H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2011
11/17/2011	US20110278735 Chip package and method for forming the same
11/17/2011	US20110278734 Chip package and method for forming the same
11/17/2011	US20110278733 Process for fabricating semiconductor devices and a semiconductor device comprising a chip with through-vias
11/17/2011	US20110278732 Interconnect Structures for Substrate
11/17/2011	US20110278728 Chip Packaging
11/17/2011	US20110278725 Stacking of transfer carriers with aperture arrays as interconnection joints
11/17/2011	US20110278724 Chip package and method for forming the same
11/17/2011	US20110278718 Assembly of multi-chip modules using reflowable features
11/17/2011	US20110278717 Semiconductor Device and Method of Embedding Bumps Formed on Semiconductor Die Into Penetrable Adhesive Layer to Reduce Die Shifting During Encapsulation
11/17/2011	US20110278716 Method of fabricating bump structure
11/17/2011	US20110278714 Chip package device and manufacturing method thereof
11/17/2011	US20110278713 Embedded component substrate, semiconductor package structure using the same and fabrication methods thereof
11/17/2011	US20110278712 Semiconductor Device and Method of Forming Perforated Opening in Bottom Substrate of Flipchip POP Assembly to Reduce Bleeding of Underfill Material
11/17/2011	US20110278708 Lead frame, semiconductor device, and method for manufacturing semiconductor device
11/17/2011	US20110278707 Semiconductor Device and Method of Forming Prefabricated Multi-Die Leadframe for Electrical Interconnect of Stacked Semiconductor Die
11/17/2011	US20110278706 Power Electronic Device Package
11/17/2011	US20110278705 Semiconductor Device and Method of Mounting Semiconductor Die to Heat Spreader on Temporary Carrier and Forming Polymer Layer and Conductive Layer Over the Die
11/17/2011	US20110278703 Semiconductor Device and Method of Forming Discontinuous ESD Protection Layers Between Semiconductor Die
11/17/2011	US20110278702 Method for producing a dopant profile
11/17/2011	US20110278697 Metal-insulator-metal capacitor and method for fabricating metal-insulator-metal capacitor structures
11/17/2011	US20110278694 Bipolar punch-through semiconductor device and method for manufacturing such a semiconductor device
11/17/2011	US20110278683 Acoustic sensor and method of manufacturing the same
11/17/2011	US20110278680 Strained Semiconductor Device and Method of Making the Same
11/17/2011	US20110278678 Semiconductor device and method for manufacturing same
11/17/2011	US20110278676 Method and apparatus for enhancing channel strain
11/17/2011	US20110278675 IGFET Device Having an RF Capability
11/17/2011	US20110278674 Trench isolation and method of fabricating trench isolation
11/17/2011	US20110278673 Methodology for fabricating isotropically recessed source and drain regions of cmos transistors
11/17/2011	US20110278672 Methodology for fabricating isotropically recessed drain regions of cmos transistors
11/17/2011	US20110278670 Apparatus, System, and Method for Tunneling Mosfets Using Self-Aligned Heterostructure Source and Isolated Drain
11/17/2011	US20110278667 Semiconductor component arrangement and method for producing thereof
11/17/2011	US20110278666 Trench MOSFET with integrated Schottky diode in a single cell and method of manufacture
11/17/2011	US20110278659 Semiconductor device and method of manufacturing the same
11/17/2011	US20110278657 Apparatus, system, and method for capacitance change non-volatile memory device
11/17/2011	US20110278656 Stacked capacitor for double-poly flash memory
11/17/2011	US20110278648 method of introducing a structure in a substrate
11/17/2011	US20110278647 Iii-nitride semiconductor electronic device, and method of fabricating iii-nitride semiconductor electronic device
11/17/2011	US20110278644 Group iii-nitride enhancement mode field effect devices and fabrication methods
11/17/2011	US20110278642 Power semiconductor structure with field effect rectifier and fabrication method thereof
11/17/2011	US20110278616 Manufacturing method of wavelength conversion element, wavelength conversion element, and light emitting device
11/17/2011	US20110278603 Organic el display and method for manufacturing same
11/17/2011	US20110278600 Light emitting diode module and method of making the same
11/17/2011	US20110278598 Semiconductor structure, an integrated circuit including a semiconductor structure and a method for manufacturing a semiconductor structure
11/17/2011	US20110278597 Method of producing a layer of cavities
11/17/2011	US20110278595 Method for manufacturing silicon carbide substrate, method for manufacturing semiconductor device, silicon carbide substrate, and semiconductor device
11/17/2011	US20110278594 Method for manufacturing silicon carbide substrate, method for manufacturing semiconductor device, silicon carbide substrate, and semiconductor device
11/17/2011	US20110278593 Method for manufacturing silicon carbide substrate, method for manufacturing semiconductor device, silicon carbide substrate, and semiconductor device
11/17/2011	US20110278590 Semiconductor Devices Having Gates Including Oxidized Nickel and Related Methods of Fabricating the Same
11/17/2011	US20110278588 Method of Preparing and Storing GaN Substrate, Prepared and Stored GaN Substrate, and Semiconductor Device and Method of Its Manufacture
11/17/2011	US20110278585 Growth of reduced dislocation density non-polar gallium nitride
11/17/2011	US20110278583 Thin-film semiconductor device for display apparatus and manufacturing method thereof
11/17/2011	US20110278582 Method for manufacturing microcrystalline semiconductor film and method for manufacturing semiconductor device
11/17/2011	US20110278581 Semiconductor device and manufacturing method thereof
11/17/2011	US20110278580 Methodology for fabricating isotropically source regions of cmos transistors
11/17/2011	US20110278578 Display device
11/17/2011	US20110278576 Array substrate and manufacturing method thereof
