Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2011
06/09/2011US20110136331 Semiconductor device and method for fabricating the same
06/09/2011US20110136330 Nonvolatile Semiconductor Memory Device and Manufacturing Method Thereof
06/09/2011US20110136329 Manufacturing method of semiconductor device
06/09/2011US20110136328 Method for depositing ultra fine grain polysilicon thin film
06/09/2011US20110136327 High mobility monolithic p-i-n diodes
06/09/2011US20110136326 Pillar devices and methods of making thereof
06/09/2011US20110136325 Method for fabricating a monolithic integrated composite group III-V and group IV semiconductor device
06/09/2011US20110136324 Semiconductor dice transfer-enabling apparatus and method for manufacturing transfer-enabling apparatus
06/09/2011US20110136323 Semiconductor device manufacturing equipment and semiconductor device manufacturing method
06/09/2011US20110136322 Adhesive Sheet for a Stealth Dicing and a Production Method of a Semiconductor Wafer Device
06/09/2011US20110136321 Method for manufacturing lamination type semiconductor integrated device
06/09/2011US20110136320 Method of manufacturing soi substrate
06/09/2011US20110136319 Methods Of Forming Isolation Structures, And Methods Of Forming Nonvolatile Memory
06/09/2011US20110136318 Method of manufacturing semiconductor device having optical devices
06/09/2011US20110136317 Semiconductor device, method of fabricating the same, and semicondutor module, electronic circuit board, and electronic system including the device
06/09/2011US20110136316 Phase change memory device in which a phase change layer is stably formed and prevented from lifting and method for manufacturing the same
06/09/2011US20110136315 Multi-Level Phase Change Memory
06/09/2011US20110136314 Systems and methods for reducing contact to gate shorts
06/09/2011US20110136313 Methods of Forming CMOS Transistors with High Conductivity Gate Electrodes
06/09/2011US20110136312 Semiconductor device and its manufacture method
06/09/2011US20110136311 Semiconductor device having a locally buried insulation layer and method of manufacturing the semiconductor device
06/09/2011US20110136310 Method of forming an insulated gate field effect transistor device having a shield electrode structure
06/09/2011US20110136309 Method of forming an insulated gate field effect transistor device having a shield electrode structure
06/09/2011US20110136308 Semiconductor device having super junction and method of manufacturing the same
06/09/2011US20110136307 Semiconductor device having buffer layer between sidewall insulating film and semiconductor substrate
06/09/2011US20110136306 Method of manufacturing a semiconductor device
06/09/2011US20110136305 Group III Nitride Semiconductor Devices with Silicon Nitride Layers and Methods of Manufacturing Such Devices
06/09/2011US20110136304 Techniques to Enhance Selectivity of Electrical Breakdown of Carbon Nanotubes
06/09/2011US20110136303 Method and Apparatus for Manufacturing Thin-Film Transistor
06/09/2011US20110136302 Semiconductor device and manufacturing method thereof
06/09/2011US20110136301 Semiconductor device and manufacturing method thereof
06/09/2011US20110136300 Method for producing a semiconductor device using laser annealing for selectively activating implanted dopants
06/09/2011US20110136299 Leadframe for leadless package, structure and manufacturing method using the same
06/09/2011US20110136298 Method of manufacturing a wiring board
06/09/2011US20110136297 Integrated circuit chip that supports through-chip electromagnetic communication
06/09/2011US20110136296 Method for manufacturing semiconductor device
06/09/2011US20110136290 Etching methods and methods of manufacturing a cmos image sensor using the same
06/09/2011US20110136287 ANNEALING OF SEMI-INSULATING CdZnTe CRYSTALS
06/09/2011US20110136285 Method for manufacturing stacked film and solar cell
06/09/2011US20110136284 Micro-Electro-Mechanical Transducer Having a Surface Plate
06/09/2011US20110136283 Process for fabricating MEMS devices
06/09/2011US20110136281 Epitaxial formation support structures and associated methods
06/09/2011US20110136277 Method of fabricating liquid crystal display device
06/09/2011US20110136276 Nitride semiconductor light-emitting device and method for fabrication thereof
06/09/2011US20110136274 Liquid crystal display device and method for fabricating the same
06/09/2011US20110136272 Fabrication method of semiconductor integrated circuit device
06/09/2011US20110136270 Method for manufacturing semiconductor device
06/09/2011US20110136269 Method for depositing microcrystalline silicon and monitor device of plasma enhanced deposition
06/09/2011US20110136268 Processes for forming electronic devices including polishing metal-containing layers
