H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2011
11/03/2011	US20110269269 Laser ablation alternative to low cost leadframe process
11/03/2011	US20110269268 Semiconductor device and a manufacturing method of the same
11/03/2011	US20110269266 Method for manufacturing semiconductor device
11/03/2011	US20110269263 Method for implanting impurities into a substrate and method for manufacturing a solar cell using the same
11/03/2011	US20110269258 Solid-state imaging device and method for manufacturing the same
11/03/2011	US20110269252 Method for positioning spacers for pitch multiplication
11/03/2011	US20110269251 Spin Transfer Torque Memory Device Having Common Source Line and Method for Manufacturing the Same
11/03/2011	US20110269250 Growth method of fe3n material
11/03/2011	US20110268538 Component test apparatus and component transport method
11/03/2011	US20110267897 Non-Volatile Memory Cells Formed in Back-End-of-Line Processes
11/03/2011	US20110267870 Decoders Using Memristive Switches
11/03/2011	US20110267867 Semiconductor device
11/03/2011	US20110267796 Nonvolatile memory device and method for manufacturing the same
11/03/2011	US20110267789 Etch-back type semiconductor package, substrate and manufacturing method thereof
11/03/2011	US20110267621 Surface plasmon resonance sensor, localized plasmon resonance sensor, and method for manufacturing same
11/03/2011	US20110267104 Enhanced permutable switching network with multicasting signals for interconnection fabric
11/03/2011	US20110267023 Dc voltage conversion module, semiconductor module, and method of making semiconductor module
11/03/2011	US20110266956 Display apparatus with storage electrodes having concavo-convex features
11/03/2011	US20110266701 Novel build-up package for integrated circuit devices, and methods of making same
11/03/2011	US20110266700 Wire bond interconnection and method of manufacture thereof
11/03/2011	US20110266699 Method for manufacturing a microelectronic device and a microelectronic device thus manufactured
11/03/2011	US20110266698 Semiconductor device comprising variable-sized contact, method of forming same, and apparatus comprising same
11/03/2011	US20110266695 Semiconductor device layout method, a computer program, and a semiconductor device manufacture method
11/03/2011	US20110266694 Methods of manufacturing semiconductor structures and devices including nanotubes, and semiconductor structures, devices, and systems fabricated using such methods
11/03/2011	US20110266693 Tce compensation for package substrates for reduced die warpage assembly
11/03/2011	US20110266692 Layered chip package and method of manufacturing same
11/03/2011	US20110266686 Semiconductor device and method of manufacturing the same
11/03/2011	US20110266685 Semiconductor Device Comprising Sophisticated Conductive Elements in a Dielectric Material System Formed by Using a Barrier Layer
11/03/2011	US20110266684 Selective Die Electrical Insulation By Additive Process
11/03/2011	US20110266683 Stackable Power MOSFET, Power MOSFET Stack, and Process of Manufacture
11/03/2011	US20110266682 Microelectronic structure including air gap
11/03/2011	US20110266681 Electronic component as well as method for its production
11/03/2011	US20110266680 Carbon nanotube circuit component structure
11/03/2011	US20110266679 Semiconductor device, and manufacturing method of semiconductor device
11/03/2011	US20110266678 Semiconductor device and method for manufacturing same
11/03/2011	US20110266677 Semiconductor structure and manufacturing method of the same
11/03/2011	US20110266676 Method for forming interconnection line and semiconductor structure
11/03/2011	US20110266675 Directional self-assembly of biological electrical interconnects
11/03/2011	US20110266674 Laser Etch Via Formation
11/03/2011	US20110266673 Integrated circuit package structure and method
11/03/2011	US20110266671 Substrate for a semiconductor package and manufacturing method thereof
11/03/2011	US20110266666 Circuit board with built-in semiconductor chip and method of manufacturing the same
11/03/2011	US20110266664 Integrated circuit packaging system with package-on-package and method of manufacture thereof
11/03/2011	US20110266661 Lead frame and method for manufacturing semiconductor device using the same
11/03/2011	US20110266660 Insulating film for semiconductor device, process and apparatus for producing insulating film for semiconductor device, semiconductor device, and process for producing the semiconductor device
11/03/2011	US20110266659 Technique for stable processing of thin/fragile substrates
11/03/2011	US20110266656 Semiconductor Device and Method of Forming Protective Coating Material Over Semiconductor Wafer to Reduce Lamination Tape Residue
11/03/2011	US20110266655 Semiconductor wafer having multilayer film, method for producing the same, and method for producing semiconductor device
