Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2011
10/20/2011US20110256702 Thin film transistor and display device, and method for manufacturing thereof
10/20/2011US20110256701 Method for tuning the work function of a metal gate of the pmos device
10/20/2011US20110256700 Method of fabricating semiconductor device
10/20/2011US20110256699 Method for manufacturing silicon carbide semiconductor device
10/20/2011US20110256698 Stepped masking for patterned implantation
10/20/2011US20110256697 Recessed-gate transistor device having a dielectric layer with multi thicknesses and method of making the same
10/20/2011US20110256696 Semiconductor device for preventing the leaning of storage nodes and method for manufacturing the same
10/20/2011US20110256695 Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device
10/20/2011US20110256694 Methods of Forming One or More Covered Voids in a Semiconductor Substrate, Methods of Forming Field Effect Transistors, Methods of Forming Semiconductor-On-Insulator Substrates, Methods of Forming a Span Comprising Silicon Dioxide, Methods of Cooling Semiconductor Devices, Methods of Forming Electromagnetic Radiation Emitters and Conduits, Methods of Forming Imager Systems, Methods of Forming Nanofluidic Channels, Fluorimetry Methods, and Integrated Circuitry
10/20/2011US20110256693 Method for Synthesis of High Quality Large Area Bulk Gallium Based Crystals
10/20/2011US20110256692 Multiple precursor concentric delivery showerhead
10/20/2011US20110256691 Removal of surface dopants from a substrate
10/20/2011US20110256690 Integrated circuit wafer dicing method
10/20/2011US20110256689 Optical device wafer processing method and laser processing apparatus
10/20/2011US20110256688 Semiconductor component and methods for producing a semiconductor component
10/20/2011US20110256687 Method for Fabricating Through Substrate Microchannels
10/20/2011US20110256686 Semiconductor device and method of manufacturing the same
10/20/2011US20110256685 Method of manufacturing semiconductor device
10/20/2011US20110256684 Field effect transistor using oxide film for channel and method of manufacturing the same
10/20/2011US20110256683 Method of manufacturing a high-performance semiconductor device
10/20/2011US20110256682 Multiple Deposition, Multiple Treatment Dielectric Layer For A Semiconductor Device
10/20/2011US20110256681 MOS Devices with Improved Source/Drain Regions with SiGe
10/20/2011US20110256680 Nand flash memory array with cut-off gate line and methods for operating and fabricating the same
10/20/2011US20110256679 Non-volatile storage having a connected source and well
10/20/2011US20110256678 Method for manufacturing semiconductor device
10/20/2011US20110256677 Novel poly resistor and poly efuse design for replacement gate technology
10/20/2011US20110256676 Methods of Manufacturing a Semiconductor Device
10/20/2011US20110256675 SELF-ALIGNED PROCESS FOR NANOTUBE/NANOWIRE FETs
10/20/2011US20110256674 Two-way Halo Implant
10/20/2011US20110256673 Deposition method and method for manufacturing semiconductor device
10/20/2011US20110256672 Nonvolatile semiconductor memory device and method of manufacturing the same
10/20/2011US20110256671 Semiconductor memory module with reverse mounted chip resistor
10/20/2011US20110256670 Method for manufacturing integrated circuit package system with under paddle leadfingers
10/20/2011US20110256669 Dicing tape-integrated film for semiconductor back surface
10/20/2011US20110256668 Method of manufacturing semiconductor apparatus
10/20/2011US20110256667 Stacked wafer manufacturing method
10/20/2011US20110256666 Thermosetting die bond film, dicing die bond film and semiconductor device
10/20/2011US20110256665 Stacked wafer manufacturing method
10/20/2011US20110256664 Integrated circuit packaging system with mountable inward and outward interconnects and method of manufacture thereof
10/20/2011US20110256663 High Speed, High Density, Low Power Die Interconnect System
10/20/2011US20110256662 Chip embedded substrate and method of producing the same
10/20/2011US20110256654 Double-sided reusable template for fabrication of semiconductor substrates for photovoltaic cell and microelectronics device manufacturing
10/20/2011US20110256653 Thermoelectric Modules and Methods for Manufacturing Thermoelectric Modules
10/20/2011US20110256652 Method for forming a transducer
10/20/2011US20110256651 Method for fabricating light-emitting devices with vertical light-extraction mechanism
10/20/2011US20110256648 Method of Making Double-sided Wavelength Converter and Light Generating Device Using Same
10/20/2011US20110256645 Multiple precursor showerhead with by-pass ports
