Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2011
10/27/2011US20110263124 Method of fabricating semiconductor device
10/27/2011US20110263123 Placing table structure
10/27/2011US20110263122 Method For Making A Laminated Chip And Method For Aligning a Lithographic Mask
10/27/2011US20110263121 Manufacturing method for semiconductor device containing stacked semiconductor chips
10/27/2011US20110263120 Through-substrate via for semiconductor device
10/27/2011US20110263119 Method of forming nanoscale three-dimensional patterns in a porous material
10/27/2011US20110263118 Method of Manufacturing Semiconductor Devices
10/27/2011US20110263117 Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device using the same
10/27/2011US20110263116 Ultrahigh density patterning of conducting media
10/27/2011US20110263115 Nmos metal gate materials, manufacturing methods, and equipment using cvd and ald processes with metal based precursors
10/27/2011US20110263114 Method for etching mo-based metal gate stack with aluminium nitride barrier
10/27/2011US20110263113 Method for manufacturing a semiconductor device
10/27/2011US20110263112 Method for forming a schottky diode having a metal-semiconductor schottky contact
10/27/2011US20110263111 Group iii-nitride n-type doping
10/27/2011US20110263110 Film-forming composition
10/27/2011US20110263109 Electrooptical device
10/27/2011US20110263108 Method of fabricating semiconductor quantum dots
10/27/2011US20110263107 Method of forming polycrystalline silicon layer and atomic layer deposition apparatus used for the same
10/27/2011US20110263106 Process for Eliminating Delamination between Amorphous Silicon Layers
10/27/2011US20110263105 Amorphous silicon film formation method and amorphous silicon film formation apparatus
10/27/2011US20110263104 Thin body semiconductor devices
10/27/2011US20110263103 Method and apparatus for cleaning a substrate surface
10/27/2011US20110263102 Methods of Fabricating Normally-Off Semiconductor Devices
10/27/2011US20110263101 Carbon nanotube based integrated semiconductor circuit
10/27/2011US20110263100 Antimony and germanium complexes useful for cvd/ald of metal thin films
10/27/2011US20110263099 Manufacturing method of semiconductor device having vertical transistor
10/27/2011US20110263098 Hybrid deposition chamber for in-situ formation of group iv semiconductors & compounds with group iii-nitrides
10/27/2011US20110263097 Method for manufacturing semiconductor device
10/27/2011US20110263096 Method for manufacturing soi substrate
10/27/2011US20110263095 Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same
10/27/2011US20110263094 Method of forming finned semiconductor devices with trench isolation
10/27/2011US20110263093 Methods of Forming Variable-Resistance Memory Devices and Devices Formed Thereby
10/27/2011US20110263092 Method for fabricating a semiconductor device
10/27/2011US20110263091 Manufacturing method of semiconductor device
10/27/2011US20110263090 Semiconductor device ahving vertical pillar transistors and method for manufacturing the same
10/27/2011US20110263089 Method for fabricating semiconductor device
10/27/2011US20110263088 Poly-si thin film transistor and organic light-emitting display having the same
10/27/2011US20110263087 Semiconductor Device and Manufacturing Method Thereof
10/27/2011US20110263086 Method for forming power devices with carbon-containing region
10/27/2011US20110263085 Method for manufacturing semiconductor device
10/27/2011US20110263084 Method for manufacturing semiconductor device
10/27/2011US20110263083 Method for manufacturing semiconductor device
10/27/2011US20110263082 Method for manufacturing semiconductor device
10/27/2011US20110263081 Methods of manufacturing cmos transistor
10/27/2011US20110263080 Manufacturing method of microcrystalline semiconductor film and manufacturing method of semiconductor device
10/27/2011US20110263079 Interface protection layaer used in a thin film transistor structure
10/27/2011US20110263078 Method for manufacturing semiconductor device
10/27/2011US20110263077 Method of assembling semiconductor devices including saw singulation
10/27/2011US20110263076 Stacked semiconductor device
10/27/2011US20110263075 Vacuum Jacket For Phase Change Memory Element
10/27/2011US20110263070 Treatment of thin film layers photovoltaic module manufacture
10/27/2011US20110263069 Methods to avoid laser anneal boundary effect within bsi cmos image sensor array
10/27/2011US20110263060 Method for Manufacturing Thin Film Transistor and Method for Manufacturing Display Device
10/27/2011US20110263059 Light-emitting device, liquid-crystal display device and method for manufacturing same
10/27/2011US20110263052 Method of removing contaminations
10/27/2011US20110263051 Interleaf for leadframe identification
