Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2011
11/16/2011CN102245532A Sintered complex oxide and sputtering target comprising same
11/16/2011CN102245531A Composite oxide sintered body and sputtering target comprising same
11/16/2011CN102245513A Pbnzt ferroelectric film, sol-gel solution, film forming method, and method for producing ferroelectric film
11/16/2011CN102245344A Film removal method, photoelectric conversion device manufacturing method, photoelectric conversion device, and film removal device
11/16/2011CN102244142A Quartz boat for manufacturing solar cell, method for inserting silicon wafers in quartz boat and method for transferring silicon wafers
11/16/2011CN102244141A On-line full-automatic silicon wafer loading and unloading machine
11/16/2011CN102244140A Diffusion turnover box
11/16/2011CN102244108A Silicon carbide (SiC) metal oxide semiconductor (MOS) capacitor with composite dielectric layer and manufacturing method for SiC MOS capacitor with composite dielectric layer
11/16/2011CN102244107A Easy-to-fill trench capacitor and preparation method thereof
11/16/2011CN102244104A Flat and lug combined bidirectional diode chip and manufacturing process thereof
11/16/2011CN102244102A Electron tunneling based enclosure type grid control metal-insulator device
11/16/2011CN102244099A SiC IEMOSFET (Implantation and Epitaxial Metal-Oxide -Semiconductor Field Effect Transistor) device with epitaxy channel and manufacturing method of SiC IEMOSFET device
11/16/2011CN102244098A Semiconducotor device and manufacturing method therefor
11/16/2011CN102244096A 3300V planar non-punch-through insulated gate bipolar transistor chip and manufacturing process thereof
11/16/2011CN102244093A Structure and method of reducing transverse diffusion width of p-n junction isolation diffusion
11/16/2011CN102244082A Manufacturing method of array substrate
11/16/2011CN102244080A Silicon-on-insulator (SOI) substrate structure and device
11/16/2011CN102244079A Power transistor chip structure of mesa technology and implementation method
11/16/2011CN102244078A Controlled silicon chip structure of mesa technology and implementation method
11/16/2011CN102244077A Special die for built-in capacitor of electret microphone and preparation method thereof
11/16/2011CN102244069A Semiconductor structure having concave part and manufacturing thereof
11/16/2011CN102244068A Semiconductor device, method for manufacturing the same, and electronic device
11/16/2011CN102244063A Semiconductor package with polygonal chip base and manufacturing method of semiconductor package
11/16/2011CN102244062A Semiconductor packaging structure and process
11/16/2011CN102244060A Packaging base plate and manufacturing method thereof
11/16/2011CN102244059A Semiconductor device for preventing crack in pad region and fabricating method thereof
11/16/2011CN102244058A Quad flat lead-free semiconductor package and manufacturing method thereof and metal plate used in manufacturing method
11/16/2011CN102244057A Semiconductor package and manufacturing method thereof
11/16/2011CN102244055A Integrated circuit chip and manufacturing method thereof
11/16/2011CN102244054A Chip package and method for forming the same
11/16/2011CN102244050A Heat radiator and manufacturing method thereof
11/16/2011CN102244048A Double-chip simulator and double-chip simulation heat dissipation system
11/16/2011CN102244047A Chip package and method for forming the same
11/16/2011CN102244046A Passivated protection diode chip and processing method thereof
11/16/2011CN102244045A Diode chip and processing technology thereof
11/16/2011CN102244044A Diode die-pressing discharging base and novel die-pressing discharging process thereof
11/16/2011CN102244042A Adhesive composition, circuit connecting material and connecting structure of circuit member
11/16/2011CN102244040A Double-substrate type storage card capsulation method and construction thereof
11/16/2011CN102244039A Splitting method of semiconductor wafer
11/16/2011CN102244038A Thin film transistor and manufacturing method thereof
11/16/2011CN102244037A Picture element structure and manufacturing method thereof
11/16/2011CN102244036A Method for manufacturing electrode insulation layer of liquid crystal display with wide viewing angle
11/16/2011CN102244035A Pixel structure and manufacturing method thereof
11/16/2011CN102244034A Array substrate and manufacturing method thereof
11/16/2011CN102244033A Method for reducing copper sag in copper interconnection wire Damascus technology
11/16/2011CN102244032A Semiconductor device and maufacturing method thereof
11/16/2011CN102244031A Contact hole and semiconductor device as well as formation method of contact hole and semiconductor device
11/16/2011CN102244030A Silicon on insulator diode device and manufacturing method thereof
