Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2014
10/09/2014US20140299918 Semiconductor substrate and fabrication method thereof, and semiconductor apparatus using the same and fabrication method thereof
10/09/2014US20140299911 Method for Producing Optoelectronic Semiconductor Components, Lead Frame Composite, and Optoelectronic Semiconductor Component
10/09/2014US20140299886 Silicon carbide semiconductor device and manufacturing method of the same
10/09/2014US20140299878 Semiconductor device and stacked semiconductor device
10/09/2014US20140299877 Coating liquid for forming metal oxide thin film, metal oxide thin film, field-effect transistor, and method for manufacturing field-effect transistor
10/09/2014US20140299873 Single-crystal oxide semiconductor, thin film, oxide stack, and formation method thereof
10/09/2014US20140299872 Heterogeneous intergration of group iii-v or ii-vi materials with silicon or germanium
10/09/2014US20140299841 Graphene based field effect transistor
10/09/2014US20140299840 Graphene laminate with band gap
10/09/2014US20140299831 3d variable resistance memory device and method of manufacturing the same
10/09/2014US20140299576 Plasma processing method and plasma processing apparatus
10/09/2014US20140299508 Anti-electrostatic substrate cassette
10/09/2014US20140299476 Electroplating method
10/09/2014US20140299277 Wafer-related data management method and wafer-related data creation device
10/09/2014US20140299271 Tunable Polish Rates By Varying Dissolved Oxygen Content
10/09/2014US20140299166 Substrate gripping device and substrate processing apparatus
10/09/2014US20140299163 Substrate processing method
10/09/2014US20140299161 Substrate processing method, substrate processing apparatus and non-transitory storage medium
10/09/2014US20140298969 Cutting apparatus
10/09/2014DE112013000641T5 Polierkopf und Polierapparatur Polishing head and polishing apparatus
10/09/2014DE112013000637T5 Prozess zum Herstellen eines Halbleitersubstrats und dadurch erhaltenes Halbleitersubstrat Process for producing a semiconductor substrate and semiconductor substrate obtained thereby
10/09/2014DE112013000515T5 Hochleistungs-Multifinger- PFET mit verspanntem Siliciumgermanium-Kanal und Herstellungsverfahren High-Multifinger- PFET strained silicon germanium channel and manufacturing processes
10/09/2014DE112012005700T5 Externe Hilfsausführungseinheiten-Schnittstelle zur ausserhalb des Chips angeordneten Hilfsausführungseinheit External auxiliary execution units interface to outside of the chip mounted auxiliary execution unit
10/09/2014DE112012005252T5 Seitenerdoxid-Isolierte Halbleiterfinne Seitenerdoxid-insulated semiconductor fin
10/09/2014DE112012005250T5 Einzelwaferätzvorrichtung Einzelwaferätzvorrichtung
10/09/2014DE112012005249T5 FETs mit hybriden Kanalmaterialien FETs with channel hybrid materials
10/09/2014DE112005001487B4 Verfahren zur Bildung von dielektrischen Schichten mit hohem K-Wert auf glatten Substraten und eine Halbleiterstruktur dies umfassend A process for the formation of dielectric layers with high k on smooth substrates, and a semiconductor structure comprising the
10/09/2014DE102014206572A1 Siliziumcarbidhalbleitervorrichtung und herstellungsverfahren für dieselbe Siliziumcarbidhalbleitervorrichtung and manufacturing processes for the same
10/09/2014DE102014206527A1 Aufteilungsverfahren für scheibenförmiges Werkstück Sharing mechanism for disc-shaped workpiece
10/09/2014DE102014206297A1 Schneidvorrichtung Cutter
10/09/2014DE102014202856A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof
10/09/2014DE102014104989A1 Integrierte Schaltungs-Gehäusebaugruppen, die eine Glas-Lötstoppmaskenschicht enthalten Integrated circuit package assemblies, which contain a glass-solder resist layer,
10/09/2014DE102014104630A1 Hochleistungs-Einzelchip-Halbleiter-Package High-performance single-chip semiconductor package
10/09/2014DE102014104378A1 Halbleitergehäuse und verfahren zu dessen herstellung Semiconductor package and method for its production
10/09/2014DE102013225006A1 Vorrichtung und Verfahren zur Reduzierung von Kontaminationen eines Retikels und/oder eines Wafers in einem optischen System An apparatus and method for reducing contamination of a reticle and / or wafer in an optical system
10/09/2014DE102013206225A1 Optoelektronisches Bauelement und Verfahren zu seiner Herstellung Optoelectronic component and process for its preparation
10/09/2014DE102013204830B4 Verfahren und Vorrichtung zur Behandlung einer Halbleiterscheibe mit einem Ätzmedium Method and apparatus for treating a semiconductor wafer with an etching medium
10/09/2014DE102013110812B3 Verfahren zur Herstellung eines weitergebildeten Metallformkörpers und Verfahren zur Herstellung einer Leistungshalbleitereinrichtung mit einer Lotverbindung diesen weitergebildeten Metallformkörper verwendend. A method for producing a metal shaped article and further developed method of manufacturing a power semiconductor device with a solder joint that further formed using metal molding.
