Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2011
10/27/2011US20110260308 Circuit board structure, packaging structure and method for making the same
10/27/2011US20110260307 Integrated circuit including bond wire directly bonded to pad
10/27/2011US20110260305 Power Semiconductor Device Packaging
10/27/2011US20110260303 Semiconductor Device and Method of Forming Openings in Thermally-Conductive Frame of FO-WLCSP to Dissipate Heat and Reduce Package Height
10/27/2011US20110260301 Semiconductor device packages with electromagnetic interference shielding
10/27/2011US20110260299 Method for via plating in electronic packages containing fluoropolymer dielectric layers
10/27/2011US20110260298 Semiconductor structures including square cuts in single crystal silicon and method of forming same
10/27/2011US20110260297 Through-substrate via and fabrication method thereof
10/27/2011US20110260296 Semiconductor wafer and method for producing same
10/27/2011US20110260295 III-Nitride Crystal Substrate and III-Nitride Semiconductor Device
10/27/2011US20110260294 Semiconductor device and method for fabricating the same
10/27/2011US20110260293 Variable capacitance device and method of fabricating the same
10/27/2011US20110260290 Memory cell that includes a carbon-based memory element and methods of forming the same
10/27/2011US20110260288 Semiconductor device and method for manufacturing the same
10/27/2011US20110260286 Semiconductor device and method for manufacturing the same
10/27/2011US20110260284 Method for Producing a Semiconductor Component, and Semiconductor Component
10/27/2011US20110260283 Dielectric composition for thin-film transistors
10/27/2011US20110260282 Semiconductor device and manufacturing methods
10/27/2011US20110260279 Semiconductor Device Connection
10/27/2011US20110260271 Semiconductor device and manufacturing method thereof
10/27/2011US20110260267 Mems devices and fabrication thereof
10/27/2011US20110260266 Semiconductor package structure and package process
10/27/2011US20110260264 Semiconductor device and method of fabricating the same
10/27/2011US20110260262 Semiconductor device and method of fabricating the same
10/27/2011US20110260258 Field effect transistor device with improved carrier mobility and method of manufacturing the same
10/27/2011US20110260255 Semiconductor device and method of manufacturing the same
10/27/2011US20110260252 Use of epitaxial ni silicide
10/27/2011US20110260248 SOI Wafer and Method of Forming the SOI Wafer with Through the Wafer Contacts and Trench Based Interconnect Structures that Electrically Connect the Through the Wafer Contacts
10/27/2011US20110260247 Ldmos transistors with a split gate
10/27/2011US20110260245 Cost Effective Global Isolation and Power Dissipation For Power Integrated Circuit Device
10/27/2011US20110260242 Transistor of semiconductor device and method for manufacturing the same
10/27/2011US20110260238 Semiconductor device and method for manufacturinmg the same
10/27/2011US20110260235 P-type control gate in non-volatile storage and methods for forming same
10/27/2011US20110260233 Device comprising a field-effect transistor in a silicon-on-insulator
10/27/2011US20110260232 Device including memory array and method thereof
10/27/2011US20110260231 Memory device and method for manufacturing the same
10/27/2011US20110260230 Cell with surrounding word line structures and manufacturing method thereof
10/27/2011US20110260227 Fin fet and method of fabricating same
10/27/2011US20110260226 Semiconductor device and method for forming the same
10/27/2011US20110260225 Semiconductor device and method for manufacturing the same
10/27/2011US20110260224 Thin film magnetic memory device capable of conducting stable data read and write operations
10/27/2011US20110260223 Stress engineering to reduce dark current of cmos image sensors
10/27/2011US20110260220 Semiconductor device and fabrication thereof
10/27/2011US20110260219 Protective layers suitable for exhaust gases for high-temperature chemfet exhaust gas sensors
10/27/2011US20110260217 Semiconductor apparatus and method of manufacturing the same
10/27/2011US20110260216 GaN BASED POWER DEVICES WITH INTEGRATED PROTECTION DEVICES: STRUCUTRES AND METHODS
10/27/2011US20110260214 Semiconductor device and method for manufacturing the same
10/27/2011US20110260213 Monolayer dopant embedded stressor for advanced cmos
10/27/2011US20110260208 Light-Emitting Device and Manufacturing Method Thereof
10/27/2011US20110260174 GaN BASED POWER DEVICES WITH INTEGRATED PROTECTION DEVICES: STRUCTURES AND METHODS
10/27/2011US20110260171 Semiconductor device and manufacturing method thereofr
10/27/2011US20110260165 Semiconductor Device and Method for Manufacturing Semiconductor Device
10/27/2011US20110260157 Semiconductor device, thin film transistor and a method for producing the same
10/27/2011US20110260137 Process for making contained layers and devices made with same
10/27/2011US20110260135 Method for Doping an Electrically Actuated Device
