H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2011
11/08/2011	US8053818 Thin film field effect transistor with dual semiconductor layers
11/08/2011	US8053811 Group 3-5 nitride semiconductor multilayer substrate, method for manufacturing group 3-5 nitride semiconductor free-standing subtrate, and semiconductor element
11/08/2011	US8053810 Structures having lattice-mismatched single-crystalline semiconductor layers on the same lithographic level and methods of manufacturing the same
11/08/2011	US8053807 Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
11/08/2011	US8053806 Group III nitride semiconductor device and epitaxial substrate
11/08/2011	US8053790 Optical device having light sensor employing horizontal electrical field
11/08/2011	US8053781 Semiconductor device having thin film transistor
11/08/2011	US8053780 Semiconductor element, method for manufacturing the same, liquid crystal display device, and method for manufacturing the same
11/08/2011	US8053778 Semiconductor device and a method for manufacturing the same
11/08/2011	US8053776 Vertical diode and method for manufacturing same and semiconductor memory device
11/08/2011	US8053773 Thin film transistor, flat panel display device having the same, and associated methods
11/08/2011	US8053772 Hydrazine-free solution deposition of chalcogenide films
11/08/2011	US8053751 Phase-change semiconductor device and methods of manufacturing the same
11/08/2011	US8053748 Integrated circuits with phase change devices
11/08/2011	US8053747 Substrate processing apparatus and cleaning method of the same
11/08/2011	US8053741 Ion-generating device and electrical apparatus
11/08/2011	US8053665 Truncated pyramid structures for see-through solar cells
11/08/2011	US8053521 Chemical mechanical polishing pad
11/08/2011	US8053377 Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing same
11/08/2011	US8053376 One-step synthesis and patterning of aligned polymer nanowires on a substrate
11/08/2011	US8053375 Super-dry reagent compositions for formation of ultra low k films
11/08/2011	US8053374 Method of manufacturing a metal wiring structure
11/08/2011	US8053373 Semiconductor-on-insulator(SOI) structures including gradient nitrided buried oxide (BOX)
11/08/2011	US8053372 Method of reducing plasma stabilization time in a cyclic deposition process
11/08/2011	US8053371 Apparatus and methods for selective removal of material from wafer alignment marks
11/08/2011	US8053370 Semiconductor device and fabrications thereof
11/08/2011	US8053369 Process for forming opening portion in interlayer insulation film on metallic layer of semiconductor device
11/08/2011	US8053368 Method for removing residues from a patterned substrate
11/08/2011	US8053367 Wafer polishing method
11/08/2011	US8053366 Al-doped charge trap layer and non-volatile memory device including the same
11/08/2011	US8053365 Methods for forming all tungsten contacts and lines
11/08/2011	US8053364 Closed-loop sputtering controlled to enhance electrical characteristics in deposited layer
11/08/2011	US8053362 Method of forming metal electrode of system in package
11/08/2011	US8053360 Semiconductor device and method of manufacturing the same
11/08/2011	US8053359 Semiconductor device having a second level of metallization formed over a first level with minimal damage to the first level and method
11/08/2011	US8053357 Prevention of post CMP defects in CU/FSG process
11/08/2011	US8053356 Interconnect structure for semiconductor devices
11/08/2011	US8053355 Methods and systems for low interfacial oxide contact between barrier and copper metallization
11/08/2011	US8053354 Reduced wafer warpage in semiconductors by stress engineering in the metallization system
11/08/2011	US8053353 Method of making connections in a back-lit circuit
11/08/2011	US8053352 Method and mesh reference structures for implementing Z-axis cross-talk reduction through copper sputtering onto mesh reference planes
11/08/2011	US8053351 Method of forming at least one bonding structure
11/08/2011	US8053350 Methods of forming a conductive transparent oxide film layer for use in a cadmium telluride based thin film photovoltaic device
11/08/2011	US8053349 BGA package with traces for plating pads under the chip
11/08/2011	US8053348 Method of forming a semiconductor device using a sacrificial uniform vertical thickness spacer structure
11/08/2011	US8053347 Method of manufacturing semiconductor device
11/08/2011	US8053346 Semiconductor device and method of forming gate and metal line thereof with dummy pattern and auxiliary pattern
11/08/2011	US8053345 Method for fabricating field effect transistor using a compound semiconductor
11/08/2011	US8053343 Method for forming selective emitter of solar cell and diffusion apparatus for forming the same
