Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2011
06/28/2011US7968194 Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler
06/28/2011US7967945 RF antenna assembly for treatment of inner surfaces of tubes with inductively coupled plasma
06/28/2011US7967943 Circuit-connecting material and circuit terminal connected structure and connecting method
06/28/2011US7967936 Methods of transferring a lamina to a receiver element
06/28/2011US7967930 Plasma reactor for processing a workpiece and having a tunable cathode
06/28/2011US7967917 Method of cleaning storage case
06/28/2011US7967915 Reduction of attraction forces between silicon wafers
06/28/2011US7967911 Apparatus and methods for chemical vapor deposition
06/28/2011US7967665 Substrate holding apparatus, polishing apparatus, and polishing method
06/28/2011US7967621 Electrical contactor, especially wafer level contactor, using fluid pressure
06/28/2011US7967047 Film splicer
06/23/2011WO2011075728A2 A simple route for alkali metal incorporation in solution-processed crystalline semiconductors
06/23/2011WO2011075563A2 Substrate processing apparatus having a radiant cavity
06/23/2011WO2011075519A1 Semiconductor device structures with modulated doping and related methods
06/23/2011WO2011075437A2 Multifunctional heater/chiller pedestal for wide range wafer temperature control
06/23/2011WO2011075418A1 Circuit board with via trace connection and method of making the same
06/23/2011WO2011075228A2 Isolation for nanowire devices
06/23/2011WO2011075110A1 Process chamber with intergrated pumping
06/23/2011WO2011074987A1 Field effect transistor structure
06/23/2011WO2011074847A2 Apparatus and method for extracting a silicon ingot
06/23/2011WO2011074837A2 Probe apparatus for a wafer solder bump
06/23/2011WO2011074775A2 Cylindrical magnetic levitation stage and lithography
06/23/2011WO2011074753A1 Chemical vapor deposition apparatus
06/23/2011WO2011074691A1 Polishing method, polishing apparatus and polishing tool
06/23/2011WO2011074671A1 Image processing device, measuring/testing system, and program
06/23/2011WO2011074649A1 Method for maintaining substrate processing apparatus, and safety apparatus for substrate processing apparatus
06/23/2011WO2011074645A1 Process for producing semiconductor layer, process for producing photoelectric converter, and solution for forming semiconductor layer
06/23/2011WO2011074604A1 Semiconductor device manufacturing method, substrate treatment apparatus, and semiconductor device
06/23/2011WO2011074590A1 Semiconductor device, measurement apparatus, and measurement method of relative permittivity
06/23/2011WO2011074589A1 Etchant and method for manufacturing semiconductor device using same
06/23/2011WO2011074537A1 Method for manufacturing thin film transistor device
06/23/2011WO2011074534A1 Substrate, template substrate, semiconductor light emitting element, semiconductor light emitting element producing method, illumination device using semiconductor light emitting element, and electronic device
06/23/2011WO2011074521A1 Substrate treatment device
06/23/2011WO2011074520A1 Method for producing electronic device, electronic device, method for producing electronic device package, and electronic device package
06/23/2011WO2011074506A1 Semiconductor device and method for manufacturing the same
06/23/2011WO2011074496A1 Resin bleeding inhibitor
06/23/2011WO2011074494A1 Composition for formation of resist underlayer film
06/23/2011WO2011074492A1 Thin film forming method and quantum dot device
06/23/2011WO2011074474A1 Substrate support member, substrate conveyance apparatus, substrate conveyance method, exposure apparatus, and device manufacturing method
06/23/2011WO2011074467A1 Method for manufacturing semiconductor device and back junction solar cell
06/23/2011WO2011074453A1 SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SAME
06/23/2011WO2011074436A1 Substrate and method for manufacturing same
06/23/2011WO2011074434A1 Temperature measuring apparatus
06/23/2011WO2011074433A1 Composition for forming photosensitive resist underlayer film
06/23/2011WO2011074430A1 Photomask blank, and process for production of photomask
06/23/2011WO2011074409A1 Method for manufacturing semiconductor device
06/23/2011WO2011074407A1 Semiconductor device and method for manufacturing the same
06/23/2011WO2011074400A1 Exposure method and exposure apparatus
06/23/2011WO2011074392A1 Semiconductor device
06/23/2011WO2011074361A1 Group iii nitride crystal substrate, group iii nitride crystal substrate having epitaxial layer, and semiconductor device and method for producing the same
06/23/2011WO2011074338A1 Semiconductor device, active matrix substrate and display device
