Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2011
06/15/2011CN1754101B Method and apparatus for detecting an unused state in a semiconductor circuit
06/15/2011CN1679147B Etching pastes for silicon surfaces and layers
06/15/2011CN1668915B Method and apparatus for determining characteristics of structural element interface having sub-micron cross-sectional area
06/15/2011CN1664683B 电子电路 Electronic circuit
06/15/2011CN1638274B Surface acoustic wave device
06/15/2011CN1622221B Apparatus and method of analyzing magnetic random access memory
06/15/2011CN1621944B Projection light etching image-forming system
06/15/2011CN1621555B Mask and container and manufacturing apparatus
06/15/2011CN1610001B Semiconductor memory device with magnetoresistance elements and method of writing data into the same
06/15/2011CN1523668B 半导体器件 Semiconductor devices
06/15/2011CN1490671B Method for designing mask and manufacturing face plate
06/15/2011CN102099907A Work-piece transfer systems and methods
06/15/2011CN102099906A Improved metrology through use of feed forward feed sideways and measurement cell re-use
06/15/2011CN102099905A 半导体装置及显示装置 The semiconductor device and display device
06/15/2011CN102099904A Methods and systems for packaging integrated circuits with thin metal contacts
06/15/2011CN102099903A Method for judging pass/fail of bonding, apparatus for judging pass/fail of bonding, and bonding apparatus
06/15/2011CN102099902A Method of forming finned semiconductor devices with trench isolation
06/15/2011CN102099901A Dual damascene via filling composition
06/15/2011CN102099900A Method and device for cleaning a substrate, and storage medium
06/15/2011CN102099899A Ion implantation with heavy halogenide compounds
06/15/2011CN102099898A Thin sacrificial masking films for protecting semiconductors from pulsed laser process
06/15/2011CN102099897A Methods to promote adhesion between barrier layer and porous low-k film deposited from multiple liquid precursors
06/15/2011CN102099896A Method for growing gan crystal
06/15/2011CN102099895A Method for fabricating crystalline film and device for fabricating crystalline film
06/15/2011CN102099894A Methods of fabricating semiconductor structures or devices using layers of semiconductor material having selected or controlled lattice parameters
06/15/2011CN102099848A Active matrix substrate, display panel, display device, and active matrix substrate manufacturing method
06/15/2011CN102099749A Positive-type radiation-sensitive composition, and resist pattern formation method
06/15/2011CN102099692A Probe
06/15/2011CN102099511A Algan bulk crystal manufacturing method and algan substrate manufacturing method
06/15/2011CN102099505A Deposition film forming apparatus and deposition film forming method
06/15/2011CN102099272A Glass substrate packaging device and glass substrate packaging method
06/15/2011CN102099193A Screen plate, interlayer insulation film, circuit board, active matrix circuit board, and image display apparatus
06/15/2011CN102099170A Method for encapsulating electronic components with a controllable closing force
06/15/2011CN102099128A Cleaning device adapted to eject high-pressure cleaning liquid
06/15/2011CN102098881A Method of manufacturing printed wiring board
06/15/2011CN102098876A Manufacturing process for circuit substrate
06/15/2011CN102098872A Pad structure and manufacturing method thereof
06/15/2011CN102098863A Electrode board for plasma processing equipment and method for removing process sediments
06/15/2011CN102098862A Lower electrode device and plasma processing equipment using same
06/15/2011CN102098028A Complementary metal-oxide-semiconductor (CMOS) ring oscillator based on mixed crystal orientation silicon on insulator (SOI) technology and manufacturing method thereof
06/15/2011CN102097672A Method for manufacturing silicon-penetrating coaxial line for microwave frequency band
06/15/2011CN102097546A Method for cutting LED chip
06/15/2011CN102097495A Integrated circuit, capacitor and its formation method
06/15/2011CN102097494A Schottky diode structure with capability of reducing reverse leakage current and with low forward voltage drop
06/15/2011CN102097492A Hetetrostructure field effect diode and manufacturing method thereof
06/15/2011CN102097491A Sonos and manufacturing method thereof
06/15/2011CN102097489A Thin film transistor and manufacturing method thereof
06/15/2011CN102097487A Oxide semiconductor thin film transistor and method of manufacturing the same
06/15/2011CN102097486A Thin film transistor, method of manufacturing the same, and organic electroluminescent device including thin film transistor
