Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2011
11/16/2011CN102242025A Cleaning composition, method for producing semiconductor device, and cleaning method
11/16/2011CN102241844A Composite dielectric material and preparation method thereof
11/16/2011CN102240976A Chemically mechanical polishing grinding fluid conveying system and chemically mechanical polishing grinding device
11/16/2011CN102240962A Conditioner of chemical mechanical polishing apparatus and conditioning method
11/16/2011CN102240927A Method for performing chemically mechanical polishing by using chemically mechanical polishing equipment
11/16/2011CN102240626A Counterforce offsetting device and pasting machine having the device
11/16/2011CN101911297B Semiconductor constructions, NAND unit cells, methods of forming semiconductor constructions, and methods of forming NAND unit cells
11/16/2011CN101905859B Method for preparing wafer-level uniform-dimension glass microcavity by positive pressure thermal forming
11/16/2011CN101882591B Detection method of wafer
11/16/2011CN101882575B Method for manufacturing ohmic contact on SiC matrix for preventing transverse spreading of metal
11/16/2011CN101866933B Two-end structure MF/LF simultaneous response quantum well infrared detector and manufacturing method thereof
11/16/2011CN101833243B Resist composition, method for forming resist pattern, and semiconductor device and method for manufacturing the same
11/16/2011CN101828257B Aluminum ribbon for ultrasonic bonding
11/16/2011CN101817498B Method for preparing low-pollution high-yield wafer-level uniform-size glass micro-cavity
11/16/2011CN101812711B Plating apparatus
11/16/2011CN101812675B Vacuum processing apparatus
11/16/2011CN101807536B Substrate conveying apparatus and substrate processing system
11/16/2011CN101804961B Method for performing hermetic package by using spherical glass micro-cavity
11/16/2011CN101789435B Super structure based on vertical gate SOI CMOS device and manufacturing method thereof
11/16/2011CN101783279B Method for spearing two materials
11/16/2011CN101758565B Bonding device of direction-finder
11/16/2011CN101752368B Standard cell architecture and methods with variable design rules
11/16/2011CN101711429B Substrate transport apparatus with multiple independently movable articulated arms
11/16/2011CN101702949B Apparatus and method for ultrasonic wet treatment of plate-like articles
11/16/2011CN101699619B Formation method of a semiconductor device
11/16/2011CN101699616B Channel MOS P-N junction Schottky diode structure and manufacturing method thereof
11/16/2011CN101685847B Light emitting device and manufacturing method therefor
11/16/2011CN101685785B Window-type press board
11/16/2011CN101681836B Method for pretreating inner space of chamber in plasma nitridation, plasma processing method and plasma processing apparatus
11/16/2011CN101678533B Synthetic grindstone
11/16/2011CN101673755B Phase change memory cell utilizing composite structure diode and preparation method thereof
11/16/2011CN101669192B Mems devices with an etch stop layer
11/16/2011CN101667579B Configurations and methods for manufacturing charge balanced devices
11/16/2011CN101663925B 电子电路装置 Electronic circuit means
11/16/2011CN101656208B Method for selectively removing TaN metal gate electrode layer
11/16/2011CN101655645B Masking film for sequential lateral solidification (SLS) technology and laser crystallization method
11/16/2011CN101641776B 半导体器件 Semiconductor devices
11/16/2011CN101641272B Conveyor, and film-forming apparatus and maintenance method thereof
11/16/2011CN101630690B Display device and method for manufacturing thereof
11/16/2011CN101625997B Dummy pattern design for reducing device performance drift
11/16/2011CN101611468B Folded package camera module and method of manufacture
11/16/2011CN101604701B Light emitting diode having a thermal conductive substrate and method of fabricating the same
11/16/2011CN101578696B Dynamic pad size to reduce solder fatigue
11/16/2011CN101529566B Method for forming wiring film, transistor, and electronic device
11/16/2011CN101527259B Substrate processing method, computer storage medium and substrate processing system
11/16/2011CN101523511B Composition for electrode formation and method for forming electrode by using the composition
11/16/2011CN101512726B Efficient pitch multiplication process
11/16/2011CN101483180B Liquid crystal display device
11/16/2011CN101471361B Image sensor and method for manufacturing the sensor
