Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2011
10/19/2011EP2378546A2 Vertical junction field effect transistors, and methods of producing the same
10/19/2011EP2378545A1 Iii-nitride semiconductor growth substrate, iii-nitride semiconductor epitaxial substrate, iii-nitride semiconductor element, iii-nitride semiconductor freestanding substrate, and method for fabricating these
10/19/2011EP2378544A2 Semiconductor device fabricating method
10/19/2011EP2378543A2 Method of forming semiconductor patterns
10/19/2011EP2378542A1 Substrate and method for manufacturing substrate
10/19/2011EP2378362A1 Resist pattern coating agent and resist pattern forming method using the same
10/19/2011EP2378273A2 System and method for double sided optical inspection of thin film disks or wafers
10/19/2011EP2377975A1 Method of growing gallium nitride crystals and process for producing gallium nitride crystals
10/19/2011EP2377903A1 Film adhesive and anisotropic conductive adhesive
10/19/2011EP2377826A1 OPTICAL MEMBER COMPRISING SILICA GLASS CONTAINING TiO2
10/19/2011EP2377662A1 Single crystal
10/19/2011EP2377376A1 Method to form solder deposits on substrates
10/19/2011EP2377172A1 Method for producing an optoelectronic component and optoelectronic component
10/19/2011EP2377154A1 Via structure and method thereof
10/19/2011EP2377153A1 Strain engineered composite semiconductor substrates and methods of forming same
10/19/2011EP2377152A2 Method and system for centering wafer on chuck
10/19/2011EP2377151A1 Method for lowering the pressure in a charge-discharge lock and associated equipment
10/19/2011EP2377150A1 Method and apparatus for manufacturing an electronic assembly, electronic assembly manufactured with the method or in the apparatus
10/19/2011EP2377149A1 Bipolar transistor having self-adjusted emitter contact
10/19/2011EP2377148A1 Method of forming gate stack and structure thereof
10/19/2011EP2377147A2 Wiresaw cutting method
10/19/2011EP2377146A2 Composition for improving dryness during wire sawing
10/19/2011EP2377145A2 Wiresaw apparatus and method for continuous removal of magnetic impurities during wiresaw cutting
10/19/2011EP2377144A2 Thin film deposition via a spatially-coordinated and time-synchronized process
10/19/2011EP2376982A1 Substrate planarization with imprint materials and processes
10/19/2011EP2376680A1 Manufacturing of low defect density free-standing gallium nitride substrates and devices fabricated thereof
10/19/2011EP2376670A1 Vacuum coating system and method for operating a vacuum coating system
10/19/2011EP2376587A1 Slurry composition containing non-ionic polymer and method for use
10/19/2011EP2376584A1 Wet-etchable antireflective coatings
10/19/2011EP2376434A1 Functional material for printed electronic components
10/19/2011EP2376346A2 Substantially rigid collapsible liner and flexible gusseted or non-gusseted liners and methods of manufacturing the same and methods for limiting choke-off in liners
10/19/2011EP2304787B1 Nitrogen-plasma surface treatment in a direct bonding method
10/19/2011EP2286450B1 Read-only memory with eeprom structure
10/19/2011EP2212927B1 Method and device for coating a carrier for thin-film solar cells
10/19/2011EP2183767B1 Preparation method of electroconductive copper patterning layer by laser irradiation
10/19/2011EP2043142B1 Mounting method using thermocompression head
10/19/2011EP1979946B1 Nanowire tunneling transistor
10/19/2011EP1921061B1 Metal-containing compound, process for producing the same and method of forming a metal-containing thin film
10/19/2011EP1858061B1 Plasma treatment apparatus and semiconductor thin film manufacturing method using same
10/19/2011EP1851002B1 Polishing apparatus and polishing method
10/19/2011EP1828333B1 Polishing composition and polishing method
10/19/2011EP1652216B1 Convertible pad support for receiving at least two pads of different dimensions
10/19/2011EP1610339B1 Magnetic memory device and read method thereof
10/19/2011EP1589375B1 Resist composition
10/19/2011EP1476891B1 Device and method of coating a substrate with magnetic or magnetisable material
10/19/2011EP1461827B1 Method for improving the efficiency of epitaxially produced quantum dot semiconductor components
10/19/2011EP1340123B1 Systems and methods for exposing substrate periphery
10/19/2011CN202013874U Novel plasma etching clamp
10/19/2011CN202013873U Lead frame guiding device