11/03/2011	US20110266654 Power storage device and method for manufacturing the same
11/03/2011	US20110266653 Semiconductor device having a fuse element
11/03/2011	US20110266651 Method for manufacturing components
11/03/2011	US20110266650 Semiconductor device and method for manufacturing same
11/03/2011	US20110266642 Method for producing a magnetic tunnel junction and magnetic tunnel junction thus obtained
11/03/2011	US20110266641 Silicon condenser microphone having an additional back chamber and a fabrication method therefor
11/03/2011	US20110266640 Acoustic sensor and method of manufacturing the same
11/03/2011	US20110266639 Method of Producing a MEMS Device
11/03/2011	US20110266638 Semiconductor Device Comprising Contact Elements and Metal Silicide Regions Formed in a Common Process Sequence
11/03/2011	US20110266637 Precise Resistor on a Semiconductor Device
11/03/2011	US20110266636 Method for forming an offset spacer of a mos device
11/03/2011	US20110266635 Native Devices Having Improved Device Characteristics and Methods for Fabrication
11/03/2011	US20110266633 Semiconductor Device Comprising Metal Gates and Semiconductor Resistors Formed on the Basis of a Replacement Gate Approach
11/03/2011	US20110266630 Semiconductor Device and Method for Manufacturing the Same
11/03/2011	US20110266626 Gate depletion drain extended mos transistor
11/03/2011	US20110266625 Maintaining Integrity of a High-K Gate Stack After Embedding a Stressor Material by Using a Liner
11/03/2011	US20110266624 Electrostatic discharge protection having multiply segmented diodes in proximity to transistor
11/03/2011	US20110266620 Transistor structure with feed-through source-to-substrate contact
11/03/2011	US20110266616 Trenched power semiconductor structure with reduced gate impedance and fabrication method thereof
11/03/2011	US20110266614 Ldmos with enhanced safe operating area (soa) and method therefor
11/03/2011	US20110266613 Semiconductor component and method of manufacture
11/03/2011	US20110266611 Nonvolatile memory device and method for fabricating the same
11/03/2011	US20110266609 SiH4 SOAK FOR LOW HYDROGEN SIN DEPOSITION TO IMPROVE FLASH MEMORY DEVICE PERFORMANCE
11/03/2011	US20110266605 Memristive Transistor Memory
11/03/2011	US20110266604 Nonvolatile memory device and method for fabricating the same
11/03/2011	US20110266600 Semiconductor memory device and manufacturing method thereof
11/03/2011	US20110266597 Semiconductor device and method for manufacturing the same
11/03/2011	US20110266596 Semiconductor device and method of making the same
11/03/2011	US20110266595 Semiconductor substrate, electronic device and method for manufacturing semiconductor substrate
11/03/2011	US20110266594 Method for obtaining a layer of aln having substantially vertical sides
11/03/2011	US20110266592 Device and method for transient voltage suppressor
11/03/2011	US20110266586 Led package and manufacturing method thereof
11/03/2011	US20110266575 Nitride-based semiconductor device and method for fabricating the same
11/03/2011	US20110266569 Led wafer with laminated phosphor layer
11/03/2011	US20110266563 Method for forming a multi-level surface on a substrate with areas of different wettability and a semiconductor device having the same
11/03/2011	US20110266561 Optical Systems Fabricated by Printing-Based Assembly
11/03/2011	US20110266558 Silicon carbide semiconductor device and method of producing silicon carbide semiconductor device
11/03/2011	US20110266557 Semiconductor Devices Having Improved Adhesion and Methods of Fabricating the Same
11/03/2011	US20110266554 Semiconductor device and method of manufacturing the device
11/03/2011	US20110266549 Laminated structure, production method of the same, multilayer circuit board, active matrix substrate, and electronic display
11/03/2011	US20110266542 Semiconductor device and method of fabricating the same
11/03/2011	US20110266538 Semiconductor device and manufacturing method thereof
11/03/2011	US20110266537 Methods of fabricating metal oxide or metal oxynitride tfts using wet process for source-drain metal etch
11/03/2011	US20110266536 Solution Composition for Manufacturing Metal Oxide Semiconductor
11/03/2011	US20110266521 Porous and non-porous nanostructures
11/03/2011	US20110266516 Phase change memory device capable of reducing disturbance and method of manufacturing the same
11/03/2011	US20110266515 Memristive switch device
11/03/2011	US20110266512 Non-volatile resistance-switching thin film devices
11/03/2011	US20110266511 Phase Change Memory Device with Air Gap
11/03/2011	US20110266504 Deposition from ionic liquids
11/03/2011	US20110266494 Stripper Solution and Method of Manufacturing Liquid Crystal Display Using the Same
11/03/2011	US20110266467 Extreme ultraviolet light source apparatus

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