| 06/16/2011 | US20110140260 Chip assembly with chip-scale packaging |
| 06/16/2011 | US20110140259 Integrated circuit packaging system with stacking interconnect and method of manufacture thereof |
| 06/16/2011 | US20110140258 Integrated circuit packaging system with package stacking and method of manufacture thereof |
| 06/16/2011 | US20110140257 Printed Circuit Board having Embedded Dies and Method of Forming Same |
| 06/16/2011 | US20110140255 Semiconductor die package including ic driver and bridge |
| 06/16/2011 | US20110140254 Panel Based Lead Frame Packaging Method And Device |