10/19/2011CN202013872U Adjustable quartz boat carrier
10/19/2011CN202013871U Dismounting apparatus of graphite boat needle
10/19/2011CN202013870U Simple silicon chip loading device
10/19/2011CN202013869U Down sprue plate used for TO92-type semiconductor packaging mould
10/19/2011CN202013868U Semiconductor plastic packaging press machine
10/19/2011CN202013867U 薄膜芯片装置 Thin-film chip device
10/19/2011CN202011134U Power failure protector for semiconductor plastic encapsulation press
10/19/2011CN1979749B Uniform magnetic-field parallel beam lens system
10/19/2011CN1916770B Method of selecting a grid model for correcting a process recipe and lithographic assembly using the same
10/19/2011CN1769528B Etchant for conductive materials and method of manufacturing a thin film transistor array panel using the same
10/19/2011CN1713967B Chemical-solution supplying apparatus
10/19/2011CN102224610A Method for cleaning magnetic film processing chamber, method for manufacturing magnetic element, and substrate processing apparatus
10/19/2011CN102224599A Dry cleaning of silicon surface for solar cell applications
10/19/2011CN102224594A Silicon carbide semiconductor device and method for manufacturing the same
10/19/2011CN102224592A P-type sic semiconductor
10/19/2011CN102224590A Antenna integrated in a semiconductor chip
10/19/2011CN102224589A Integrated capacitor with interlinked lateral fins
10/19/2011CN102224588A Shielding for integrated capacitors
10/19/2011CN102224586A Structure and manufacture method for multi-row lead frame and semiconductor package
10/19/2011CN102224585A Integration sequences with top profile modification
10/19/2011CN102224584A Electronic component package and electronic component package manufacturing method
10/19/2011CN102224583A Methods for protecting a die surface with photocurable materials
10/19/2011CN102224582A Device and method for at least partially encapsulating a closed flat carrier with electronic components
10/19/2011CN102224581A Field effect transistor
10/19/2011CN102224580A Thin film transistor manufacturing method, thin film transistor, and electronic device
10/19/2011CN102224579A Semiconductor device and electronic device
10/19/2011CN102224578A Dielectric film, process for producing dielectric film, semiconductor device, and recording medium
10/19/2011CN102224577A Composition for sealing semiconductor, semiconductor device, and process for manufacturing semiconductor device
10/19/2011CN102224576A Confinement of foam delivered by a proximity head
10/19/2011CN102224575A Surface protection tape for dicing and method for peeling and removing surface protection tape for dicing
10/19/2011CN102224574A Bottom up plating by organic surface passivation and differential plating retardation
10/19/2011CN102224573A Method and apparatus for trench and via profile modification
10/19/2011CN102224572A Fluid delivery mechanism for vaccum wafer processing system
10/19/2011CN102224571A Substrate processing method and substrate processing apparatus
10/19/2011CN102224570A Substrate processing apparatus
10/19/2011CN102224569A Methods of forming a masking pattern for integrated circuits
10/19/2011CN102224568A Method for manufacturing bonded wafer
10/19/2011CN102224567A Integrated capacitor with grid plates
10/19/2011CN102224566A Integrated capacitor with alternating layered segments
10/19/2011CN102224565A Integrated capacitor with array of crosses
10/19/2011CN102224536A Substrate for display panel, and display panel
10/19/2011CN102224276A Sputtering target and process for producing same
10/19/2011CN102224215A Temporarily fixing agent for semiconductor wafer, and process for production of semiconductor device using same
10/19/2011CN102223765A Substrate processing apparatus and method
10/19/2011CN102223757A Wiring board and method for manufacturing wiring board
10/19/2011CN102223756A Method for producing an electrically conductive connection between a contact and a counter contact
10/19/2011CN102222729A Method for improving electroplating quality of front electrode of solar cell
10/19/2011CN102222702A Capacitor and formation method thereof
10/19/2011CN102222700A 薄膜晶体管元件及其制作方法 The thin film transistor device and manufacturing method
10/19/2011CN102222699A Display device
10/19/2011CN102222697A Grid-control metal-insulator device based on electronic tunneling
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