Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2011
11/16/2011EP2387077A2 Semiconductor device with a peripheral base region
11/16/2011EP2387067A1 Method for manufacturing semiconductor package, method for encapsulating semiconductor, and solvent-borne semiconductor encapsulating epoxy resin composition
11/16/2011EP2387066A2 Method of forming a single-electron memory device using a sub-micron mask
11/16/2011EP2387063A1 Chamber for physical vapor deposition
11/16/2011EP2386491A1 A loading tool
11/16/2011EP2386118A1 Dispensing liquid containing material to patterned surfaces using a dispensing tube
11/16/2011EP2386115A2 Memory cell having dielectric memory element
11/16/2011EP2386114A2 Scatterometry metrology target design optimization
11/16/2011EP2385958A2 Adhesives and binders for electro-optic displays
11/16/2011EP2332168B1 Dislocation engineering using a scanned laser
11/16/2011EP2065926B1 Feeding structure of electrostatic chuck, method for producing the same, and method for regenerating feeding structure of electrostatic chuck
11/16/2011EP1981078B1 Drive apparatus for substrate transfer robot having coolant circulating passage
11/16/2011EP1932171B1 Finfet-based non-volatile memory device
11/16/2011EP1886261B1 Semiconductor device
11/16/2011EP1815502B1 Method and device for treating substrates and corresponding nozzle unit
11/16/2011EP1801647B1 Photomask blank and photomask
11/16/2011EP1786023B1 Simox substrate manufacturing method
11/16/2011EP1745513B1 Integrated getter for vacuum or inert gas packaged leds
11/16/2011EP1494271B1 Method for dicing substrate
11/16/2011EP1066123B1 Improvement in aqueous stripping and cleaning compositions
11/16/2011EP0977251B1 Resin sealed semiconductor device and method for manufacturing the same
11/16/2011EP0958609B1 A FIELD CONTROLLED SEMICONDUCTOR DEVICE OF SiC AND A METHOD FOR PRODUCTION THEREOF
11/16/2011CN202042485U Single polycrystalline EEPROM (electrically erasable programmable read-only memory) continuously adjustable in threshold voltage
11/16/2011CN202042476U Device packaging structure
11/16/2011CN202042470U Angle adjusting mechanism of soft landing push-pull boat of diffusion furnace
11/16/2011CN202042469U Charging box for solar energy silicon slices
11/16/2011CN202042468U Mold cleaning lead wire placing disk
11/16/2011CN202042467U Wafer floating pressure plate
11/16/2011CN202042466U Rotating basket for cleaning polycrystalline silicon block
11/16/2011CN202042465U Flattened lead diode cleaning disc
11/16/2011CN202042464U Cleaning device for semiconductor packaging
11/16/2011CN202042463U Double track axial diode consistent machine
11/16/2011CN202042281U Conducting wire molding device for multi-wire-diameter component
11/16/2011CN1947262B LDMOS transistor and manufacture method thereof
11/16/2011CN1943034B Tuneable semiconductor device
11/16/2011CN1893094B 半导体器件以及其制造方法 Semiconductor device and manufacturing method thereof
11/16/2011CN1822337B Substrate having silicon germanium material and stressed silicon nitride layer
11/16/2011CN1808282B Exposure apparatus and device manufacturing method
11/16/2011CN1790682B Semiconductor composite apparatus, method for manufacturing it, LED head and imaging device
11/16/2011CN1703773B Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
11/16/2011CN1669892B Calibration of high speed loader to substrate transport system
11/16/2011CN1662114B Plasma antenna
11/16/2011CN1652151B Semiconductor device
11/16/2011CN1531093B Microminiature power converter with multiple output
11/16/2011CN1384546B 半导体器件 Semiconductor devices
11/16/2011CN102246607A Electrode connection structure, conductive adhesive used therefor, and electronic device
11/16/2011CN102246604A Plasma processing apparatus
11/16/2011CN102246327A Magnetoresistance effect element and magnetic memory cell and magnetic random access memory using same
11/16/2011CN102246312A Jfet device structures and methods for fabricating the same
11/16/2011CN102246311A Cu alloy film and display device
11/16/2011CN102246309A Trench-based power semiconductor devices with increased breakdown voltage characteristics
11/16/2011CN102246308A Trench-based power semiconductor devices with increased breakdown voltage characteristics
