Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2011
10/18/2011US8039349 Methods for fabricating non-planar semiconductor devices having stress memory
10/18/2011US8039348 Vertical gated access transistor
10/18/2011US8039347 Semiconductor device having vertically aligned pillar structures that have flat side surfaces and method for manufacturing the same
10/18/2011US8039346 Insulated gate silicon carbide semiconductor device and method for manufacturing the same
10/18/2011US8039345 Methods of forming semiconductor devices
10/18/2011US8039344 Methods of forming a capacitor structure and methods of manufacturing a semiconductor device using the same
10/18/2011US8039343 Scratch protection for direct contact sensors
10/18/2011US8039341 Selective uniaxial stress modification for use with strained silicon on insulator integrated circuit
10/18/2011US8039340 Methods of forming an array of memory cells, methods of forming a plurality of field effect transistors, methods of forming source/drain regions and isolation trenches, and methods of forming a series of spaced trenches into a substrate
10/18/2011US8039339 Separate layer formation in a semiconductor device
10/18/2011US8039338 Method for reducing defects of gate of CMOS devices during cleaning processes by modifying a parasitic PN junction
10/18/2011US8039337 Nonvolatile memory device with multiple blocking layers and method of fabricating the same
10/18/2011US8039336 Semiconductor device and method of fabrication thereof
10/18/2011US8039335 Semiconductor device comprising NMOS and PMOS transistors with embedded Si/Ge material for creating tensile and compressive strain
10/18/2011US8039334 Shared gate for conventional planar device and horizontal CNT
10/18/2011US8039333 Semiconductor device and method of fabricating the same
10/18/2011US8039332 Method of manufacturing a buried-gate semiconductor device and corresponding integrated circuit
10/18/2011US8039331 Opto-thermal annealing methods for forming metal gate and fully silicided gate-field effect transistors
10/18/2011US8039330 Method for manufacturing semiconductor device
10/18/2011US8039329 Field effect transistor having reduced contact resistance and method for fabricating the same
10/18/2011US8039328 Trench Schottky device with single barrier
10/18/2011US8039327 Transistor forming methods
10/18/2011US8039326 Methods for fabricating bulk FinFET devices having deep trench isolation
10/18/2011US8039325 Methods of fabricating semiconductor device having capacitorless one-transistor memory cell
10/18/2011US8039324 Image sensor and method of fabricating the same
10/18/2011US8039323 Semiconductor device and manufacturing method thereof
10/18/2011US8039322 Semiconductor device and manufacturing method thereof
10/18/2011US8039321 Electrical fuse, semiconductor device having the same, and method of programming and reading the electrical fuse
10/18/2011US8039320 Optimized circuit design layout for high performance ball grid array packages
10/18/2011US8039319 Method for fabricating QFN semiconductor package
10/18/2011US8039318 System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices
10/18/2011US8039316 Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof
10/18/2011US8039315 Thermally enhanced wafer level package
10/18/2011US8039314 Metal adhesion by induced surface roughness
10/18/2011US8039313 Method for producing a semiconductor device including connecting a functional wafer to a carrier substrate and selectively etching the carrier substrate
10/18/2011US8039312 Method for forming a capped micro-electro-mechanical system (MEMS) device
10/18/2011US8039311 Leadless semiconductor chip carrier system
10/18/2011US8039310 Method of manufacturing semiconductor device with improved design freedom of external terminal
10/18/2011US8039309 Systems and methods for post-circuitization assembly
10/18/2011US8039308 Integrated-circuit package for proximity communication
10/18/2011US8039306 3D integration of vertical components in reconstituted substrates
10/18/2011US8039305 Method for bonding semiconductor wafers and method for manufacturing semiconductor device
10/18/2011US8039304 Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structures
10/18/2011US8039303 Method of forming stress relief layer between die and interconnect structure
10/18/2011US8039302 Semiconductor package and method of forming similar structure for top and bottom bonding pads
10/18/2011US8039301 Gate after diamond transistor
10/18/2011US8039299 Method for fabricating an integrated circuit including resistivity changing material having a planarized surface
10/18/2011US8039298 Phase changeable memory cell array region and method of forming the same
10/18/2011US8039297 Plasma treating methods of fabricating phase change memory devices, and memory devices so fabricated
10/18/2011US8039293 Method of manufacturing photoelectric conversion device
