H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2011
11/15/2011	US8058711 Filler for filling a gap and method for manufacturing semiconductor capacitor using the same
11/15/2011	US8058707 Semiconductor devices having redundant through-die vias and methods of fabricating the same
11/15/2011	US8058705 Composite material substrate
11/15/2011	US8058700 Surge overcurrent protection for solid state, smart, highside, high current, power switch
11/15/2011	US8058693 Semiconductor device having switching element and method for fabricating semiconductor device having switching element
11/15/2011	US8058690 Integration of planar and tri-gate devices on the same substrate
11/15/2011	US8058689 Techniques to reduce substrate cross talk on mixed signal and RF circuit design
11/15/2011	US8058683 Access device having vertical channel and related semiconductor device and a method of fabricating the access device
11/15/2011	US8058679 Semiconductor device and semiconductor device manufacturing method
11/15/2011	US8058672 Semiconductor device and display device
11/15/2011	US8058664 Transparent solder mask LED assembly
11/15/2011	US8058662 Light emitting diode and method of fabricating the same
11/15/2011	US8058656 Method for producing a matrix of individual electronic components and matrix produced thereby
11/15/2011	US8058654 Display device and manufacturing method thereof
11/15/2011	US8058651 Thin film transistor array substrate and method for manufacturing the same
11/15/2011	US8058649 Thin-film transistor and method of manufacturing the same
11/15/2011	US8058639 Nitride semiconductor element and method for production thereof
11/15/2011	US8058626 Method and apparatus for modifying a ribbon-shaped ion beam
11/15/2011	US8058603 Light sensing panel, and liquid crystal display apparatus having the same
11/15/2011	US8058565 Wiring board, semiconductor device, and method for manufacturing wiring board
11/15/2011	US8058187 Trap charge equalizing method and threshold voltage distribution reducing method
11/15/2011	US8058186 Components for substrate processing apparatus and manufacturing method thereof
11/15/2011	US8058184 Semiconductor device producing method
11/15/2011	US8058183 Restoring low dielectric constant film properties
11/15/2011	US8058182 Surface micromachining process of MEMS ink jet drop ejectors on glass substrates
11/15/2011	US8058181 Method for post-etch cleans
11/15/2011	US8058180 Methods of fabricating a semiconductor device using a dilute aqueous solution of an ammonia and peroxide mixture
11/15/2011	US8058179 Atomic layer removal process with higher etch amount
11/15/2011	US8058178 Photoresist strip method for low-k dielectrics
11/15/2011	US8058177 Winged vias to increase overlay margin
11/15/2011	US8058176 Methods of patterning insulating layers using etching techniques that compensate for etch rate variations
11/15/2011	US8058175 Method for planarization of wafer and method for formation of isolation structure in top metal layer
11/15/2011	US8058174 Method for treating semiconductor processing components and components formed thereby
11/15/2011	US8058173 Methods for producing smooth wafers
11/15/2011	US8058172 Polishing process of a semiconductor substrate
11/15/2011	US8058171 Stirring apparatus for combinatorial processing
11/15/2011	US8058170 Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics
11/15/2011	US8058169 Interconnection architecture for semiconductor device
11/15/2011	US8058168 Method of fabricating semiconductor device having metal-semiconductor compound regions
11/15/2011	US8058167 Dynamic Schottky barrier MOSFET device and method of manufacture
11/15/2011	US8058166 Method of manufacturing a semiconductor device
11/15/2011	US8058165 Semiconductor device and method of manufacturing the same
11/15/2011	US8058164 Methods of fabricating electronic devices using direct copper plating
11/15/2011	US8058163 Enhanced reliability for semiconductor devices using dielectric encasement
11/15/2011	US8058162 Nonvolatile semiconductor memory and method of manufacturing the same
11/15/2011	US8058161 Recessed STI for wide transistors
11/15/2011	US8058160 Method of forming nonvolatile memory device
11/15/2011	US8058159 Method of making low work function component
11/15/2011	US8058158 Hybrid semiconductor substrate including semiconductor-on-insulator region and method of making the same