11/16/2011CN102246307A Trench-based power semiconductor devices with increased breakdown voltage characteristics
11/16/2011CN102246306A Trench-based power semiconductor devices with increased breakdown voltage characteristics
11/16/2011CN102246299A Method for making via interconnection
11/16/2011CN102246296A Semiconductor-sealing resin composition, method for producing semiconductor device, and semiconductor device
11/16/2011CN102246295A Granulated epoxy resin composition for semiconductor encapsulation, semiconductor device using same, and method for manufacturing semiconductor device
11/16/2011CN102246294A Low power memory device with JFET device structures
11/16/2011CN102246293A Interconnect structure with improved dielectric line to via electromigration resistant interfacial layer and method of fabricating same
11/16/2011CN102246292A Method of plating through wafer vias in a wafer for 3D packaging
11/16/2011CN102246291A Strain engineered composite semiconductor substrates and methods of forming same
11/16/2011CN102246290A Substrate cooling apparatus and substrate processing system
11/16/2011CN102246289A De-clamping wafers from an electrostatic chuck
11/16/2011CN102246288A Electrostatic chuck with compliant coat
11/16/2011CN102246287A A load lock for cooling wafers and a method of cooling the wafers
11/16/2011CN102246286A Vacuum processing apparatus and vacuum transfer apparatus
11/16/2011CN102246285A Resin paste for die bonding, method for producing semiconductor device, and semiconductor device
11/16/2011CN102246284A Bipolar transistor
11/16/2011CN102246283A Bipolar transistor
11/16/2011CN102246282A High pressure bevel etch process
11/16/2011CN102246281A Method for cleaning object and system for cleaning object
11/16/2011CN102246280A Carrier head membrane
11/16/2011CN102246279A Carrier head membrane roughness to control polishing rate
11/16/2011CN102246278A Platen and adapter assemblies for facilitating silicon electrode polishing
11/16/2011CN102246277A Apparatus and method for wet-processing object, and fluid diffusion plate and barrel used therein
11/16/2011CN102246276A Condensible gas cooling system
11/16/2011CN102246275A Methods of forming multi-doped junctions on a substrate
11/16/2011CN102246274A Concentric showerhead for vapor deposition
11/16/2011CN102246273A Continuous feed chemical vapor deposition
11/16/2011CN102246272A System and method for recycling a gas used to deposit a semiconductor layer
11/16/2011CN102246271A Shaped anode and anode-shield connection for vacuum physical vapor deposition
11/16/2011CN102246270A Chamber shield for vacuum physical vapor deposition
11/16/2011CN102246269A Low expansion glass substrate for reflection type mask and method for processing same
11/16/2011CN102246268A System for processing of substrate, method of processing of substrate, and storage medium that stores program
11/16/2011CN102246267A Method for manufacturing composite substrate on which wide bandgap semiconductor is laminated
11/16/2011CN102246266A Normal-temperature bondong device
11/16/2011CN102246265A Substrate and method for manufacturing substrate
11/16/2011CN102246264A SOI wafer manufacturing method
11/16/2011CN102246263A Integration of a processing bench in an inline coating system
11/16/2011CN102246262A Method for encapsulating semiconductor dies
11/16/2011CN102246261A System for encapsulation of semiconductor dies
11/16/2011CN102246128A Display device
11/16/2011CN102245934A Rack and pinion system, vacuum processing device, drive control method for rack and pinion system, drive control program, and recording medium
11/16/2011CN102245814A Method for producing nitride compound semiconductor substrate, and nitride compound semiconductor free-standing substrate
11/16/2011CN102245803A Catalyst chemical vapor deposition apparatus
11/16/2011CN102245802A Film-forming method, film-forming apparatus, and storage medium
11/16/2011CN102245798A Sputtering device and sputtering method
11/16/2011CN102245750A Cleaning agent for electronic materials
11/16/2011CN102245723A Wet-etchable antireflective coatings
11/16/2011CN102245663A Photo-curing material manufacturing method, and photo-curing material and article
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