Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2011
10/19/2011CN102222694A semiconductor device having a strained channel and method of manufacture thereof
10/19/2011CN102222693A FinFET device and manufacturing method thereof
10/19/2011CN102222692A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/19/2011CN102222691A High drive-current three-dimensional multiple-gate transistor and manufacturing method thereof
10/19/2011CN102222687A Germanium-based NMOS (N-metal-oxide-semiconductor) device and preparation method thereof
10/19/2011CN102222686A Fence-type grid-controlled metal-insulator device based on electronic tunneling
10/19/2011CN102222676A Solid-state image pickup device and electronic apparatus
10/19/2011CN102222673A Novel SOI (silicon on insulator) material and preparation method thereof
10/19/2011CN102222672A Bismuth ferrite base film layer stacked structure capacitor and preparation method thereof
10/19/2011CN102222668A Semiconductor device and method for forming the same
10/19/2011CN102222661A Electrical alignment mark set and method for aligning wafer stack
10/19/2011CN102222658A Multi-circle arranged IC (integrated circuit) chip packaging member and producing method thereof
10/19/2011CN102222657A Multi-ring-arranged double-integrated circuit (IC) chip packaging piece and production method thereof
10/19/2011CN102222654A Semiconductor device with through substrate via and its production method
10/19/2011CN102222653A Dimpling block structure
10/19/2011CN102222650A Electronic element packaging body and formation method thereof
10/19/2011CN102222649A Adhesive composition,circuit connecting material, connection structure of circuit connectors and semiconductor devices
10/19/2011CN102222647A Semiconductor die and method of manufacturing semiconductor feature
10/19/2011CN102222646A Split-gate type memory and manufacturing method thereof
10/19/2011CN102222645A Method for making flash memory element
10/19/2011CN102222644A Method for manufacturing active matrix organic light-emitting diode (AMOLED) apparatus
10/19/2011CN102222643A Method for filling redundant metal in manufacturing process of integrated circuit and semiconductor device
10/19/2011CN102222642A Integrated circuit system with stress redistribution layer
10/19/2011CN102222641A Method for forming a metal oxidation barrier layer of a copper interconnect
10/19/2011CN102222640A 通孔形成方法 The method for forming the through-hole
10/19/2011CN102222639A Method for forming double-mosaic structure
10/19/2011CN102222638A Method for removing copper residue between copper lead wires
10/19/2011CN102222637A Preparation method of germanium substrate on insulator
10/19/2011CN102222636A Manufacturing method of shallow trench isolation
10/19/2011CN102222635A Preparation method of large-diameter vertical silicon wafer carrier
10/19/2011CN102222634A Dicing tape-integrated film for semiconductor back surface
10/19/2011CN102222633A Thermosetting die bond film, dicing die bond film and method for manufacturing semiconductor device
10/19/2011CN102222632A Wafer testing method and device
10/19/2011CN102222631A Method for detecting metal interconnection layer of semiconductor device
10/19/2011CN102222630A Method for preparing Sn-Ag-In ternary lead-free flip salient point
10/19/2011CN102222629A 半导体装置及其制造方法 Semiconductor device and manufacturing method
10/19/2011CN102222628A Jig for semiconductor process
10/19/2011CN102222627A Packaging method possessing wafer dimension paster
10/19/2011CN102222626A Machine bench for semiconductor technology
10/19/2011CN102222625A Manufacturing method of light-emitting diode (LED) packaging structure and base thereof
10/19/2011CN102222624A Preparation method of single crystal copper wire
10/19/2011CN102222623A Method of manufacturing semiconductor apparatus
10/19/2011CN102222622A Semiconductor device and manufacturing method for semiconductor device
10/19/2011CN102222621A Method for combining heat-radiating fins of heat radiator with heat pipe and heat radiator thereof
10/19/2011CN102222620A Preparation method of LDMOS (Laterally Diffused Metal Oxide Semiconductor) for efficiently collecting substrate current
10/19/2011CN102222619A Semiconductor device manufacturing method
10/19/2011CN102222618A Trench metal oxide semiconductor field effect tube
10/19/2011CN102222617A Manufacturing method of high density structure of trench power semiconductor
10/19/2011CN102222616A Manufacturing method of semiconductor device