06/15/2011CN102097485A Edmos transistor and manufacturing method thereof
06/15/2011CN102097484A Multichannel LDMOS (laterally diffused metal oxide semiconductor) and preparation method thereof
06/15/2011CN102097483A GaN-base heterostructure enhancement type insulated gate field effect transistor and preparation method thereof
06/15/2011CN102097482A Integrated double longitudinal channel SOI LDMOS (silicon on insulator laterally double diffusion metal oxide semiconductor) device unit
06/15/2011CN102097479A Low-voltage buried channel VDMOS (vertical double-diffused metal oxide semiconductor) device
06/15/2011CN102097478A Extremely-low on resistance shallow slot buried channel VDMOS (vertical double diffusion metal oxide semiconductor) device
06/15/2011CN102097476A Integrated circuit structure and formation method thereof
06/15/2011CN102097475A Semiconductor device and method for fabricating semiconductor device
06/15/2011CN102097474A CMOS compatible low gate charge lateral MOSFET
06/15/2011CN102097472A Process for forming a wiring film, a transistor, and an electronic device
06/15/2011CN102097470A Semiconductor device and method for manufacturing the same
06/15/2011CN102097469A Semiconductor structure and manufacture method thereof
06/15/2011CN102097468A Trench MOSFEF structure and preparation method thereof
06/15/2011CN102097467A Compound semiconductor device and production method thereof
06/15/2011CN102097466A Silicon germanium heterojunction transistor and manufacturing method thereof
06/15/2011CN102097465A Parasitic vertical PNP triode in BiCMOS process and manufacturing method thereof
06/15/2011CN102097464A High-voltage bipolar transistor
06/15/2011CN102097463A Semi self-aligned bipolar transistor and manufacturing method thereof
06/15/2011CN102097462A Bipolar semiconductor device and method of producing same
06/15/2011CN102097461A Substantially lattice matched semiconductor materials and associated methods
06/15/2011CN102097460A Semiconductor device and its manufacture method
06/15/2011CN102097459A Multilayer film structure for controllably preparing polycrystalline silicon films
06/15/2011CN102097458A Methods and devices for fabricating and assembling printable semiconductor elements
06/15/2011CN102097454A OLED (Organic Light Emitting Diode) display and manufacturing method thereof
06/15/2011CN102097448A Organic electroluminescent display device and method for fabricating the same
06/15/2011CN102097447A Brightness-adjustable light emitting device, array and manufacturing method thereof
06/15/2011CN102097440A Mother substrate for liquid crystal display and manufacturing method thereof
06/15/2011CN102097439A Manufacturing method of semiconductor device
06/15/2011CN102097438A Flat panel display device and method of manufacturing the same
06/15/2011CN102097435A Semiconductor device and method for forming the same
06/15/2011CN102097434A Trench metal-oxide semiconductor field effect transistor (MOSFET) and manufacture method thereof
06/15/2011CN102097433A Trench metal-oxide semiconductor field effect transistor (MOSFET) and manufacture method thereof
06/15/2011CN102097432A Semiconductor device and manufacturing method thereof
06/15/2011CN102097428A Integrated circuit wafer and integrated circuit wafer cutting method
06/15/2011CN102097427A Laminate Electronic Device
06/15/2011CN102097415A Semiconductor packaging piece and manufacture method thereof
06/15/2011CN102097413A Structure and method for testing integrity of grid oxide layer and dielectric layer
06/15/2011CN102097412A Embedded bit line structure, field effect transistor structure with the same and method of fabricating the same
06/15/2011CN102097411A Semiconductor packaging structure and packaging method thereof
06/15/2011CN102097410A Lead structure of coating with enhanced welding strength
06/15/2011CN102097409A Semiconductor device and method for manufacturing the same
06/15/2011CN102097408A Wafer level semiconductor device connector
06/15/2011CN102097407A Semiconductor package and manufacturing method thereof
06/15/2011CN102097406A Encapsulation insulating clad structure of single grain size semiconductor element and clad method
06/15/2011CN102097404A Wafer level chip scale packaging structure with low substrate resistance and manufacturing method thereof
06/15/2011CN102097399A Heat conduction for chip stacks and 3-D circuits
06/15/2011CN102097397A Device including package and system and its method
06/15/2011CN102097395A Substrate structure with embedded chip
06/15/2011CN102097394A Semiconductor device and method for manufacturing the same
06/15/2011CN102097392A Mounting device of conductive ball
06/15/2011CN102097390A Manufacturing method of pixel structure