Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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10/20/2011 | WO2011130205A2 Support system for a semiconductor device |
10/20/2011 | WO2011130088A1 Low power semiconductor transistor structure and method of fabrication thereof |
10/20/2011 | WO2011130040A2 Apparatus for high throughput wafer bonding |
10/20/2011 | WO2011130014A2 Pulsed plasma to affect conformal processing |
10/20/2011 | WO2011129959A2 Molding windows in thin pads |
10/20/2011 | WO2011129957A2 Preferential dielectric gapfill |
10/20/2011 | WO2011129763A1 An interconnect structure and a method of forming the same |
10/20/2011 | WO2011129636A2 Method for synthesizing nanoelectrode materials using an ultra-fast combustion method, and nanoelectrode materials synthesized by the method |
10/20/2011 | WO2011129560A2 Fluid supply apparatus |
10/20/2011 | WO2011129492A1 Gas injection unit and a thin-film vapour-deposition device and method using the same |
10/20/2011 | WO2011129456A1 Deposition method and method for manufacturing semiconductor device |
10/20/2011 | WO2011129443A1 Semiconductor device |
10/20/2011 | WO2011129373A1 Light-reflective anisotropic conductive adhesive agent, and light emitting device |
10/20/2011 | WO2011129282A1 Laser processing apparatus |
10/20/2011 | WO2011129278A1 Resin composition for adhesive agent, adhesive agent comprising the resin composition, adhesive sheet, and printed wiring board involving the adhesive sheet as adhesive layer |
10/20/2011 | WO2011129272A1 Attachment material for semiconductor chip bonding, attachment film for semiconductor chip bonding, semiconductor device manufacturing method, and semiconductor device |
10/20/2011 | WO2011129256A1 Bonding wire |
10/20/2011 | WO2011129254A1 Polishing pad |
10/20/2011 | WO2011129246A1 Single-crystal substrate, single-crystal substrate having crystalline film, crystalline film, method for producing single-crystal substrate having crystalline film, method for producing crystalline substrate, and method for producing element |
10/20/2011 | WO2011129244A1 Contact structure and method for manufacturing contact structure |
10/20/2011 | WO2011129234A1 Semiconductor device and method for manufacturing same |
10/20/2011 | WO2011129233A1 Semiconductor device |
10/20/2011 | WO2011129227A1 Semiconductor device, process for production of semiconductor device, and display device |
10/20/2011 | WO2011129212A1 Mask blank and process for production of mold for imprinting use |
10/20/2011 | WO2011129152A1 Swirl flow forming body and contactless conveyance device |
10/20/2011 | WO2011129037A1 Thin film transistor substrate, method for producing same, and display device |
10/20/2011 | WO2011129005A1 Photocurable composition for formation of resin pattern, and pattern formation method using same |
10/20/2011 | WO2011128994A1 Silicon carbide semiconductor device and method for manufacturing same |
10/20/2011 | WO2011128982A1 Component transfer device and method |
10/20/2011 | WO2011128981A1 Component transfer device and method |
10/20/2011 | WO2011128980A1 Apparatus and method for transferring component |
10/20/2011 | WO2011128932A1 Organic semiconductor device and method for manufacturing organic semiconductor device |
10/20/2011 | WO2011128811A2 Grounded chuck |
10/20/2011 | WO2011128319A1 Method for handling a wafer using a support structure |
10/20/2011 | WO2011128260A1 Heat treatment method having a heating step, a treatment step, and a cooling step |
10/20/2011 | WO2011128226A1 Device and method for simultaneously precipitating a plurality of semiconductor layers in a plurality of process chambers |
10/20/2011 | WO2011128217A1 Method for producing a semiconductor wafer |
10/20/2011 | WO2011128162A1 Substrate handling apparatus and lithographic apparatus |
10/20/2011 | WO2011128001A2 Method for producing a photovoltaic module comprising semiconductor cells contact-connected on the rear side, and photovoltaic module |
10/20/2011 | WO2011127907A2 Method and device for forming solder deposits |
10/20/2011 | WO2011127896A1 Process for internally coating functional layers with a through-hardened material |
10/20/2011 | WO2011127840A1 Method for fabricating waveguides using epitaxial growth |
10/20/2011 | WO2011127720A1 The method of fabricating the semiconductor device |
10/20/2011 | WO2011127634A1 Semiconductor device and manufacturing method thereof |
10/20/2011 | WO2011106072A3 Use of ruthenium tetroxide as a precursor and reactant for thin film depositions |
10/20/2011 | WO2011101238A8 Electric resistance element suitable for light-emitting diode, laser diodes, or photodetectors |