06/23/2011WO2011074319A1 Deformable mirror, illumination optical system, exposure device, and method for producing device
06/23/2011WO2011074308A1 Silicon carbide substrate
06/23/2011WO2011074274A1 Pair of substrate holders, method for manufacturing device, separation device, method for separating substrates, substrate holder, and device for positioning substrate
06/23/2011WO2011074237A1 Sic semiconductor element and manufacturing method for same
06/23/2011WO2011074195A1 Semiconductor substrate, semiconductor device, and production method for semiconductor substrate
06/23/2011WO2011074183A1 Defect observation method and defect observation device
06/23/2011WO2011074176A1 Process for production of silicon epitaxial wafer
06/23/2011WO2011074171A1 Defect inspection apparatus and defect inspection method
06/23/2011WO2011074166A1 Nitride semiconductor element, and process for production of nitride semiconductor element
06/23/2011WO2011074160A1 Cleaning method
06/23/2011WO2011074158A1 Semiconductor chip and semiconductor device provided with said semiconductor chip
06/23/2011WO2011074155A1 Semiconductor device and manufacturing method for same
06/23/2011WO2011074075A1 Method for manufacturing semiconductor device
06/23/2011WO2011073937A2 System and method for doping semiconductor materials
06/23/2011WO2011073908A1 On chip integrated inductor and manufacturing method therefor
06/23/2011WO2011073842A2 High temperature chuck and method of using same
06/23/2011WO2011073841A2 Reinforced pin for being used in a pin chuck, and a pin chuck using such reinforced pin
06/23/2011WO2011073840A2 Device and process for liquid treatment of a wafer shaped article
06/23/2011WO2011073716A1 Process for recycling a substrate.
06/23/2011WO2011073348A1 Method and device for controlling the manufacture of semiconductor by measuring contamination
06/23/2011WO2011073082A1 Method for making a semiconductor device by laser irradiation
06/23/2011WO2011073057A1 System to improve coreless package connections and associated methods
06/23/2011WO2011072976A1 Method for the planarization of a semiconductor chip by means of a solder connection and a semiconductor chip
06/23/2011WO2011072787A1 Deposition of nanoparticles
06/23/2011WO2011072706A1 Method for removing substrate layers
06/23/2011WO2011072598A1 Dual-stage exchanging system for silicon wafer stage of lithography machine and exchange method thereof
06/23/2011WO2011072597A1 Dual silicon wafer stage exchange method and system for lithographic apparatus
06/23/2011WO2011072577A1 Robot arm device and substrate processing system comprising the same
06/23/2011WO2011072528A1 Mos-type esd protection structure for silicon-on-insulator technologies and method thereof
06/23/2011WO2011072527A1 Vertical soi bipolar transistor and making method thereof
06/23/2011WO2011072520A1 Finfet structure and manufacturing method thereof
06/23/2011WO2011072376A1 Method of manufacturing transferable elements incorporating radiation enabled li ft off for allowing transfer from host substrate
06/23/2011WO2011072375A1 Composite patterning device and method for removing elements from host substrate by establishing conformal contact between device and a contact surface
06/23/2011WO2011072373A1 Method and magnetic transfer stamp for transferring semiconductor dice using magnetic transfer printing techniques
06/23/2011WO2011072372A1 Method and electrostatic transfer stamp for transferring semiconductor dice using electrostatic transfer printing techniques
06/23/2011WO2011049699A3 Semiconductor wafer having scribe lane alignment marks for reducing crack propagation
06/23/2011WO2011043870A3 Split level shallow trench isolation for area efficient body contacts in soi mosfets
06/23/2011WO2011037757A3 Method and apparatus for high efficiency gas dissociation in inductive coupled plasma reactor
06/23/2011WO2011036158A3 Wafer pretreatment for copper electroplating
06/23/2011WO2011031565A3 Super junction trench power mosfet device fabrication
06/23/2011WO2011031563A3 Super junction trench power mosfet devices
06/23/2011WO2011031512A3 Interdigitated vertical parallel capacitor
06/23/2011WO2011031321A3 Replaceable upper chamber parts of plasma processing apparatus
06/23/2011WO2011028600A3 Arrangements for manipulating plasma confinement within a plasma processing system and methods thereof
06/23/2011WO2011019523A3 Roll mechanics for enabling printed electronics
06/23/2011US20110153062 Substrate-processing apparatus and method of transferring substrate in the same
06/23/2011US20110151751 Method of manufacturing semiconductor device
06/23/2011US20110151679 Film formation method for forming silicon-containing insulating film
06/23/2011US20110151678 Novel gap fill integration