10/20/2011US20110256644 Masks for microlithography and methods of making and using such masks
10/20/2011US20110256643 Method for detaching layers with low magnetic permeability
10/20/2011US20110256642 Manufacturing method of magneto-resistance effect element
10/20/2011US20110256484 Method for producing comb-shaped electrode
10/20/2011US20110256473 Mask blank substrate set and mask blank set
10/20/2011US20110256377 Photovoltaic structures produced with silicon ribbons
10/20/2011US20110255950 System and Method for Sealing a Vapor Deposition Source
10/20/2011US20110255770 Inspection system and method for inspecting line width and/or positional errors of a pattern
10/20/2011US20110255567 Laser Diodes Comprising QWI Output Window and Waveguide Areas and Methods of Manufacture
10/20/2011US20110255335 Charge trap memory having limited charge diffusion
10/20/2011US20110255334 Flash memory having multi-level architecture
10/20/2011US20110255326 Semiconductor Device
10/20/2011US20110255255 Housing for a circuit that is to be implanted in-vivo and process of making the same
10/20/2011US20110255172 Laser irradiation apparatus and manufacturing method of semiconductor device
10/20/2011US20110255082 Optical inspection method and optical inspection apparatus
10/20/2011US20110255045 Display substrate, liquid crystal display including the display substrate, and method of manufacturing the display substrate
10/20/2011US20110255022 Semiconductor device and method of fabricating the same
10/20/2011US20110254988 Solid-state image sensing device and method for fabricating the same
10/20/2011US20110254900 Inkjet head assembly and method for manufacturing the same
10/20/2011US20110254898 Liquid discharge head and method for manufacturing the same
10/20/2011US20110254653 Multilayered structure
10/20/2011US20110254176 Dicing tape-integrated film for semiconductor back surface
10/20/2011US20110254173 Semiconductor Device and Method of Forming Conductive Vias with Trench in Saw Street
10/20/2011US20110254172 Package-on-package system with through vias and method of manufacture thereof
10/20/2011US20110254169 Semiconductor device with through substrate via
10/20/2011US20110254168 Integrated circuit interconnect structure
10/20/2011US20110254166 Chip Area Optimized Pads
10/20/2011US20110254165 Semiconductor integrated circuit device and production method thereof
10/20/2011US20110254164 Self-aligned barrier layers for interconnects
10/20/2011US20110254163 Sleeve insulators and semiconductor device including the same
10/20/2011US20110254162 High Speed, High Density, Low Power Die Interconnect System
10/20/2011US20110254159 Conductive feature for semiconductor substrate and method of manufacture
10/20/2011US20110254156 Semiconductor Device and Method of Wafer Level Package Integration
10/20/2011US20110254155 Wafer Level Die Integration and Method Therefor
10/20/2011US20110254154 Routing layer for mitigating stress in a semiconductor die
10/20/2011US20110254153 Die structure and die connecting method
10/20/2011US20110254152 Chip structure, chip bonding structure using the same, and manufacturing method thereof
10/20/2011US20110254151 Method for fabricating bump structure without ubm undercut
10/20/2011US20110254149 Semiconductor component and manufacturing method of semiconductor component
10/20/2011US20110254147 Semiconductor equipment and method of manufacturing the same
10/20/2011US20110254146 Semiconductor Device and Method of Forming Electrical Interconnection Between Semiconductor Die and Substrate with Continuous Body of Solder Tape
10/20/2011US20110254144 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
10/20/2011US20110254143 Chip package structure and method of making the same
10/20/2011US20110254141 Physical structure for use in a physical unclonable
10/20/2011US20110254140 Photoresists and methods for use thereof
10/20/2011US20110254139 Cmp-first damascene process scheme
10/20/2011US20110254138 Low-temperature absorber film and method of fabrication
10/20/2011US20110254135 Iii-nitride semiconductor growth substrate, iii-nitride semiconductor epitaxial substrate, iii-nitride semiconductor element, iii-nitride semiconductor freestanding substrate, and method for fabricating these
10/20/2011US20110254133 Photoresists and methods for use thereof
10/20/2011US20110254132 Vertical interdigitated semiconductor capacitor
10/20/2011US20110254129 Electrical components for microelectronic devices and methods of forming the same
10/20/2011US20110254128 Electrode for energy storage device and method for manufacturing the same
10/20/2011US20110254127 Method and device for a dram capacitor having low depletion ratio
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