Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2011
06/16/2011WO2011072027A2 Reverse side engineered iii-nitride devices
06/16/2011WO2011071980A2 Ultra low silicon loss high dose implant strip
06/16/2011WO2011071973A2 Methods of making semiconductor devices having implanted sidewalls and devices made thereby
06/16/2011WO2011071966A2 Cross-point diode arrays and methods of manufacturing cross-point diode arrays
06/16/2011WO2011071889A1 Laser lift off systems and methods
06/16/2011WO2011071864A1 Growth methodology for light emitting semiconductor devices
06/16/2011WO2011071857A1 High throughput recrystallization of semiconducting materials
06/16/2011WO2011071825A1 Method to remove capping layer of insulation dielectric in interconnect structures
06/16/2011WO2011071726A2 Curable resin compositions useful as underfill sealants for low-k dielectric-containing semiconductor devices
06/16/2011WO2011071717A2 Backside stress compensation for gallium nitride or other nitride-based semiconductor devices
06/16/2011WO2011071706A1 Methods of and apparatus for controlling pressure in multiple zones of a process tool
06/16/2011WO2011071600A2 Thin foil for use in packaging integrated circuits
06/16/2011WO2011071598A2 Quantum-well-based semiconductor devices
06/16/2011WO2011071568A2 STRUCTURE AND METHOD FOR ACHIEVING SELECTIVE ETCHING IN (Ga,A1,In,B)N LASER DIODES
06/16/2011WO2011071191A1 P-type algan layer, method for producing same and group iii nitride semiconductor light-emitting element
06/16/2011WO2011071185A1 Semiconductor device and method for manufacturing the same
06/16/2011WO2011071168A1 Cmp polishing liquid, method for polishing substrate, and electronic component
06/16/2011WO2011071126A1 Multilayer mirror for euv lithography and process for producing same
06/16/2011WO2011071123A1 Reflective-layer-equipped substrate for euv lithography, reflective mask blank for euv lithography, reflective mask for euv lithography, and process for producing reflective-layer-equipped substrate
06/16/2011WO2011071107A1 Photosensitive adhesive composition having adhesiveness even after photocuring reaction and after pattern formation
06/16/2011WO2011071086A1 Optical member for use in euv lithography
06/16/2011WO2011071073A1 Electrostatic chuck apparatus
06/16/2011WO2011071069A1 Method for cleaning film forming apparatus, film forming method, and film forming apparatus
06/16/2011WO2011071028A1 Method for processing laminated electrode
06/16/2011WO2011070981A1 Semiconductor device and method for producing same
06/16/2011WO2011070947A1 Radiation-sensitive resin composition, polymer, monomer and method for producing radiation-sensitive resin composition
06/16/2011WO2011070945A1 Thin film manufacturing apparatus, thin film manufacturing method, and method for manufacturing semiconductor device
06/16/2011WO2011070944A1 Active matrix substrate and display device
06/16/2011WO2011070928A1 Semiconductor device
06/16/2011WO2011070905A1 Nonvolatile latch circuit and logic circuit, and semiconductor device using the same
06/16/2011WO2011070901A1 Semiconductor device and manufacturing method thereof
06/16/2011WO2011070900A1 Semiconductor device and manufacturing method thereof
06/16/2011WO2011070898A1 Polishing slurry for silicon carbide and polishing method therefor
06/16/2011WO2011070892A1 Semiconductor device and manufacturing method thereof
06/16/2011WO2011070887A1 Field effect transistor
06/16/2011WO2011070855A1 Method for manufacturing semiconductor device, and semiconductor device
06/16/2011WO2011070853A1 Spatial light modulator, illumination optical system, exposure apparatus, and method for manufacturing device
06/16/2011WO2011070819A1 Plasma ignition device, plasma ignition method, and plasma generation device
06/16/2011WO2011070805A1 Process for production of photoelectric conversion device
06/16/2011WO2011070768A1 Nitride semiconductor light-emitting element and manufacturing method therefor
06/16/2011WO2011070760A1 Method for producing semiconductor element
06/16/2011WO2011070753A1 Device and method for pressure bonding of parts
06/16/2011WO2011070741A1 Tray for cvd and film-forming method using same
06/16/2011WO2011070739A1 Epoxy resin composition for semiconductor encapsulation, cured product thereof, and semiconductor device using epoxy resin composition
06/16/2011WO2011070718A1 Low-molecular-weight positive-type radiation-sensitive composition, and resist pattern formation method
06/16/2011WO2011070699A1 Semiconductor wafer polishing method
06/16/2011WO2011070694A1 Semiconductor device and method for manufacturing same
06/16/2011WO2011070693A1 Solid-state imaging device
06/16/2011WO2011070627A1 Method for bonding semiconductor substrates and mems device