11/17/2011	US20110278572 Electro-Optical Device
11/17/2011	US20110278570 Scaling of bipolar transistors
11/17/2011	US20110278569 Wafer level integration module with interconnects
11/17/2011	US20110278568 Manufacturing process of integrated electronic circuits and circuits thereby obtained
11/17/2011	US20110278566 Method of patterning thin film solution-deposited
11/17/2011	US20110278565 Oxide thin film transistor and method of fabricating the same
11/17/2011	US20110278563 Thin film transistor array substrate and method for manufacturing the same
11/17/2011	US20110278550 Organic light emitting diode display and manufacturing method thereof
11/17/2011	US20110278544 Generation of multiple diameter nanowire field effect transistors
11/17/2011	US20110278543 Generation of mutiple diameter nanowire field effect transistors
11/17/2011	US20110278542 TFET with Nanowire Source
11/17/2011	US20110278539 Generation of multiple diameter nanowire field effect transistors
11/17/2011	US20110278536 Light emitting material
11/17/2011	US20110278533 Double gyroid structure nanoporous films and nanowire networks
11/17/2011	US20110278531 Forming Electrodes for Chalcogenide Containing Devices
11/17/2011	US20110278529 Memory employing diamond-like carbon resistivity-switchable material and methods of forming the same
11/17/2011	US20110278528 Self aligned fin-type programmable memory cell
11/17/2011	US20110278464 Radiation detector and fabrication process
11/17/2011	US20110278363 Semiconductor substrate-based system for an rfid device, rfid device, and method for manufacturing such a semiconductor substrate-based system
11/17/2011	US20110278260 Inductive plasma source with metallic shower head using b-field concentrator
11/17/2011	US20110278205 Method and apparatus of conveying objects to be processed and computer-readable storage medium storing program
11/17/2011	US20110277832 Method for production of titanium dioxide composite and photoelectric conversion device incorporated with the same
11/17/2011	US20110277807 Photoelectric conversion module
11/17/2011	DE19644450B4 Digitalisierende Eingangsstufe eines AD-Direktumsetzers und Herstellverfahren Digitized input stage of an AD converter and direct production process
11/17/2011	DE10206658B4 Verfahren zum Überprüfen einer integrierten elektrischen Schaltung A method for checking an integrated electrical circuit
11/17/2011	DE102011101457A1 Verfahren zur Herstellung einer Halbleiteranordnung A process for producing a semiconductor device
11/17/2011	DE102011007625A1 Trübe Zinkoxid-Schicht für geformte CIGS/CIS-Solarzellen Cloudy zinc oxide layer formed CIGS / CIS solar cells
11/17/2011	DE102011002233A1 GaN based power devices with integrated protection devices: structures and methods GaN based power devices with integrated protection devices: structures and methods
11/17/2011	DE102010064411A1 Verfahren zur Herstellung einer dielektrisch isolierten Halbleitervorrichtung A method of manufacturing a dielectrically isolated semiconductor device
11/17/2011	DE102010028931A1 Drahtsägevorrichtung zum Herstellen von Wafern A wire saw for producing wafers
11/17/2011	DE102010020974A1 Method for manufacturing solar cells utilized for supplying power to e.g. stationary apparatus, involves performing splitting process on wafer by exerting pressure vertically and evenly on wafer from top to bottom of wafer by knife
11/17/2011	DE102010020749A1 Electronic device e.g. direct current (DC)-DC converter has silicon chip with metal film directly connected to electronic component that is connected to solder ball and connection elements, to serve as carrier for electronic component
11/17/2011	DE102010020696A1 Method for sintering three-dimensional contour exhibiting semiconductor component for power electronics using low-temperature joining technique, involves applying sintering pressure by upper die with contours of semiconductor component
11/17/2011	DE102010020175A1 Halbleiterbauteil mit defektreicher Schicht zur optimalen Kontaktierung von Emittern sowie Verfahren zu dessen Herstellung A semiconductor device comprising defect-rich layer for optimum contacting of emitters and to processes for the preparation thereof
11/17/2011	DE102009029769B4 Verfahren zur Herstellung eines elektronischen Bauteils mit einem mediendichten Kunststoffgehäuse A method of manufacturing an electronic component having a media-impermeable plastic housing
11/17/2011	DE102009025243B4 Verfahren zur Herstellung und Verfahren zur Bearbeitung einer Halbleiterscheibe aus Silicium Methods for making and method for processing a semiconductor wafer of silicon
11/17/2011	DE102007003812B4 Halbleiterbauelement mit Trench-Gate und Verfahren zur Herstellung A semiconductor device having trench gate and processes for preparing
11/17/2011	DE102006006424B4 Anordnung mit mindestens einem Leistungshalbleitermodul und einem Kühlbauteil und zugehöriges Herstellungsverfahren Arrangement with at least one power semiconductor module and a cooling component and associated production method
11/17/2011	DE102004061930B4 Optisches Halbleiterbauelement zur Ankopplung an eine optische Faser und damit ausgerüstete elektronische Einrichtung An optical semiconductor device for coupling to an optical fiber and electronic device equipped therewith
11/17/2011	DE10196527B3 Verfahren zum Herstellen einer dicken Oxidschicht auf dem Boden einer Grabenstruktur in Silicium A method for producing a thick oxide layer on the bottom of a grave structure in silicon
11/17/2011	DE10109507B4 Halbleiterherstellungsverfahren Semiconductor manufacturing processes
11/17/2011	CA2778307A1 Semiconductor device, combined substrate, and methods for manufacturing them
11/17/2011	CA2768285A1 Silicon carbide substrate fabrication method, semiconductor device fabrication method, silicon carbide substrate, and semiconductor device
11/16/2011	EP2387094A1 Switch circuit and method of switching radio frequency signals

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