10/27/2011US20110263050 Low power rf tuning using optical and non-reflected power methods
10/27/2011US20110263049 Wafer edge inspection
10/27/2011US20110262867 Method of creating an evaluation map, system, method of manufacturing a semiconductor device and computer program product
10/27/2011US20110262849 Photomask and pattern formation method using the same
10/27/2011US20110262848 Manufacturing method for exposure mask, generating method for mask substrate information, mask substrate, exposure mask, manufacturing method for semiconductor device and server
10/27/2011US20110262847 Mask blank providing system, mask blank providing method, mask blank transparent substrate manufacturing method, mask blank manufacturing method, and mask manufacturing method
10/27/2011US20110262846 Methods of manufacturing a mask blank substrate, a mask blank, a photomask, and a semiconductor device
10/27/2011US20110262315 Substrate support having dynamic temperature control
10/27/2011US20110262258 Small Chip Packaging Fixture And Method Of Using Magnetic Field Assisted Self-alignment and Its Application for RFID Chip To Antenna Assembly
10/27/2011US20110262257 Horizontal articulated robot and substrate transfer system provided with the same
10/27/2011US20110262252 Substrate Processing System and Substrate Transferring Method
10/27/2011US20110262117 Heat Treatment Apparatus and Heat Treatment Method
10/27/2011US20110261856 Vertical-cavity surface-emitting laser
10/27/2011US20110261855 Optical semiconductor device and method of manufacturing optical semiconductor device
10/27/2011US20110261854 Semiconductor laser and manufacturing method thereof
10/27/2011US20110261853 Nitride semiconductor device and method for fabricating the same
10/27/2011US20110261850 Surface emitting laser device, surface emitting laser array, optical scanning device, image forming apparatus, and manufacturing method of surface emitting laser device
10/27/2011US20110261628 256 Meg dynamic random access memory
10/27/2011US20110261608 Self-Repairing Memristor and Method
10/27/2011US20110261607 Arrays Of Vertically Stacked Tiers Of Non-Volatile Cross Point Memory Cells, Methods Of Forming Arrays Of Vertically Stacked Tiers Of Non-Volatile Cross Point Memory Cells, And Methods Of Reading A Data Value Stored By An Array Of Vertically Stacked Tiers Of Non-Volatile Cross Point Memory Cells
10/27/2011US20110261550 Use of conductive paint as a method of electromagnetic interference shielding on semiconductor devices
10/27/2011US20110261491 Monitor circuit for determining the lifetime of a semiconductor device
10/27/2011US20110261465 Diffractive combiner for multicolor and monochrome display, method of manufacture and head-up display device using same
10/27/2011US20110261345 Exposure apparatus and device manufacturing method
10/27/2011US20110261331 Exposure apparatus and device manufacturing method
10/27/2011US20110261330 Substrate conveyance device and substrate conveyance method, exposure apparatus and exposure apparatus and exposure method, device manufacturing method
10/27/2011US20110261019 Semiconductor device, method for manufacturing same, and display device
10/27/2011US20110260733 Fabrication process for photovoltaic cell
10/27/2011US20110260342 Resin composition for encapsulating semiconductor, method for producing semiconductor device and semiconductor device
10/27/2011US20110260340 Circuit board structure, packaging structure and method for making the same
10/27/2011US20110260338 Semiconductor Device and Method of Forming Adjacent Channel and DAM Material Around Die Attach Area of Substrate to Control Outward Flow of Underfill Material
10/27/2011US20110260337 Method of manufacturing semiconductor device and semiconductor device
10/27/2011US20110260332 Multilevel interconnect structures and methods of fabricating same
10/27/2011US20110260326 Structures and methods for air gap integration
10/27/2011US20110260322 "Semiconductor on semiconductor substrate multi-chip-scale package"
10/27/2011US20110260321 Flip Chip Interconnection Structure
10/27/2011US20110260319 Three-dimensional stacked substrate arrangements
10/27/2011US20110260317 Cu pillar bump with electrolytic metal sidewall protection
10/27/2011US20110260316 Semiconductor Device and Method of Forming Bump on Substrate to Prevent ELK ILD Delamination During Reflow Process
10/27/2011US20110260314 Die package and corresponding method for realizing a double side cooling of a die package
10/27/2011US20110260313 Integrated circuit package system with contoured encapsulation and method for manufacturing thereof
10/27/2011US20110260312 Semiconductor device and lead frame used for the same
10/27/2011US20110260310 Quad flat non-leaded semiconductor package and fabrication method thereof
10/27/2011US20110260309 Semiconductor package, test socket and related methods