H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2011
10/25/2011	US8043942 Method for producing core-shell nanowires, nanowires produced by the method and nanowire device comprising the nanowires
10/25/2011	US8043941 Laser processing method and chip
10/25/2011	US8043940 Method for manufacturing semiconductor chip and semiconductor device
10/25/2011	US8043939 Method for manufacturing semiconductor wafer
10/25/2011	US8043938 Method for manufacturing SOI substrate and SOI substrate
10/25/2011	US8043937 Method for manufacturing semiconductor substrate
10/25/2011	US8043936 Method for manufacturing semiconductor device
10/25/2011	US8043935 Method for manufacturing semiconductor substrate and method for manufacturing semiconductor device
10/25/2011	US8043934 Methods of use and formation of a lateral bipolar transistor with counter-doped implant regions under collector and/or emitter regions
10/25/2011	US8043933 Integration sequences with top surface profile modification
10/25/2011	US8043932 Method of fabricating semiconductor device
10/25/2011	US8043931 Methods for forming multi-layer silicon structures
10/25/2011	US8043930 Semiconductor memory device and method of manufacturing the same
10/25/2011	US8043929 Semiconductor substrate and method for production thereof
10/25/2011	US8043928 Efficient provision of alignment marks on semiconductor wafer
10/25/2011	US8043927 Method of manufacturing a CMOS image sensor
10/25/2011	US8043926 Nonvolatile memory devices including oxygen-deficient metal oxide layers and methods of manufacturing the same
10/25/2011	US8043925 Method of forming capacitor of semiconductor memory device
10/25/2011	US8043924 Methods of forming phase-change memory units, and methods of manufacturing phase-change memory devices using the same
10/25/2011	US8043923 Method of manufacturing semiconductor device
10/25/2011	US8043922 Method of fabricating semiconductor device
10/25/2011	US8043921 Nitride removal while protecting semiconductor surfaces for forming shallow junctions
10/25/2011	US8043920 finFETS and methods of making same
10/25/2011	US8043919 Method of fabricating semiconductor device
10/25/2011	US8043918 Semiconductor device and its manufacturing method
10/25/2011	US8043917 Method for manufacturing semiconductor device
10/25/2011	US8043916 Method of fabricating semiconductor device having multiple gate insulating layer
10/25/2011	US8043915 Pitch multiplied mask patterns for isolated features
10/25/2011	US8043914 Methods of fabricating flash memory devices comprising forming a silicide on exposed upper and side surfaces of a control gate
10/25/2011	US8043913 Method of forming trench-gate field effect transistors
10/25/2011	US8043912 Manufacturing method of a semiconductor device having polycide wiring layer
10/25/2011	US8043911 Methods of forming semiconductor constructions
10/25/2011	US8043910 Integrated semiconductor structure including a heterojunction bipolar transistor and a Schottky diode
10/25/2011	US8043909 Porous semiconductive film and process for its production
10/25/2011	US8043908 Method of fabricating memory
10/25/2011	US8043907 Atomic layer deposition processes for non-volatile memory devices
10/25/2011	US8043906 Method of forming a III-nitride selective current carrying device including a contact in a recess
10/25/2011	US8043905 Semiconductor device and method of fabricating the same
10/25/2011	US8043904 Semiconductor manufacturing method and semiconductor device
10/25/2011	US8043903 Method of manufacturing semiconductor device
10/25/2011	US8043902 Semiconductor device and manufacturing method thereof
10/25/2011	US8043901 Method for manufacturing display device
10/25/2011	US8043900 Semiconductor integrated circuit device and a method of manufacturing the same
10/25/2011	US8043899 Photosensitive resin composition
10/25/2011	US8043898 Method of manufacturing semiconductor package with etch removal of carrier frame and base plating layer
10/25/2011	US8043897 Method for forming micro-electro-mechanical system (MEMS) package
10/25/2011	US8043896 Semiconductor chip, method of manufacturing the semiconductor chip and semiconductor chip package including an inclined via hole
10/25/2011	US8043895 Method of fabricating stacked assembly including plurality of stacked microelectronic elements
