H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2011
11/24/2011	US20110287625 Methods of forming a pattern, methods of forming a gate structure and methods of manufacturing a semiconductor device using the same
11/24/2011	US20110287624 Nonvolatile semiconductor memory device and method of manufacturing the same
11/24/2011	US20110287623 Three-Dimensional Nonvolatile Memory Devices Having Sub-Divided Active Bars and Methods of Manufacturing Such Devices
11/24/2011	US20110287622 Transistors with Multilayered Dielectric Films and Methods of Manufacturing Such Transistors
11/24/2011	US20110287621 Semiconductor device and method for manufacturing the same
11/24/2011	US20110287620 Method of adjusting metal gate work function of nmos device
11/24/2011	US20110287619 Flash Memory Cell Arrays Having Dual Control Gates Per Memory Cell Charge Storage Element
11/24/2011	US20110287618 Method of manufacturing silicon carbide semiconductor apparatus
11/24/2011	US20110287617 Method of manufacturing super-junction semiconductor device
11/24/2011	US20110287616 Bottom anode schottky diode structure and method
11/24/2011	US20110287615 High-density nonvolatile memory and methods of making the same
11/24/2011	US20110287614 Group 6a/Group 3a ink and methods of making and using same
11/24/2011	US20110287613 Manufacturing method of superjunction structure
11/24/2011	US20110287612 Nonvolatile Memory Device, Method of Manufacturing the Nonvolatile Memory Device, and Memory Module and System Including the Nonvolatile Memory Device
11/24/2011	US20110287611 Reducing Variation by Using Combination Epitaxy Growth
11/24/2011	US20110287610 Selenium/Group 3A ink and methods of making and using same
11/24/2011	US20110287609 Wafer processing method
11/24/2011	US20110287608 Method for cutting substrate and method for manufacturing electronic element
11/24/2011	US20110287607 Method and apparatus for improved wafer singulation
11/24/2011	US20110287606 Method for fabricating chip elements provided with wire insertion grooves
11/24/2011	US20110287605 Method for manufacturing soi substrate
11/24/2011	US20110287604 Methods of forming semiconductor structures comprising direct bonding of substrates
11/24/2011	US20110287603 Method for manufacturing silicon carbide substrate
11/24/2011	US20110287602 Phase change memory device having a bent heater and method for manufacturing the same
11/24/2011	US20110287601 Methods of forming a dielectric containing dysprosium doped hafnium oxide
11/24/2011	US20110287600 Selective Etching in the Formation of Epitaxy Regions in MOS Devices
11/24/2011	US20110287599 Method of Fabricating a Transistor
11/24/2011	US20110287598 Method of manufacturing super-junction semiconductor device
11/24/2011	US20110287596 System and method for providing low voltage high density multi-bit storage flash memory
11/24/2011	US20110287595 Semiconductor integrated circuit device
11/24/2011	US20110287594 Method of manufacturing semiconductor device
11/24/2011	US20110287593 Method for forming semiconductor film and method for manufacturing semiconductor device
11/24/2011	US20110287592 Method for manufacturing semiconductor device
11/24/2011	US20110287591 Method for manufacturing semiconductor device
11/24/2011	US20110287590 Contact structures in substrate having bonded interface, semiconductor device including the same, methods of fabricating the same
11/24/2011	US20110287589 Method for manufacturing antenna and method for manufacturing semiconductor device
11/24/2011	US20110287588 Method for manufacturing heat-dissipating semiconductor package structure
11/24/2011	US20110287587 Method for fabricating heat dissipation package structure
11/24/2011	US20110287586 MEMS Switch Capping and Passivation Method
11/24/2011	US20110287585 Semiconductor device including semiconductor elements mounted on base plate
11/24/2011	US20110287584 Semiconductor package having side walls and method for manufacturing the same
11/24/2011	US20110287583 Convex die attachment method
11/24/2011	US20110287582 Method of forming a semiconductor device
11/24/2011	US20110287581 Semiconductor workpiece carriers and methods for processing semiconductor workpieces
11/24/2011	US20110287580 Method for manufacturing semiconductor device
11/24/2011	US20110287572 Semiconductor device fabrication methods
11/24/2011	US20110287567 Betavoltaic battery with a shallow junction and a method for making same
11/24/2011	US20110287563 Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader
11/24/2011	US20110287562 Method of manufacturing liquid discharge head substrate, method of manufacturing liquid discharge head, and method of manufacturing liquid discharge head assembly
11/24/2011	US20110287561 Thin film transistor array substrate with improved test terminals
