Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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11/17/2011 | WO2011071966A3 Cross-point diode arrays and methods of manufacturing cross-point diode arrays |
11/17/2011 | WO2011069054A3 Phonon-enhanced crystal growth and lattice healing |
11/17/2011 | WO2011063084A3 Electrostatic chuck with reduced arcing |
11/17/2011 | WO2011062453A3 Device for inspecting bonded wafer using laser |
11/17/2011 | WO2011060090A3 Multilayer growth by gas phase deposition |
11/17/2011 | WO2011047359A3 Method and apparatus including nanowire structure |
11/17/2011 | WO2011016741A3 Amorphous multicomponent dielectric based on the mixture of high band gap and high k materials, respective devices and manufacture |
11/17/2011 | WO2010142683A4 Method for forming thin semiconductor layer substrates and method for producing a semiconductor element, in particular a solar cell comprising, using said type of semiconductor layer substrate |
11/17/2011 | WO2010104610A8 Stacked microelectronic assembly with microelectronic elements having vias extending through bond pads |
11/17/2011 | US20110282484 Substrate positioning apparatus, substrate processing apparatus, substrate positioning method, and computer readable medium having a program stored thereon |
11/17/2011 | US20110282421 Diamond neural devices and associated methods |
11/17/2011 | US20110281509 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure |
11/17/2011 | US20110281504 Grinding method for workpiece having a plurality of bumps |
11/17/2011 | US20110281443 Film formation method and film formation apparatus |
11/17/2011 | US20110281442 Methods and apparatus for forming nitrogen-containing layers |
11/17/2011 | US20110281441 Process of Localized Electrografting onto Photosensitive Semiconductor Substrates |
11/17/2011 | US20110281440 Methods for nitridation and oxidation |
11/17/2011 | US20110281439 Applying wafer backside coatings to semiconductor wafers |
11/17/2011 | US20110281438 Pulsed bias plasma process to control microloading |
11/17/2011 | US20110281437 Method of manufacturing a semiconductor device |
11/17/2011 | US20110281436 Cleaning composition, method for producing semiconductor device, and cleaning method |
11/17/2011 | US20110281435 Fast gas switching plasma processing apparatus |
11/17/2011 | US20110281434 Methods of Forming Patterned Photoresist Layers Over Semiconductor Substrates |
11/17/2011 | US20110281433 Etching method using an at least semi-solid media |
11/17/2011 | US20110281432 Fluorine depleted adhesion layer for metal interconnect structure |
11/17/2011 | US20110281431 Method of patterning thin metal films |
11/17/2011 | US20110281430 Wafer level package and method of manufacturing the same |
11/17/2011 | US20110281429 Multi-Layer Charge Trap Silicon Nitride/Oxynitride Layer Engineering with Interface Region Control |
11/17/2011 | US20110281428 Method of fabricating semiconductor device |
11/17/2011 | US20110281427 Method of fabricating semiconductor device |
11/17/2011 | US20110281426 Semiconductor device and method of forming the same |
11/17/2011 | US20110281425 Method of manufacturing semiconductor device |
11/17/2011 | US20110281424 Relaxed InGaN/AlGaN Templates |
11/17/2011 | US20110281423 Method of producing semiconductor wafer and semiconductor wafer |
11/17/2011 | US20110281422 Method for obtaining high-quality boundary for semiconductor devices fabricated on a partitioned substrate |
11/17/2011 | US20110281421 Process for producing powders of germanium |
11/17/2011 | US20110281420 Method for manufacturing soi wafer |
11/17/2011 | US20110281419 Method for manufacturing dielectric isolation type semiconductor device |
11/17/2011 | US20110281418 Semiconductor memory device and method for manufacturing the same |
11/17/2011 | US20110281417 Vapor deposition of silicon dioxide nanolaminates |
11/17/2011 | US20110281416 Manufacturing method of semiconductor device |
11/17/2011 | US20110281415 Methods of forming an isolation layer and methods of manufacturing semiconductor devices having an isolation layer |
11/17/2011 | US20110281414 Semiconductor processing |
11/17/2011 | US20110281413 Contact hole, semiconductor device and method for forming the same |
11/17/2011 | US20110281412 Production of a transistor gate on a multibranch channel structure and means for isolating this gate from the source and drain regions |
11/17/2011 | US20110281411 Method for manufacturing semiconductor device |
11/17/2011 | US20110281410 Method for fabricating a semiconductor device having an epitaxial channel and transistor having same |
11/17/2011 | US20110281409 Semiconductor Structures Using Replacement Gate and Methods of Manufacture |
11/17/2011 | US20110281408 Method of manufacturing a semiconductor device |
11/17/2011 | US20110281407 Strained semiconductor by full wafer bonding |