10/27/2011US20110260133 Switching element and manufacturing method thereof
10/27/2011US20110260132 High concentration nitrogen-containing germanium telluride based memory devices and processes of making
10/27/2011US20110259951 Method for Tracing Individual Dies
10/27/2011US20110259840 Semiconductor package magazine
10/27/2011US20110259525 Reaction absorber and semiconductor assembling system
10/27/2011US20110259524 Capacitive coupling plasma processing apparatus and method for using the same
10/27/2011US20110259522 Vacuum Processing Apparatus
10/27/2011US20110259520 Arrangements for improving bevel etch repeatability among substrates
10/27/2011US20110259366 Ion source cleaning in semiconductor processing systems
10/27/2011US20110259109 Sensor system, method for operating a sensor system, and method for manufacturing a sensor system
10/27/2011US20110258849 Semiconductor device fabricating method and fabricating apparatus
10/27/2011DE202007019330U1 Beschichtung/Abdeckung für optoelektronische Bauteile Coating / cover for optoelectronic devices
10/27/2011DE102011001063A1 Integrierter Schaltkreis mit einem direkt an ein Pad gebondeten Bonddraht Integrated circuit with a directly bonded to a pad bonding wire
10/27/2011DE102010028239A1 Contacting device for solar cell module, has contact carrier positioned on base frame by positioning units for receiving contact terminals of solar cell series for electrical interconnection of solar cells
10/27/2011DE102010028121A1 Method for manufacturing e.g. application-specific integrated switching circuit, involves removing connector of plastic mass and chips from carrier by thermal decomposition of thermoplastic material at temperature
10/27/2011DE102010028045A1 Ein Leistungsschalterbauelement mit verbesserter Temperaturverteilung A circuit breaker device with improved temperature distribution
10/27/2011DE102010018595A1 Verfahren zur Herstellung einer Verbindungshalbleiterschicht A process for preparing a compound semiconductor layer
10/27/2011DE102010018465A1 Vorrichtung und Verfahren zum Ermitteln der räumlichen Lage von Plattenelementen eines Waferbootes Apparatus and method for determining the spatial position of plate elements of a wafer boat
10/27/2011DE102010018051A1 Cutting brittle flat material comprising areas of metal layers on its surface, comprises partially covering flat material surface along dividing line by metal layer areas, exposing to laser radiation and introducing laser radiation energy
10/27/2011DE102010018032A1 Verfahren und Vorrichtung zur Bearbeitung eines Werkstückes mit einem Laser Method and apparatus for machining a workpiece with a laser
10/27/2011DE102010017844A1 Verfahren und Vorrichtung zur Herstellung elektronischer und/oder energieerzeugender und/oder energieumwandelnder Elemente und Komponenten Method and apparatus for production of electronic and / or energy-producing and / or energy-converting elements and components
10/27/2011DE102009047314B4 Leistungssteigerung in Transistoren mit einem Metallgatestapel mit großem ε durch Reduzieren einer Breite von Versatzabstandshaltern Performance increase in transistors with metal gate stack with large ε by reducing a width of offset spacers
10/27/2011CA2738099A1 Dielectric composition for thin-film transistors
10/26/2011EP2381487A1 Substrate for light-emitting element
10/26/2011EP2381485A2 Treatment of thin film layers photovoltaic module
10/26/2011EP2381480A1 Semiconductor device with a drain layer
10/26/2011EP2381478A2 Integrated circuit device
10/26/2011EP2381476A2 Semiconductor device
10/26/2011EP2381472A1 Method for manufacturing a microelectronic device and microelectronic device thus manufactured
10/26/2011EP2381471A1 Production of a memory unit with independent self-aligned gates
10/26/2011EP2381470A1 Semiconductor device comprosing a field-effect transistor in a silicon-on-insulator structure
10/26/2011EP2381469A1 Filling material and filling method using the same
10/26/2011EP2381468A1 Toggle-type positioning platform
10/26/2011EP2381467A1 Photocurable transfer sheet, and method for forming uneven pattern using same
10/26/2011EP2381466A2 Method for decontaminating semi-conductor wafers
10/26/2011EP2381465A1 Tool tip interface for a die handling tool
10/26/2011EP2381464A1 Device and method for releasing a product substrate from a holder substrate
10/26/2011EP2381289A1 MEMS device
10/26/2011EP2381008A2 Catalyst-aided chemical processing method and apparatus
10/26/2011EP2380413A2 Controlling ion energy distribution in plasma processing systems
10/26/2011EP2380251A1 Silicon based opto-electric circuits
10/26/2011EP2380213A1 Method and apparatus for laser-processing a semiconductor photovoltaic apparatus
10/26/2011EP2380204A2 Compositions and processes for forming photovoltaic devices
10/26/2011EP2380195A1 Electrical contacts for cmos devices and iii-v devices formed on a silicon substrate
10/26/2011EP2380194A1 Face-to-face (f2f) hybrid structure for an integrated circuit
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