11/24/2011	US20110287560 In-situ melt and reflow process for forming flip-chip interconnections and systems thereof
11/24/2011	US20110287369 Resist underlayer film forming composition containing silicon having anion group
11/24/2011	US20110287363 High-resolution photolithographic method for forming nanostructures, in particular in the manufacture of integrated electronic devices
11/24/2011	US20110287345 Electron beam drawing apparatus, electron beam drawing method, semiconductor device manufacturing mask manufacturing method, and semiconductor device manufacturing template manufacturing method
11/24/2011	US20110287344 Reflective photomask, manufacturing method of the photomask, and pattern formation method
11/24/2011	US20110287250 Adhesive sheet, semiconductor device, and process for producing semiconductor device
11/24/2011	US20110287219 Synthetic quartz glass substrate and making method
11/24/2011	US20110286819 Substrate processing apparatus and substrate processing method
11/24/2011	US20110286690 Optical package and related methods
11/24/2011	US20110286319 Charged particle beam writing apparatus, write data creation method and charged particle beam writing method
11/24/2011	US20110286284 Multi-transistor non-volatile memory element
11/24/2011	US20110286283 3d two-bit-per-cell nand flash memory
11/24/2011	US20110286275 Stacked Memory Devices And Method Of Manufacturing The Same
11/24/2011	US20110286263 Memory device
11/24/2011	US20110286188 Multilayer printed circuit board using flexible interconnect structure, and method of making same
11/24/2011	US20110286002 Light reflecting mask, exposure apparatus, and measuring method
11/24/2011	US20110285977 Lithographic apparatus and device manufacturing method
11/24/2011	US20110285975 Method of managing euv exposure mask and exposure method
11/24/2011	US20110285614 Semiconductor device
11/24/2011	US20110285547 External Conditions Audio Playback System and Method
11/24/2011	US20110285036 Overlay mark assistant feature
11/24/2011	US20110285028 Semiconductor device and method for fabricating the same
11/24/2011	US20110285027 Semiconductor circuit structure and method of forming the same using a capping layer
11/24/2011	US20110285026 Process For Improving Package Warpage and Connection Reliability Through Use Of A Backside Mold Configuration (BSMC)
11/24/2011	US20110285025 Wafer Level Chip Scale Package Method Using Clip Array
11/24/2011	US20110285024 Semiconductor device and manufacturing method thereof
11/24/2011	US20110285023 Substrate Interconnections having Different Sizes
11/24/2011	US20110285018 Multiple selectable function integrated circuit module
11/24/2011	US20110285017 Method for producing an optoelectronic device and optoelectronic device
11/24/2011	US20110285016 Semiconductor device and method of manufacturing the same
11/24/2011	US20110285015 Bump structure and fabrication method thereof
11/24/2011	US20110285014 Packaging structure and package process
11/24/2011	US20110285012 Substrate Contact Opening
11/24/2011	US20110285011 Cu pillar bump with l-shaped non-metal sidewall protection structure
11/24/2011	US20110285009 Integrated circuit packaging system with dual side connection and method of manufacture thereof
11/24/2011	US20110285007 Semiconductor Device and Method of Forming Ultra Thin Multi-Die Face-to-Face WLCSP
11/24/2011	US20110285006 Semiconductor Package and Method for Making the Same
11/24/2011	US20110285004 Devices including, methods using, and compositions of reflowable getters
11/24/2011	US20110285001 Leadless integrated circuit packaging system and method of manufacture thereof
11/24/2011	US20110285000 Semiconductor system with fine pitch lead fingers and method of manufacturing thereof
11/24/2011	US20110284999 Integrated circuit packaging system with isolated pads and method of manufacture thereof
11/24/2011	US20110284997 Chip-Exposed Semiconductor Device and Its Packaging Method
11/24/2011	US20110284996 Semiconductor device and method of manufacturing the same
11/24/2011	US20110284995 Micromechanical membranes and related structures and methods
11/24/2011	US20110284994 Electrically Broken, but Mechanically Continuous Die Seal for Integrated Circuits
11/24/2011	US20110284993 Composite growth substrate for growing simiconductor device
11/24/2011	US20110284992 3d integrated circuit and method of manufacturing the same
11/24/2011	US20110284991 Semiconductor device and method of manufacturing semiconductor device
11/24/2011	US20110284990 Process for making an alignment structure in the fabrication of a semiconductor device
11/24/2011	US20110284986 Bypass diode for a solar cell

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