11/16/2011CN101465324B Technological method for implementing three-dimensional stereostructure phase-change storage chip
11/16/2011CN101465322B Method of manufacturing organic light-emitting device
11/16/2011CN101465300B LED optical strip and method of manufacturing the same
11/16/2011CN101454896B Flexible joint methodology to attach a die on an organic substrate
11/16/2011CN101454894B Engineering strain in thick strained-soi substrates
11/16/2011CN101447442B Method for making a device including placing a semiconductor chip on a substrate
11/16/2011CN101436607B Electric resistance transition memory and manufacturing method thereof
11/16/2011CN101436595B Integrated memory device, integrated memory chip and method for processing such memory chip
11/16/2011CN101432846B Method for bonding a semiconductor substrate to a metal substrate
11/16/2011CN101431005B Controlled annealing method
11/16/2011CN101414575B Method for processing silicon-based liquid crystal metal routing
11/16/2011CN101409266B Package structure
11/16/2011CN101404243B Processing system for process object and thermal processing method for process object
11/16/2011CN101398627B Coating treatment method, coating treatment apparatus, and computer-readable storage medium
11/16/2011CN101388371B Semiconductor device, display device and manufacture method thereof
11/16/2011CN101379592B Semiconductor production plant
11/16/2011CN101371348B Germanium on glass and glass-ceramic structures
11/16/2011CN101359583B Plasma processing apparatus of batch type
11/16/2011CN101351815B Manufacturing method and device for making an in-mold circuit comprising a chip
11/16/2011CN101345230B Integrated circuit structure and its forming method
11/16/2011CN101337227B Method for cleaning semiconductor chip using cleaning solution
11/16/2011CN101320733B Semiconductor device and manufacturing method thereof
11/16/2011CN101299431B Display panel and method for producing thin-film transistor substrate
11/16/2011CN101281922B Solid-state image capturing apparatus, method for manufacturing the same, and electronic information device
11/16/2011CN101278239B Process for producing substrate with metal wiring
11/16/2011CN101266984B Semiconductor device and method of manufacturing the same
11/16/2011CN101266918B Method for manufacturing semiconductor device
11/16/2011CN101234704B Electronic component transfer loading device and method
11/16/2011CN101233618B Semiconductor device and method of manufacturing the same
11/16/2011CN101207945B Heating device
11/16/2011CN101192003B Photocurable organic material and method of fabricating array substrate for liquid crystal display device using the same
11/16/2011CN101187056B Production method of p-doped epitaxial coated silicon semiconductor wafers
11/16/2011CN101166583B Methods and apparatus for determining the endpoint of a cleaning or conditioning process in a plasma processing system
11/16/2011CN101156236B 倒装片安装方法及凸块形成方法 Flip-chip mounting method and a bump forming method
11/16/2011CN101151721B Method of fabricating insulating layer and device of processing semiconductor device
11/16/2011CN101144972B 掩模坯板和掩模 Mask blanks and masks
11/16/2011CN101127349B Plastic overmolded packages with mechanically decoupled lid attach attachment
11/16/2011CN101107695B Transparent conductive film deposition apparatus, multilayer transparent conductive film continuously deposition apparatus and method of film deposition therewith
11/16/2011CN101100743B Metal organic chemical vapor deposition equipment
11/16/2011CN101080467B Actinic energy ray curable resion composition and use thereof
11/16/2011CN101064294B Circuit device and method for manufacturing circuit device
11/16/2011CN101044604B Novel polyorganosiloxane dielectric materials
11/16/2011CN101036233B Semiconductor component
11/16/2011CN101017786B Manufacturing method of semiconductor package
11/15/2011US8060244 Substrate processing apparatus and carrier adjusting system
11/15/2011US8059269 Particle inspection apparatus, exposure apparatus, and device manufacturing method
11/15/2011US8059262 Calculation program, and exposure method for calculating light intensity distribution formed on image plane
11/15/2011US8059261 Masking device, lithographic apparatus, and device manufacturing method
11/15/2011US8059078 Semiconductor device, and display device and electronic device utilizing the same
11/15/2011US8059076 Display panel, mask and method of manufacturing the same
11/15/2011US8058735 Wafer-level chip scale package having stud bump and method for fabricating the same