10/09/2014DE102013107193A1 Rohling aus Silizium, Verfahren zu dessen Herstellung sowie Verwendung desselben Of the same blank out of silicon, a process for its preparation and use
10/09/2014DE102013103495A1 Verfahren zum Herstellen eines Siliziumsubstrates für die Solarzellenfertigung A method of manufacturing a silicon substrate for solar cell production
10/09/2014DE102013001967B4 Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten Träger zu einem zweiten Träger Apparatus and method for transferring electronic components from a first carrier to a second carrier
10/09/2014DE102012217957B4 Verfahren zur Herstellung einer Mikro-LED-Matrix A process for producing a micro-LED matrix
10/09/2014DE102010062386B4 Verfahren zum Konvertieren von Halbleiterschichten, derartig hergestellte Halbleiterschichten sowie derartige Halbleiterschichten umfassende elektronische und optoelektronische Erzeugnisse A method of converting semiconductor layers thus produced semiconductor layers and such semiconductor layers comprehensive electronic and opto-electronic products
10/09/2014DE102010016696B4 Halbleiter-Bauelement Semiconductor component
10/09/2014DE102010000518B4 Verfahren zur Herstellung einer Halbleiteranordnung A process for producing a semiconductor device
10/09/2014DE102005032142B4 Verfahren zum Kontaktieren von Halbleiterbauteilen mit einem Testkontakt A method for bonding semiconductor components with a test contact
10/09/2014DE10139092B4 Halbleiterchip-Aufnahmeverfahren Semiconductor chip pick-up method
10/08/2014EP2787583A1 Quantum cascade laser manufacturing method
10/08/2014EP2787533A1 Graphene devices and methods of fabricating the same
10/08/2014EP2787528A1 Recording element and recording device
10/08/2014EP2787527A1 Method for treating metallic oxide surface and method for preparing thin film transistor
10/08/2014EP2787526A1 Semiconductor device fabrication method
10/08/2014EP2787525A1 Substrate structures and semiconductor devices employing the same
10/08/2014EP2787099A2 In-situ dry clean chamber for front end of line fabrication
10/08/2014EP2787039A1 Resin composition, resin composition sheet, semiconductor device and method for manufacturing same
10/08/2014EP2786420A2 Solar cell and process for producing a solar cell
10/08/2014EP2786416A1 Field-effect transistor with two-dimensional channel realized with lateral heterostructures based on hybridized graphene
10/08/2014EP2786415A1 P-type oxide, composition for producing p-type oxide, method for producing p-type oxide, semiconductor element, display element, image display device, and system
10/08/2014EP2786410A1 Quantum well device with lateral electrodes
10/08/2014EP2786407A2 Method for depositing materials on a substrate
10/08/2014EP2786406A1 Brush with cantilevered nodules
10/08/2014EP2786405A1 Coating liquid for forming metal oxide thin film, metal oxide thin film, field-effect transistor, and method for manufacturing field-effect transistor
10/08/2014EP2786404A1 Semiconductor device and method for manufacturing the same
10/08/2014EP2786403A1 Method for doping a semiconductor body, and semiconductor component
10/08/2014EP2786402A1 Bootstrapping and synthesis of mechanosynthesis tips
10/08/2014EP2786396A1 Ion implant apparatus and a method of implanting ions
10/08/2014EP2785893A2 Material deposition system for depositing materials on a substrate
10/08/2014EP2785476A1 Method of fabricating a heat sink
10/07/2014USRE45180 Structure for a multiple-gate FET device and a method for its fabrication
10/07/2014US8856722 System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates
10/07/2014US8855949 Plasma processing device and method of monitoring discharge state in plasma processing device
10/07/2014US8855805 Conveyance vehicle system
10/07/2014US8855337 Microphone and accelerometer
10/07/2014US8854865 Semiconductor memory device
10/07/2014US8854863 Arrays of nonvolatile memory cells and methods of forming arrays of nonvolatile memory cells
10/07/2014US8854855 Semiconductor memory device and method for manufacturing the same
10/07/2014US8854614 Methods of thermally treating a semiconductor wafer
10/07/2014US8854600 Exposure apparatus and photomask
10/07/2014US8854599 Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method
10/07/2014US8854593 Electro-optical device
10/07/2014US8854564 Substrate for a display device and method of manufacturing the same
10/07/2014US8854449 Substrate position detection apparatus, film deposition apparatus equipped with the same, and substrate position detection method
10/07/2014US8854287 Vertical alignment display device with enhanced contrast
10/07/2014US8853940 Display device with seal member
10/07/2014US8853868 Semiconductor structures including sub-resolution alignment marks
10/07/2014US8853866 Semiconductor device and stacked-type semiconductor device
10/07/2014US8853865 Semiconductor device with overlapped lead terminals
10/07/2014US8853864 Semiconductor device and a method of manufacturing the same
10/07/2014US8853862 Contact structures for semiconductor transistors
10/07/2014US8853861 Semiconductor device having groove-shaped via-hole
10/07/2014US8853860 Method and apparatus for reduced parasitics and improved multi-finger transistor thermal impedance
10/07/2014US8853859 Passivation for wafer level—chip-scale package devices
10/07/2014US8853858 Curing low-k dielectrics for improving mechanical strength
10/07/2014US8853857 3-D integration using multi stage vias
10/07/2014US8853856 Methodology for evaluation of electrical characteristics of carbon nanotubes
10/07/2014US8853855 Integrated circuit packaging system with conductive pillars and molded cavities and method of manufacture thereof
10/07/2014US8853852 Semiconductor apparatus and electronic equipment
10/07/2014US8853849 Package arrangement and a method of manufacturing a package arrangement
10/07/2014US8853848 Interconnection structure, apparatus therewith, circuit structure therewith
10/07/2014US8853847 Stacked chip module with integrated circuit chips having integratable and reconfigurable built-in self-maintenance blocks