10/20/2011 | WO2011093979A3 Feedforward temperature control for plasma processing apparatus |
10/20/2011 | WO2011090852A3 Through silicon via lithographic alignment and registration |
10/20/2011 | WO2011090827A3 Esd protection device and method |
10/20/2011 | WO2011087610A3 Conductivity improvements for iii-v semiconductor devices |
10/20/2011 | WO2011087606A3 Techniques for forming contacts to quantum well transistors |
10/20/2011 | WO2011084397A3 Body contacted transistor with reduced parasitic capacitance |
10/20/2011 | WO2011081831A3 Hermetic electrical feedthrough |
10/20/2011 | WO2011081645A3 Adjusting substrate temperature to improve cd uniformity |
10/20/2011 | WO2011074775A3 Cylindrical magnetic levitation stage and lithography |
10/20/2011 | WO2011064684A3 Method and apparatus for surface treatment using a mixture of acid and oxidizing gas |
10/20/2011 | WO2011061029A3 Silicon layers made of polymer-modified liquid silane formulations |
10/20/2011 | WO2011056485A3 Endpoint method using peak location of spectra contour plots versus time |
10/20/2011 | WO2011053001A3 Front retainer |
10/20/2011 | WO2011053000A3 Wafer-conveying container equipped with a door-locking device |
10/20/2011 | WO2011051015A3 Aluminum containing metal layer for threshold voltage shift |
10/20/2011 | WO2011050171A4 Method for tunably repairing low-k dielectric damage |
10/20/2011 | WO2011044046A3 Improved multichamber split processes for led manufacturing |
10/20/2011 | WO2010070562A9 Device for treating disc-like articles and method for oparating same |
10/20/2011 | US20110256817 Polishing pad and method for producing same |
10/20/2011 | US20110256815 Method for polishing silicon wafer, method for producing silicon wafer, apparatus for polishing disk-shaped workpiece, and silicon wafer |
10/20/2011 | US20110256736 Method for processing a substrate using a laser beam |
10/20/2011 | US20110256735 Ald of metal silicate films |
10/20/2011 | US20110256734 Silicon nitride films and methods |
10/20/2011 | US20110256733 Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus |
10/20/2011 | US20110256732 Pulsed Plasma to Affect Conformal Processing |
10/20/2011 | US20110256731 method for fabricating a gate dielectric layer |
10/20/2011 | US20110256730 Finishing method for manufacturing substrates in the field of electronics |
10/20/2011 | US20110256729 Showerhead for CVD Depositions |
10/20/2011 | US20110256728 Wafer thinning method in wafer treating system |
10/20/2011 | US20110256727 Method of forming semiconductor patterns |
10/20/2011 | US20110256726 Plasma activated conformal film deposition |
10/20/2011 | US20110256725 Structure and method for thin film device with stranded conductor |
10/20/2011 | US20110256724 Gas and liquid injection methods and apparatus |
10/20/2011 | US20110256723 Method for forming semiconductor device |
10/20/2011 | US20110256722 Methods for forming roughened surfaces and applications thereof |
10/20/2011 | US20110256721 Ruthenium-containing precursors for cvd and ald |
10/20/2011 | US20110256720 Techniques for Impeding Reverse Engineering |
10/20/2011 | US20110256719 Method of fabricating semiconductor device |
10/20/2011 | US20110256718 Thin films |
10/20/2011 | US20110256717 Methods for fabricating semiconductor devices |
10/20/2011 | US20110256716 Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features |
10/20/2011 | US20110256715 Barrier layer for copper interconnect |
10/20/2011 | US20110256714 Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same |
10/20/2011 | US20110256713 Polyhedral oligomeric silsesquioxane based imprint materials and imprint process using polyhedral oligomeric silsesquioxane based imprint materials |
10/20/2011 | US20110256712 Etchant for electrode and method of fabricating thin film transistor array panel using the same |
10/20/2011 | US20110256711 Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods |
10/20/2011 | US20110256710 Semiconductor device and method for manufacturing same |
10/20/2011 | US20110256709 Level posture sensing chip and its manufacturing method, level posture sensor |
10/20/2011 | US20110256708 Methods of Manufacturing Flash Memory Devices by Selective Removal of Nitrogen Atoms |
10/20/2011 | US20110256707 Process for fabricating non-volatile storage |
10/20/2011 | US20110256706 Method of forming a semiconductor structure |
10/20/2011 | US20110256705 Method for forming a split gate device |
10/20/2011 | US20110256704 Method for manufacturing a metal gate electrode/high k dielectric gate stack |
10/20/2011 | US20110256703 Semiconductor device and method of fabricating the same |