10/19/2011CN102222615A Production process for Schottky chip and etching solution therefor
10/19/2011CN102222614A Formation method of power metal oxide field effect tube
10/19/2011CN102222613A Plasma oxidation method and plasma oxidation apparatus
10/19/2011CN102222612A Dry etching method and dry etching apparatus
10/19/2011CN102222611A Method for fabricating a gate dielectric layer
10/19/2011CN102222610A Method for fabricating a semiconductor device
10/19/2011CN102222609A Impurity concentration distribution control method of semiconductor component and related semiconductor component
10/19/2011CN102222608A Method of crystallizing a silicon layer, thin film transistor and organic light emitting display device
10/19/2011CN102222607A Transfer method special for graphene thin film prepared by CVD (chemical vapor deposition) method
10/19/2011CN102222606A Forming method of capacitor
10/19/2011CN102222605A Wafer conveying device with fragment detection
10/19/2011CN102222604A Ejector sleeve device mechanism
10/19/2011CN102222603A Wafer detecting system
10/19/2011CN102222602A Imprinting device
10/19/2011CN102222601A Method for enhancing sharpness of wafer ID
10/19/2011CN102222600A Cabinet recovery processing method and apparatus
10/19/2011CN102222599A Method and device for optimizing technological process
10/19/2011CN102222598A Substrate processing device
10/19/2011CN102222252A Method, equipment and system for producing smart card
10/19/2011CN102221783A Chemically amplified positive resist composition and pattern forming process
10/19/2011CN102221780A Chemically amplified negative resist composition for EB or EUV lithography and patterning process
10/19/2011CN102221761A Silicon-based liquid crystal device and manufacturing method thereof
10/19/2011CN102221756A Liquid crystal display (LCD) panel structure of integrated touch panel and manufacturing method thereof
10/19/2011CN102221416A Polishing solution physical parameter measuring apparatus, measuring method and chemically mechanical polishing equipment
10/19/2011CN102220092A Dicing tape-integrated film for semiconductor back surface
10/19/2011CN102220091A Adhesive tape for wafer processing
10/19/2011CN102218700A Chemical mechanical polishing equipment
10/19/2011CN102218616A Electronic welding tool
10/19/2011CN101958304B Double-side graph chip direct-put module package structure and package method thereof
10/19/2011CN101901761B MOCVD growth method of non-polar m-surface GaN based on gamma-surface LiAlO2 substrate
10/19/2011CN101901740B Electronic component cutting and stripping machine and method thereof
10/19/2011CN101866861B Integration method of high-reliability power hybrid integrated circuit
10/19/2011CN101866835B Method for preparing high-germanium-content germanium-silicon virtual substrate
10/19/2011CN101855717B Inline-type wafer conveyance device
10/19/2011CN101853880B AlGaN/GaN high-electron-mobility transistor and manufacturing method thereof
10/19/2011CN101831613B Method for growing nonpolar InN film by utilizing nonpolar ZnO buffer layer
10/19/2011CN101826502B Island-exposed and submerged island-exposed type lead frame structure and method for sequentially etching and plating
10/19/2011CN101752236B Atomic layer deposition Al2O3/HfO2 method for regulating energy band offset between GaAs semiconductor and gate dielectric
10/19/2011CN101681929B Gate insulating film forming agent for thin-film transistor
10/19/2011CN101681859B 半导体器件 Semiconductor devices
10/19/2011CN101656250B Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates
10/19/2011CN101531675B Chelating agent and preparation method and application thereof
10/19/2011CN101512742B Method for manufacturing semiconductor device
10/19/2011CN101482918B Finger print detection device
10/19/2011CN101436564B Substrate processing apparatus, substrate washing apparatus and substrate processing apparatus
10/19/2011CN101414548B Single wafer drying device and drying method
10/19/2011CN101388334B Heat treatment device
10/19/2011CN101325836B Plasma cvd apparatus and film deposition method
10/19/2011CN101325209B Semiconductor device and method for manufacturing the same
10/19/2011CN101290898B Mask manufacturing method of base board using the mask
10/19/2011CN101246290B Electro-optical device substrate, method of manufacturing the same, electro-optical device and electronic apparatus
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