10/25/2011	US8043894 Integrated circuit package system with redistribution layer
10/25/2011	US8043893 Thermo-compression bonded electrical interconnect structure and method
10/25/2011	US8043891 Method of encapsulating a wafer level microdevice
10/25/2011	US8043890 Process for separating disk-shaped substrates with the use of adhesive powers
10/25/2011	US8043889 Patterned chemical bath deposition of a textured thin film from a printed seed layer
10/25/2011	US8043888 Phase change memory cell with heater and method therefor
10/25/2011	US8043886 Methods for manufacturing a contact grid on a photovoltaic cell
10/25/2011	US8043885 Method of manufacturing semiconductor film and method of manufacturing photovoltaic element
10/25/2011	US8043884 Methods of seamless gap filling
10/25/2011	US8043883 Method for manufacturing solid-state imaging device having improved sensitivity and reduced flare
10/25/2011	US8043882 Method of making microminiature moving device
10/25/2011	US8043880 Microelectronic device
10/25/2011	US8043879 Semiconductor light emitting device manufacture method
10/25/2011	US8043878 Method for manufacturing high efficiency light-emitting diodes
10/25/2011	US8043877 Electro-optic integrated circuits and methods for the production thereof
10/25/2011	US8043876 Light emitting diode package and manufacturing method thereof
10/25/2011	US8043874 Method for coating semiconductor device using droplet deposition
10/25/2011	US8043872 Epitaxial material used for GaN based LED with low polarization effect and manufacturing method thereof
10/25/2011	US8043871 Method for forming oxide film on silicon wafer
10/25/2011	US8043870 CMP pad thickness and profile monitoring system
10/25/2011	US8043798 Method of forming fine patterns
10/25/2011	US8043792 Composition for formation of antireflection film and pattern formation method using the same
10/25/2011	US8043772 Manufacturing method and manufacturing system of semiconductor device
10/25/2011	US8043771 Phase shift mask blank and method of manufacturing phase shift mask
10/25/2011	US8043770 Photomask and method of forming overlay vernier of semiconductor device using the same
10/25/2011	US8043709 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
10/25/2011	US8043521 Processing apparatus
10/25/2011	US8043520 Method for manufacturing porous structure and method for forming pattern
10/25/2011	US8043484 Methods and apparatus for resputtering process that improves barrier coverage
10/25/2011	US8043472 Substrate processing apparatus and focus ring
10/25/2011	US8043471 Plasma processing apparatus
10/25/2011	US8043470 Electrode/probe assemblies and plasma processing chambers incorporating the same
10/25/2011	US8043469 Substrate processing method, substrate processing apparatus, and storage medium
10/25/2011	US8043468 Apparatus for and method of processing substrate
10/25/2011	US8043467 Liquid processing apparatus and liquid processing method
10/25/2011	US8043466 Etching apparatus
10/25/2011	US8043462 Methods for forming gas barriers on electronic devices
10/25/2011	US8043438 Device for cleaning CVD device and method of cleaning CVD device
10/25/2011	US8043432 Atomic layer deposition systems and methods
10/25/2011	US8043431 Substrate processing apparatus and method for manufacturing a semiconductor device
10/25/2011	US8043200 Method and storage medium for replacing process instrument in processing apparatus
10/25/2011	US8043140 Wafer polishing apparatus and wafer polishing method
10/25/2011	US8043039 Substrate treatment apparatus
10/25/2011	US8042727 Heater, reflow apparatus, and solder bump forming method and apparatus
10/25/2011	US8042724 Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate
10/25/2011	US8042267 Method for producing microsystems
10/20/2011	WO2011130717A2 Forming functionalized carrier structures with coreless packages
10/20/2011	WO2011130693A2 Method for fabricating through-substrate microchannels
10/20/2011	WO2011130586A2 Improved debonding equipment and methods for debonding temporary bonded wafers
10/20/2011	WO2011130397A2 Improved silicon nitride films and methods
10/20/2011	WO2011130326A2 Plasma activated conformal film deposition
10/20/2011	WO2011130252A2 Ball-grid array device having chip assembled on half-etched metal leadframe

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