06/16/2011WO2011070626A1 Method for bonding semiconductor substrates and mems device
06/16/2011WO2011070625A1 Method for bonding semiconductor substrates and mems device
06/16/2011WO2011070495A1 Electronic component with protection casing and related production method
06/16/2011WO2011070398A1 Metallic mg oxygen diffusion barrier diffusion applied for electronic devices
06/16/2011WO2011070386A1 Monitoring device for the wire of a wire saw device and method for operating the same
06/16/2011WO2011070087A1 Packaging an electronic device
06/16/2011WO2011069737A1 Circuit device comprising a semiconductor component
06/16/2011WO2011069735A1 Method and device for a laser lift-off method having a beam splitter
06/16/2011WO2011069687A1 Substrate support
06/16/2011WO2011069409A1 Robot arm device and substrate processing system comprising the same
06/16/2011WO2011069370A1 Method of forming high-germanium component channel material layer
06/16/2011WO2011069272A1 Apparatus and method for transporting planar substrates, such as silicon wafers
06/16/2011WO2011069242A1 Semiconductor dice transfer-enabling apparatus and method for manufacturing transfer-enabling apparatus
06/16/2011WO2011045442A3 Switching system and method
06/16/2011WO2011041140A3 Method of filling deep trench in a substrate
06/16/2011WO2011038242A3 Hybrid gas injector
06/16/2011WO2011037700A3 Semiconductor device with oxygen-diffusion barrier layer and method for fabricating same
06/16/2011WO2011034841A3 Method and apparatus for showerhead cleaning
06/16/2011WO2011031672A3 Parallel system for epitaxial chemical vapor deposition
06/16/2011WO2011028807A3 Metrology systems and methods
06/16/2011WO2011028599A3 Direct drive arrangement to control confinement rings positioning and methods thereof
06/16/2011WO2011026129A3 Radio frequency (rf) ground return arrangements
06/16/2011WO2011021811A3 Mask for forming a front electrode of a solar cell
06/16/2011WO2011017226A3 Compound lift pin tip with temperature compensated attachment feature
06/16/2011WO2011016630A3 Panel equilibrium adjusting device and a panel attaching device comprising the same
06/16/2011WO2011012382A3 Silicon wafer based structure for heterostructure solar cells
06/16/2011WO2011011532A4 Hollow cathode showerhead
06/16/2011WO2010145844A3 Device for handling and positioning large-sized solar modules
06/16/2011WO2010080354A3 Semiconductor core, integrated fibrous photovoltaic device
06/16/2011WO2008067098A3 Applications of polycrystalline wafers
06/16/2011US20110145775 Cell library, layout method, and layout apparatus
06/16/2011US20110144799 Processing apparatus and processing method
06/16/2011US20110144792 Semiconductor processing system and program
06/16/2011US20110144295 Resist polymer, resist composition, process for pattern formation, and starting compounds for production of the resist polymer
06/16/2011US20110143554 Reduction of defects formed on the surface of a silicon oxynitride film
06/16/2011US20110143553 Integrated tool sets and process to keep substrate surface wet during plating and clean in fabrication of advanced nano-electronic devices
06/16/2011US20110143552 Heat-resistant adhesive sheet for semiconductor device fabrication, adhesive used for the sheet, and method for fabricating semiconductor device using the sheet
06/16/2011US20110143551 Device and process for chemical vapor phase treatment
06/16/2011US20110143550 Method for manufacturing semiconductor device, apparatus for processing substrate, and computer readable medium
06/16/2011US20110143549 Etching method, method for manufacturing microstructure, and etching apparatus
06/16/2011US20110143548 Ultra low silicon loss high dose implant strip
06/16/2011US20110143547 Solution for removal of residue after semiconductor dry process and residue removal method using same
06/16/2011US20110143546 Ashing method and ashing device
06/16/2011US20110143545 Apparatus and method of treating surface of semiconductor substrate
06/16/2011US20110143544 Method of forming micropattern, die formed by this method of forming micropattern, transfer method and micropattern forming method using this die
06/16/2011US20110143543 Method of Forming Capacitors, and Methods of Utilizing Silicon Dioxide-Containing Masking Structures
06/16/2011US20110143542 Method to remove capping layer of insulation dielectric in interconnect structures
06/16/2011US20110143541 Apparatus and method of treating surface of semiconductor substrate
06/16/2011US20110143540 Semiconductor Wafer Handler
06/16/2011US20110143539 Polishing pad with endpoint window and systems and methods using the same
06/16/2011US20110143538 Semiconductor Processing Methods
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