11/08/2011	US8053342 Mask ROM device, semiconductor device including the mask ROM device, and methods of fabricating mask ROM device and semiconductor device
11/08/2011	US8053341 Method for fabricating semiconductor device
11/08/2011	US8053340 Method for fabricating semiconductor devices with reduced junction diffusion
11/08/2011	US8053339 Semiconductor device and manufacturing method thereof
11/08/2011	US8053338 Plasma CVD apparatus
11/08/2011	US8053337 Method of manufacturing semiconductor device
11/08/2011	US8053336 Method for reducing chip warpage
11/08/2011	US8053335 Forming method of gallium nitride system compound semiconductor layer, transfer method of the same, and substrate structure with the same bonded thereto
11/08/2011	US8053334 Method for forming silicon oxide film of SOI wafer
11/08/2011	US8053332 Method for manufacturing SOI substrate and semiconductor device
11/08/2011	US8053331 Flexible display substrates
11/08/2011	US8053330 Quasi-hydrophobic Si-Si wafer bonding using hydrophilic Si surfaces and dissolution of interfacial bonding oxide
11/08/2011	US8053329 Method for low temperature bonding and bonded structure
11/08/2011	US8053328 Methods of selective deposition of fine particles onto selected regions of a substrate
11/08/2011	US8053327 Method of manufacture of an integrated circuit system with self-aligned isolation structures
11/08/2011	US8053326 Semiconductor device and method of fabricating the same
11/08/2011	US8053325 Body contact structures and methods of manufacturing the same
11/08/2011	US8053324 Method of manufacturing a semiconductor device having improved transistor performance
11/08/2011	US8053323 Patterning methodology for uniformity control
11/08/2011	US8053322 Epitaxial deposition-based processes for reducing gate dielectric thinning at trench edges and integrated circuits therefrom
11/08/2011	US8053321 Formation of standard voltage threshold and low voltage threshold MOSFET devices
11/08/2011	US8053320 Semiconductor device and manufacturing method thereof
11/08/2011	US8053319 Method of forming a high voltage device
11/08/2011	US8053318 FET with replacement gate structure and method of fabricating the same
11/08/2011	US8053317 Method and structure for improving uniformity of passive devices in metal gate technology
11/08/2011	US8053316 Method of fabricating vertical channel transistor
11/08/2011	US8053315 Method to manufacture split gate with high density plasma oxide layer as inter-polysilicon insulation layer
11/08/2011	US8053314 Asymmetric field effect transistor structure and method
11/08/2011	US8053313 Semiconductor device and method of fabricating the same
11/08/2011	US8053312 Semiconductor device and method for fabricating the same
11/08/2011	US8053311 Dielectric film and semiconductor device using dielectric film including hafnium, aluminum or silicon, nitrogen, and oxygen
11/08/2011	US8053310 Method for defect reduction for memory cell capacitors
11/08/2011	US8053309 Methods of fabricating semiconductor devices
11/08/2011	US8053308 Method of forming a pattern and method of manufacturing a capacitor
11/08/2011	US8053307 Method of fabricating semiconductor device with cell epitaxial layers partially overlap buried cell gate electrode
11/08/2011	US8053306 PFET with tailored dielectric and related methods and integrated circuit
11/08/2011	US8053305 Method for producing semiconductor device
11/08/2011	US8053304 Method of forming high-mobility devices including epitaxially growing a semiconductor layer on a dislocation-blocking layer in a recess formed in a semiconductor substrate
11/08/2011	US8053303 SOI body contact using E-DRAM technology
11/08/2011	US8053302 Non-volatile memory device and method of manufacturing same
11/08/2011	US8053301 CMOS SiGe channel pFET and Si channel nFET devices with minimal STI recess
11/08/2011	US8053300 Semiconductor device
11/08/2011	US8053298 Planar split-gate high-performance MOSFET structure and manufacturing method
11/08/2011	US8053297 Method of fabricating a thin film transistor using joule heat from the gate electrode to form a crystallized channel region
11/08/2011	US8053296 Capacitor formed on a recrystallized polysilicon layer
11/08/2011	US8053295 Liquid crystal display device and method of fabricating the same
11/08/2011	US8053294 Manufacturing method of thin film transistor by controlling generation of crystal nuclei of microcrystalline semiconductor film
11/08/2011	US8053293 Method of manufacturing a display substrate
11/08/2011	US8053292 Semiconductor device and method of manufacturing semiconductor device
11/08/2011	US8053291 Method for making thin film transistor comprising flocculating of carbon nanotubes
11/08/2011	US8053290 Manufacturing method of semiconductor device

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