11/16/2011CN102244029A Manufacturing process of silicon-on-insulator substrate and manufacturing process of silicon-on-insulator device
11/16/2011CN102244028A Method for manufacturing dielectric isolation type semiconductor device
11/16/2011CN102244027A Test carrier
11/16/2011CN102244026A Substrate positioning apparatus, substrate processing apparatus and substrate positioning method
11/16/2011CN102244025A Method and apparatus of conveying objects to be processed
11/16/2011CN102244024A Tray for low-profile quad flat package (LQFP) integrated circuit
11/16/2011CN102244023A Substrate processing apparatus and substrate processing method
11/16/2011CN102244022A Manufacturing method of single intermetallic compound micro-interconnecting structure of flip chip
11/16/2011CN102244021A Low-k chip encapsulating method
11/16/2011CN102244020A Package method and package die structure of composite material lead frame
11/16/2011CN102244019A 半导体装置及其制造方法 Semiconductor device and manufacturing method
11/16/2011CN102244018A Manufacturing method of chip embedded type printed circuit board
11/16/2011CN102244017A Encapsulation method and encapsulation and spraying equipment thereof for encapsulating surface glass of flake component
11/16/2011CN102244016A Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
11/16/2011CN102244015A Method for performing flexible electronic patterning on pretensioning elastic base plate
11/16/2011CN102244014A Manufacturing method of stackable package structure
11/16/2011CN102244013A Semiconductor device and manufacturing method thereof
11/16/2011CN102244012A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/16/2011CN102244011A Manufacturing process of water-cooled liquid cooling plate
11/16/2011CN102244010A Preparation method of p-CuAlO2/n-ZnO:Al transparent thin film heterojunction of glass substrate
11/16/2011CN102244009A Thin film transistor and manufacturing method thereof
11/16/2011CN102244008A Method for regulating back gate threshold voltage of SOI-NMOS (silicon on insulator-N-channel metal oxide semiconductor) device
11/16/2011CN102244007A Preparation of silicon-based gallium arsenide material by utilizing V-shaped groove
11/16/2011CN102244006A Thin film transistor and manufacturing method thereof
11/16/2011CN102244005A Oxide thin film transistor and method of fabricating the same
11/16/2011CN102244004A Manufacturing method of semiconductor device
11/16/2011CN102244003A Preparation method for side wall of InP HBT device
11/16/2011CN102244002A Preparation method of heterojunction with metal/semiconductor nanometer wire crossing structure
11/16/2011CN102244001A Acid-washing dehydration process and device of diode
11/16/2011CN102244000A Semiconductor device, variable capacitance diode and formation method thereof
11/16/2011CN102243999A Preparation method of silicon nitride layer in preparation process of semiconductor device
11/16/2011CN102243998A Method of manufacturing semiconductor device
11/16/2011CN102243997A Process method for etching and cleaning oxide film in deep groove before epitaxial growth
11/16/2011CN102243996A Preparation method of high-density platinum nanometer crystals suitable for flash memories
11/16/2011CN102243995A Integration method of gate oxide with different thicknesses in high-voltage process
11/16/2011CN102243994A Method of growing silicon-based gallium arsenide material with inverted V-shaped silicon dioxide groove structure
11/16/2011CN102243993A Method for growing GaInP compound semiconductor on Ge substrate
11/16/2011CN102243992A Method for manufacturing microcrystalline semiconductor film and method for manufacturing semiconductor device
11/16/2011CN102243991A Method for inducing amorphous silicon film with tin to be crystallized into polycrystalline silicon film
11/16/2011CN102243990A Preparation method of graphite nanoribbon
11/16/2011CN102243989A Integrated method for removal of halogen residues from etched substrates by thermal process
11/16/2011CN102243988A Cleaning process cavity and cleaning process for semiconductor silicon slice
11/16/2011CN102243987A Substrate processing device and substrate processing system
11/16/2011CN102243986A Processing apparatus
11/16/2011CN102243985A Waste heat utilization device for semiconductor production line and operating method thereof
11/16/2011CN102243984A Method of removing boron spots on chip
11/16/2011CN102243670A Method and system for generating semiconductor process formula
11/16/2011CN102243494A Exception handling method and exception handling method for process control
11/16/2011CN102243439A Chemically amplified positive resist composition for EB or EUV lithography and patterning process
11/16/2011CN102243404A Array substrate and manufacturing method thereof
11/16/2011CN102243186A Method for detecting chip appearance
11/16/2011CN102242402A Texturing device for solar cell silicon wafer
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