06/09/2011US20110136267 Method of controlling film thinning of semiconductor wafer for solid-state image sensing device
06/09/2011US20110136266 Method of manufacturing a light emitting device and thin film forming apparatus
06/09/2011US20110136265 Method of Manufacturing Thin-Film Solar Panel and Laser Scribing Apparatus
06/09/2011US20110135557 Hardmask materials
06/09/2011US20110135428 Substrate-processing apparatus and method of transferring substrate in the same
06/09/2011US20110135427 Method for transferring target object and apparatus for processing target object
06/09/2011US20110135426 Vacuum transfer apparatus
06/09/2011US20110135187 Photovoltaic cell manufacturing method and photovoltaic cell manufacturing apparatus
06/09/2011US20110134956 Process for producing semiconductor device and semiconductor device
06/09/2011US20110134955 Semiconductor laser diode device and method of fabrication thereof
06/09/2011US20110134954 SEMICONDUCTOR DEVICE HAVING AN InGaN LAYER
06/09/2011US20110134952 Method of manufacturing semiconductor laser, semiconductor laser, optical disc device, method of manufacturing semiconductor device, and semiconductor device
06/09/2011US20110134950 Method of manufacturing semiconductor device
06/09/2011US20110134700 Nonvolatile Semiconductor Memory
06/09/2011US20110134698 FLASH MEMORY CELL ON SeOI HAVING A SECOND CONTROL GATE BURIED UNDER THE INSULATING LAYER
06/09/2011US20110134691 Scalable multi-function and multi-level nano-crystal non-volatile memory device
06/09/2011US20110134690 METHOD OF CONTROLLING A DRAM MEMORY CELL ON THE SeOI HAVING A SECOND CONTROL GATE BURIED UNDER THE INSULATING LAYER
06/09/2011US20110134688 Asymmetric Write Current Compensation
06/09/2011US20110134504 Micro-Electro-Mechanical System Tiltable Lens
06/09/2011US20110133880 Integrated circuit inductor with integrated vias
06/09/2011US20110133876 Manufacture method for IC process with TOP and TOP-1 metal layers thickened and stacked inductor manufactured by this method
06/09/2011US20110133827 Semiconductor integrated circuit device
06/09/2011US20110133666 Display, method of manufacturing display and electronic device
06/09/2011US20110133500 Handling device and handling method for wafers
06/09/2011US20110133362 Mold release film for manufacturing semiconductor resin package and semiconductor resin package manufacturing method using same
06/09/2011US20110133347 Method and apparatus of providing overlay
06/09/2011US20110133345 Manufacturing method for electronic device
06/09/2011US20110133344 Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
06/09/2011US20110133342 Wiring board, manufacturing method of the wiring board, and semiconductor package
06/09/2011US20110133341 Semiconductor package and method of manufacturing the same
06/09/2011US20110133339 Semiconductor Structure and Method for Making the Same
06/09/2011US20110133337 Area reduction for surface mount package chips
06/09/2011US20110133336 Semiconductor Wafer and Method of Manufacturing the Same and Method of Manufacturing Semiconductor Device
06/09/2011US20110133334 Semiconductor Device and Method of Confining Conductive Bump Material with Solder Mask Patch
06/09/2011US20110133333 Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers, and methods of fabricating same
06/09/2011US20110133332 Package substrate and method of fabricating the same
06/09/2011US20110133331 Interface structure for copper-copper peeling integrity
06/09/2011US20110133329 Semiconductor device and method of manufacturing the same
06/09/2011US20110133325 Integrated circuit packaging system with interconnect and method of manufacture thereof
06/09/2011US20110133321 Semiconductor device and manufacturing method thereof
06/09/2011US20110133320 Semiconductor package and method of manufacturing the same
06/09/2011US20110133319 Auxiliary leadframe member for stabilizing the bond wire process
06/09/2011US20110133318 SiP SUBSTRATE
06/09/2011US20110133316 Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof
06/09/2011US20110133315 System support for electronic components and method for production thereof
06/09/2011US20110133314 Method for producing a semiconductor wafer
06/09/2011US20110133313 Hardmask materials
06/09/2011US20110133311 Semiconductor device and method of manufacturing semiconductor device
06/09/2011US20110133310 integrated circuit and a method using integrated process steps to form deep trench isolation structures and deep trench capacitor structures for the integrated circuit
06/09/2011US20110133309 Semiconductor device and manufacturing method therefor
06/09/2011US20110133306 Semiconductor devices and methods of forming the same
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