H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2011
11/23/2011	CN102254893A Quadrilateral flat leadless package with double convex points and production method thereof
11/23/2011	CN102254891A Flip chip packaging structure and manufacturing method thereof
11/23/2011	CN102254890A Stacked semiconductor package and method for manufacturing the same
11/23/2011	CN102254889A High-power semiconductor device and packaging method thereof
11/23/2011	CN102254888A Manufacturing method of printed circuit board unit, manufacturing apparatus thereof, manufacturing method of electronic component, and electronic component
11/23/2011	CN102254887A Semiconductor device structure and manufacturing method thereof
11/23/2011	CN102254885A Passive device, passive device-embedded circuit board and manufacturing method
11/23/2011	CN102254883A Component welding structure and welding method thereof
11/23/2011	CN102254880A Chip packaging device and manufacturing method thereof
11/23/2011	CN102254879A Controlled silicon for large-size silicon chip employing plastic entity package and packaging process thereof
11/23/2011	CN102254875A Ceramic package and manufacturing method thereof
11/23/2011	CN102254872A Semiconductor structure and method of forming semiconductor component
11/23/2011	CN102254871A Semiconductor eevice and manufacturing method thereof
11/23/2011	CN102254870A Integrated circuit element, forming method thereof and packaging assembly
11/23/2011	CN102254868A Method for fabricating chip elements provided with wire insertion grooves
11/23/2011	CN102254867A Flash memory manufacturing method
11/23/2011	CN102254866A Method for forming semiconductor structure
11/23/2011	CN102254865A Ic component production method
11/23/2011	CN102254864A Method for manufacturing phase change memory element
11/23/2011	CN102254863A Breaking apparatus and breaking method for substrate made of brittle materials
11/23/2011	CN102254862A Semiconductor device manufacturing method
11/23/2011	CN102254861A Manufacturing methods of thin film transistor matrix substrate and display panel
11/23/2011	CN102254860A Method for manufacturing thin film transistor
11/23/2011	CN102254859A Method for manufacturing metal oxide semiconductor integrated circuit comprising Zener diode
11/23/2011	CN102254858A Process for fabricating semiconductor devices and a semiconductor device comprising a chip with through-vias
11/23/2011	CN102254857A Semiconductor process and structure
11/23/2011	CN102254856A Semiconductor device used in interconnection technology and manufacturing method thereof
11/23/2011	CN102254855A Method of pre-metal dielectric (PMD) stress recovery
11/23/2011	CN102254854A Forming method of double-trench isolation structure
11/23/2011	CN102254853A Dual-shallow trench isolation structure forming method
11/23/2011	CN102254852A Thimble cap of die bonder
11/23/2011	CN102254851A Vacuum type chuck device having nitrogen protection
11/23/2011	CN102254850A Method of manufacturing super-junction semiconductor device
11/23/2011	CN102254849A Loading interlocking device in preparation process of semiconductor device
11/23/2011	CN102254848A Substrate processing apparatus and substrate processing method
11/23/2011	CN102254847A Plamsa processing apparatus
11/23/2011	CN102254846A Method for simulating resistance of metal silicide layer in semiconductor device
11/23/2011	CN102254845A Method for detecting bottom outline of contact plug
11/23/2011	CN102254844A Memory chip bit line failure analysis method
11/23/2011	CN102254843A Method for metalizing back of semiconductor chip applied to eutectic packaging
11/23/2011	CN102254842A Activation treatments in plating processes
11/23/2011	CN102254841A Air duct device
11/23/2011	CN102254840A Semiconductor device and manufacture method thereof
11/23/2011	CN102254839A Simple out-core integration method for integrated circuit and novel frame
11/23/2011	CN102254838A Novel integrated circuit (IC) package manufacturing process
11/23/2011	CN102254837A Packaging process of electronic tag inversely stuck sheet packaging production line
11/23/2011	CN102254836A Manufacturing method of electronic device package, electronic device package, and oscillator
11/23/2011	CN102254835A Semiconductor device and the manufacturing method thereof
11/23/2011	CN102254834A Semiconductor packaging structure and method thereof
11/23/2011	CN102254833A Light-emitting diode encapsulating procedure
11/23/2011	CN102254832A Ceramic substrate manufacturing method
11/23/2011	CN102254831A High-precision ceramic substrate process