10/18/2011US8039292 Holey electrode grids for photovoltaic cells with subwavelength and superwavelength feature sizes
10/18/2011US8039291 Demounting of inverted metamorphic multijunction solar cells
10/18/2011US8039290 Method of making photovoltaic cell
10/18/2011US8039289 Diffusion furnaces employing ultra low mass transport systems and methods of wafer rapid diffusion processing
10/18/2011US8039288 Semiconductor device and manufacturing method thereof
10/18/2011US8039286 Method for fabricating optical device
10/18/2011US8039285 Thin film getter protection
10/18/2011US8039284 Dual metal silicides for lowering contact resistance
10/18/2011US8039283 Nitride compound semiconductor element and method for manufacturing same
10/18/2011US8039282 Semiconductor optical device and method of fabricating the same
10/18/2011US8039280 Light emitting diode and method of fabricating the same
10/18/2011US8039279 Method for making a light emitting diode by electroless plating
10/18/2011US8039277 Providing current control over wafer borne semiconductor devices using overlayer patterns
10/18/2011US8039276 Manufacturing method of semiconductor device
10/18/2011US8039275 Integrated circuit packaging system with rounded interconnect and method of manufacture thereof
10/18/2011US8039274 Multi-chip package semiconductor device and method of detecting a failure thereof
10/18/2011US8039203 Integrated circuits and methods of design and manufacture thereof
10/18/2011US8039200 Photosensitive composition and pattern-forming method using the photosensitive composition
10/18/2011US8039180 Scattering bar OPC application method for sub-half wavelength lithography patterning
10/18/2011US8039178 Manufacturing method of transparent substrate for mask blanks, manufacturing method of mask blanks, manufacturing method of exposure masks, manufacturing method of semiconductor devices, manufacturing method of liquid crystal display devices, and defect correction method of exposure masks
10/18/2011US8039177 Method of correcting a flare and computer program product
10/18/2011US8039054 Layer deposition methods
10/18/2011US8039043 Method of forming resistance film
10/18/2011US8038909 Forming active material of copper/indium/gallium/selenium or sulfur as ink for solar cells by reacting a solution of non-oxide compounds and capping agent; annealing to form nanoparticles 1-500nm diameter; narrow size distribution; close packing; uniformity; polycrystalline; quality; high quality films
10/18/2011US8038898 Abrasive liquid for metal and method for polishing
10/18/2011US8038890 Piezoelectric-driven MEMS device and method for manufacturing the same
10/18/2011US8038863 Composite stamper for imprint lithography
10/18/2011US8038857 Thin film transistor, thin film transistor substrate, processes for producing the same, liquid crystal display using the same, and related devices and processes; and sputtering target, transparent electroconductive film formed by use of this, transparent electrode, and related devices and processes
10/18/2011US8038856 Method and apparatus for fluid processing a workpiece
10/18/2011US8038839 Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
10/18/2011US8038838 Spin head, method of operating the spin head and apparatus for treating substrates with the spin head
10/18/2011US8038837 Ring-shaped component for use in a plasma processing, plasma processing apparatus and outer ring-shaped member
10/18/2011US8038836 Plasma processing apparatus
10/18/2011US8038835 Processing device, electrode, electrode plate, and processing method
10/18/2011US8038834 Method and system for controlling radical distribution
10/18/2011US8038833 Plasma processing apparatus
10/18/2011US8038831 Radio frequency identification device support for passport and its manufacturing method
10/18/2011US8038796 Apparatus for spatial and temporal control of temperature on a substrate
10/18/2011US8038752 Metal ion-containing CMP composition and method for using the same
10/18/2011US8038497 Methods of fabricating light emitting devices by selective deposition of light conversion materials based on measured emission characteristics
10/18/2011US8038496 Method of manufacturing a light emitting device and using an electrode layer as a mask during manufacturing
10/18/2011US8038136 Hand having rocking mechanism and substrate delivering device having the same
10/18/2011US8037891 Two-fluid nozzle for cleaning substrate and substrate cleaning apparatus
10/18/2011US8037878 Method for slicing workpiece by using wire saw and wire saw
10/18/2011CA2544209C Cleaning solutions and etchants and methods for using same
10/18/2011CA2502717C Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit
10/13/2011WO2011127258A1 Fabrication of large-area hexagonal boron nitride thin films
10/13/2011WO2011127183A2 Memomy programming methods and memory programming devices
10/13/2011WO2011127122A2 Titanium-containing precursors for vapor deposition
10/13/2011WO2011127041A1 Selective patterning for low cost through vias