11/15/2011	US8058156 Plasma immersion ion implantation reactor having multiple ion shower grids
11/15/2011	US8058155 Integrated nanowires/microelectrode array for biosensing
11/15/2011	US8058154 Methods for discretized processing and process sequence integration of regions of a substrate
11/15/2011	US8058153 Method for recovering damage of low dielectric insulating film for manufacturing semiconductor device
11/15/2011	US8058152 Method for manufacturing integrated circuit
11/15/2011	US8058151 Methods of die sawing
11/15/2011	US8058150 Particle free wafer separation
11/15/2011	US8058149 Method for fabricating a semiconductor substrate
11/15/2011	US8058148 Methods and apparatus for producing semiconductor on insulator structures using directed exfoliation
11/15/2011	US8058147 Method for producing semiconductor components and thin-film semiconductor component
11/15/2011	US8058146 Peeling method
11/15/2011	US8058145 Micro-electro-mechanical device and manufacturing method for the same
11/15/2011	US8058144 Method for capping a MEMS wafer
11/15/2011	US8058143 Substrate bonding with metal germanium silicon material
11/15/2011	US8058142 Bonded semiconductor structure and method of making the same
11/15/2011	US8058141 Recessed gate electrode MOS transistor and method for fabricating the same
11/15/2011	US8058140 Thickened sidewall dielectric for memory cell
11/15/2011	US8058139 Manufacturing method for semiconductor devices
11/15/2011	US8058138 Gap processing
11/15/2011	US8058137 Method for fabrication of a semiconductor device and structure
11/15/2011	US8058136 Self-alignment method for recess channel dynamic random access memory
11/15/2011	US8058135 Process for the production of electrolyte capacitors
11/15/2011	US8058134 Junction profile engineering using staged thermal annealing
11/15/2011	US8058133 Method of fabrication of metal oxide semiconductor field effect transistor
11/15/2011	US8058132 Method of fabricating flash memory device
11/15/2011	US8058131 Semiconductor integrated circuit device and method of producing the same
11/15/2011	US8058130 Method of forming a nitrogen-enriched region within silicon-oxide-containing masses
11/15/2011	US8058129 Lateral double diffused MOS device and method for manufacturing the same
11/15/2011	US8058128 Methods of fabricating recessed channel metal oxide semiconductor (MOS) transistors
11/15/2011	US8058127 Manufacturing method of semiconductor power devices
11/15/2011	US8058126 Semiconductor devices and structures including at least partially formed container capacitors and methods of forming the same
11/15/2011	US8058125 Poly resistor on a semiconductor device
11/15/2011	US8058124 Method of manufacturing a semiconductor device
11/15/2011	US8058123 Integrated circuit and method of fabrication thereof
11/15/2011	US8058122 Formation of metal gate electrode using rare earth alloy incorporated into mid gap metal
11/15/2011	US8058120 Integration scheme for strained source/drain CMOS using oxide hard mask
11/15/2011	US8058119 Device scheme of HKMG gate-last process
11/15/2011	US8058117 Method of synthesizing silicon wires
11/15/2011	US8058116 Method of fabricating an amorphous zinc-oxide based thin film transistor (TFT) including source/drain electrodes formed between two oxide semiconductor layers
11/15/2011	US8058115 Method of fabricating organic thin film transistor using surface energy control
11/15/2011	US8058114 Method of manufacturing the array substrate capable of decreasing a line resistance
11/15/2011	US8058113 Printing method for high performance electronic devices
11/15/2011	US8058112 Semiconductor device having carbon nanotubes and method for manufacturing the same
11/15/2011	US8058111 Integrated circuit arrangement comprising a pin diode, and production method
11/15/2011	US8058110 Plating method, semiconductor device fabrication method and circuit board fabrication method
11/15/2011	US8058109 Method for manufacturing a semiconductor structure
11/15/2011	US8058108 Methods of forming semiconductor chip underfill anchors
11/15/2011	US8058107 Semiconductor die package using leadframe and clip and method of manufacturing
11/15/2011	US8058106 MEMS device package with vacuum cavity by two-step solder reflow method
11/15/2011	US8058105 Method of fabricating a packaging structure
11/15/2011	US8058104 Reversible leadless package and methods of making and using same

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