11/23/2011	CN102254830A DEPMOS (Drain Expansion P-type Metal Oxide Semiconductor) transistor and forming method thereof
11/23/2011	CN102254829A Preparation method of SiGe buffer layer with high relaxivity
11/23/2011	CN102254828A Method for making semiconductor device with super junction structure and rapid reverse recovery characteristic
11/23/2011	CN102254827A Method of manufacturing super-junction semiconductor device
11/23/2011	CN102254826A Bi-grid oxide groove mosfet and three or four mask process with passage stop groove
11/23/2011	CN102254825A Method for fabricating a shallow and narrow trench fet and related structures
11/23/2011	CN102254824A Semiconductor device and forming method thereof
11/23/2011	CN102254823A Lateral double diffusion metal oxide silicon (LDMOS) transistor and method for making same
11/23/2011	CN102254822A Method for manufacturing power semiconductor device
11/23/2011	CN102254821A Metal oxide semiconductor (MOS) capacitor based on silicon-on-insulator (SOI) material and method for making MOS capacitor
11/23/2011	CN102254820A Semiconductor device manufacturing method
11/23/2011	CN102254819A Low gate charging metal oxide semiconductor positive-negative (P-N) junction diode structure and method for making same
11/23/2011	CN102254818A Semiconductor junction diode device and method for manufacturing same
11/23/2011	CN102254817A Manufacturing method for trench and manufacturing method of semiconductor device
11/23/2011	CN102254816A Method for improving surface performance of reclaiming wafer and method for depositing SiOx thin film on reclaiming wafer
11/23/2011	CN102254815A Etching method for conducting layer during preparation of semiconductor device
11/23/2011	CN102254814A Silicon oxide selective etching solution, preparation method and application thereof
11/23/2011	CN102254813A 等离子体蚀刻方法 The plasma etching method
11/23/2011	CN102254812A Dry etching method
11/23/2011	CN102254811A Etching method of oxidation layer of wafer to reduce etching residues
11/23/2011	CN102254810A Method for removing photo resistor during preparation of semiconductor device
11/23/2011	CN102254809A Dry etching method for patterned sapphire substrate
11/23/2011	CN102254808A Method for reducing line edge roughness (LER) and device for implementing method
11/23/2011	CN102254807A Silicon film formation method and silicon film formation apparatus
11/23/2011	CN102254806A Method for double-grid oxide layer in BCD (Bipolar, COMS and DMOS) process
11/23/2011	CN102254805A Method for adjusting work function of metal gate applied to N-channel metal oxide semiconductor (NMOS) device
11/23/2011	CN102254804A Method for preparing trench type power MOS (Metal Oxide Semiconductor) transistor
11/23/2011	CN102254803A Method for manufacturing resistive type memory
11/23/2011	CN102254802A Method for forming high electron mobility transistor
11/23/2011	CN102254801A Method for controlling doping density of doped region of semiconductor device accurately
11/23/2011	CN102254800A Epitaxial growth method for gallium nitride (GaN)-based quantum dots
11/23/2011	CN102254799A Method for preparing AZO antireflective film of solar cell
11/23/2011	CN102254798A Method for manufacturing silicon carbide PIN microstructure
11/23/2011	CN102254797A Low-temperature polysilicon membrane and manufacturing method thereof, transistor and display device
11/23/2011	CN102254796A Method for forming alternative arrangement of P-type and N-type semiconductor thin layers
11/23/2011	CN102254795A Preparation method of one-dimensional scale limited graphene nano band
11/23/2011	CN102254794A Manufacturing method and process adjusting method for laminated wafer
11/23/2011	CN102254793A Double-layer quartz groove for cleaning silicon wafer
11/23/2011	CN102254792A Die peeling device with safety push-up pin
11/23/2011	CN102254791A Load lock chamber with decoupled slit valve door seal compartment
11/23/2011	CN102254790A Vertical laminar flow system of microenvironment
11/23/2011	CN102254789A Stripping method and stripping solution
11/23/2011	CN102254788A Manufacturing execution system and manufacturing system having virtual measuring function
11/23/2011	CN102254787A Semiconductor chip separation device and method
11/23/2011	CN102254786A Method for analyzing and checking local pattern density of chip
11/23/2011	CN102254777A Substrate processing apparatus
11/23/2011	CN102254764A Bearing device of component
11/23/2011	CN102254763A Manufacturing method of hermetic container and image display apparatus

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