11/17/2011 | US20110281406 Semiconductor device manufacturing method |
11/17/2011 | US20110281405 Method of fabricating a semiconductor device and semiconductor device |
11/17/2011 | US20110281404 Method of sealing a semiconductor element with an epoxy resin composition |
11/17/2011 | US20110281403 Method For Encapsulating Semiconductor Dies |
11/17/2011 | US20110281402 Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region |
11/17/2011 | US20110281401 Semiconductor device manufacturing method |
11/17/2011 | US20110281400 Near chip scale semiconductor packages |
11/17/2011 | US20110281399 Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
11/17/2011 | US20110281398 Thin quad flat package with no leads (qfn) fabrication methods |
11/17/2011 | US20110281397 Method for manufacturing a semiconductor component and structure therefor |
11/17/2011 | US20110281396 Stacked electronic component and manufacturing method thereof |
11/17/2011 | US20110281395 Self-assembly of micro-structures |
11/17/2011 | US20110281394 Method for manufacturing semiconductor device |
11/17/2011 | US20110281389 Micromachine and Method for Manufacturing the Same |
11/17/2011 | US20110281385 Liquid crystal display device and method of manufacturing the same |
11/17/2011 | US20110281384 Method of manufacturing thin film transistor and method of manufacturing flat panel display using the same |
11/17/2011 | US20110281382 Nitride-based semiconductor device and method of fabricating the same |
11/17/2011 | US20110281380 Probe card and method of manufacturing semiconductor integrated circuit device |
11/17/2011 | US20110281379 Methods of forming conductive layer patterns using gas phase cleaning process and methods of manufacturing semiconductor devices |
11/17/2011 | US20110281378 Ultrasonic system for measuring gas velocity |
11/17/2011 | US20110281377 Method for separating and transferring ic chips |
11/17/2011 | US20110281376 Substrate processing apparatus, substrate processing method and storage medium recording program |
11/17/2011 | US20110281375 Magnetic microelectronic device attachment |
11/17/2011 | US20110281221 Applications of semiconductor nano-sized particles for photolithography |
11/17/2011 | US20110281218 Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin composition |
11/17/2011 | US20110281208 Hybrid Multi-Layer Mask |
11/17/2011 | US20110281207 Reflective mask blank and method of manufacturing a reflective mask |
11/17/2011 | US20110281138 Method of mounting semiconductor chips, semiconductor device obtained using the method,method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same |
11/17/2011 | US20110281038 Production Apparatus and Method of producing a Light-Emitting Device by Using the Same Apparatus |
11/17/2011 | US20110280703 Apparatus and method for contactless handling of an object |
11/17/2011 | US20110280693 Substrate processing apparatus |
11/17/2011 | US20110280276 Time-related temperature variation transducer, electronic chip incorporating this transducer and method of fabrication of this chip |
11/17/2011 | US20110280266 Semiconductor laser apparatus, method of manufacturing semiconductor laser apparatus and optical apparatus |
11/17/2011 | US20110280097 Wordline driver for memory |
11/17/2011 | US20110280077 Multi-semiconductor material vertical memory strings, strings of memory cells having individually biasable channel regions, memory arrays incorporating such strings, and methods of accessing and forming the same |
11/17/2011 | US20110280076 Junctionless tft nand flash memory |
11/17/2011 | US20110280064 Composite resistance variable element and method for manufacturing the same |
11/17/2011 | US20110279979 Constructions Comprising Rutile-Type Titanium Oxide; And Methods Of Forming And Utilizing Rutile-Type Titanium Oxide |
11/17/2011 | US20110279816 Photomask mounting/housing device and resist inspection method and resist inspection apparatus using same |
11/17/2011 | US20110279815 Manufacturing method and structure for wafer level image sensor module with fixed focal length |
11/17/2011 | US20110279800 Lithographic apparatus and device manufacturing method |
11/17/2011 | US20110279795 Lithographic apparatus and device manufacturing method |
11/17/2011 | US20110279764 Active matrix substrate and display device |
11/17/2011 | US20110279201 Microelectromechanical resonator and a method for producing the same |
11/17/2011 | US20110279125 FET Nanopore Sensor |
11/17/2011 | US20110278742 Circuitry and Method for Encapsulating the Same |
11/17/2011 | US20110278741 Semiconductor Device and Method of Forming Interconnect Structure and Mounting Semiconductor Die in Recessed Encapsulant |
11/17/2011 | US20110278740 Scalable transfer-join bonding lock-and-key structures |
11/17/2011 | US20110278738 Self-aligned, integrated circuit contact |
11/17/2011 | US20110278736 Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP |