Patents
Sitemap › G01 - Measuring; Testing › G01R - Measuring electric variables; Measuring magnetic variables › G01R 3 - Apparatus or processes specially adapted for the manufacture of measuring instruments
Patents for G01R 3 - Apparatus or processes specially adapted for the manufacture of measuring instruments (2,138)
09/2003
09/23/2003US6623345 Wafer for cleaning semiconductor device probe
09/18/2003US20030176066 Contact structure and production method thereof and probe contact assemly using same
09/18/2003US20030173661 Contact structure and production method thereof and probe contact assembly using same
09/16/2003US6622289 Methods for making contact device for making connection to an electronic circuit device and methods of using the same
09/16/2003US6621262 Method for optimizing probe card analysis and scrub mark analysis data
09/16/2003US6621261 Work inspection apparatus
09/12/2003WO2003075409A1 Anisotropic conductive film and method for producing the same
09/09/2003US6617865 Compliant probe apparatus
09/09/2003US6617863 Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof
09/09/2003US6616966 Method of making lithographic contact springs
09/02/2003US6614250 Sensor probe for use in board inspection and manufacturing method thereof
09/02/2003US6612861 Forming reliable semiconductor testing device having high frequency bandwidth
08/2003
08/28/2003WO2003071289A1 Contact structure having silicon finger contactor
08/21/2003US20030155940 Method for forming cantilever beam probe card and probe card formed
08/19/2003US6608385 Contact structure and production method thereof and probe contact assembly using same
08/14/2003WO2003067650A1 Method for manufacturing electric contact element for testing electro device and electric contact element thereby
08/14/2003WO2003035541A3 Probe needle for testing semiconductor chips and method for producing said probe needle
08/14/2003WO2002064496A3 Method for forming microelectronic spring structures on a substrate
08/14/2003US20030150640 Silicon space transformer and method of manufacturing same
08/12/2003US6605954 Reducing probe card substrate warpage
08/12/2003US6604395 Semi-automated probe bender
08/07/2003US20030146769 Nickel alloy probe card frame laminate
08/06/2003EP1332375A1 Method for making a block for testing components
08/06/2003EP0898712B1 Wafer-level burn-in and test
07/2003
07/31/2003WO2003062836A1 Probe with trapezoidal contactor and device based on application thereof, and method of producing them
07/31/2003WO2003062322A1 Apparatus and method for cleaning test probes
07/24/2003US20030138644 Apparatus and method for cleaning test probes
07/17/2003US20030134441 Micro probing tip made by micro machine method
07/17/2003US20030132027 Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor
07/16/2003CN1430768A Method and device for examining pre-determined area of printed circuit board
07/09/2003EP1301827A4 Photolithographically-patterned out-of-plane coil structures and method of making
07/08/2003US6590294 Device for bump probing and method of fabrication
07/03/2003US20030122569 Probe structure and manufacturing method thereof
07/03/2003US20030122563 Probe card and method for manufacturing the same
07/03/2003US20030122562 Adapting apparatus with detecting and repairing functions and method thereof
07/01/2003US6586955 Methods and structures for electronic probing arrays
06/2003
06/26/2003US20030116346 Low cost area array probe for circuits having solder-ball contacts are manufactured using a wire bonding machine
06/25/2003EP1321978A2 Contact structure
06/19/2003US20030113990 Microelectronic spring contact repair
06/17/2003US6579804 Contact structure and production method thereof and probe contact assembly using same
06/17/2003US6578264 Method for constructing a membrane probe using a depression
06/12/2003WO2003049155A1 System and method for laser micro- machining
06/12/2003US20030106213 Angled flying lead wire bonding process
06/12/2003US20030106209 Method and apparatus for manufacturing known good semiconductor die
06/10/2003US6576485 Contact structure and production method thereof and probe contact assembly using same
06/10/2003US6576301 Micromachining tool over the first abrasive layer, irradiating a beam of electrothermal energy to form a deposition pattern thereon, depositing conductive material in the deposition pattern forming a horizontal portion of the contactor
06/05/2003WO2002061443A9 Nickel alloy probe card frame laminate
06/05/2003US20030102877 Electrical test probes and methods of making the same
06/04/2003EP1316803A2 Lithographic contact elements
06/04/2003EP1135690B1 Lithographic contact elements
06/03/2003US6573738 Multi-layered probe for a probecard
06/03/2003US6573702 Method and apparatus for cleaning electronic test contacts
05/2003
05/29/2003US20030099737 Forming tool for forming a contoured microelectronic spring mold
05/29/2003US20030099097 Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
05/22/2003US20030096519 Microspring with conductive coating deposited on tip after release
05/22/2003US20030094965 Microelectronic fabrication die electrical probe apparatus electrical test method providing enhanced microelectronic fabrication die electrical test accuracy and efficiency
05/20/2003US6566898 Temperature compensated vertical pin probing device
05/20/2003US6566245 Method of manufacturing probe unit and probe unit manufactured using this method
05/20/2003US6566150 Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step
05/20/2003US6566149 Method for manufacturing substrate for inspecting semiconductor device
05/15/2003US20030092365 Apparatuses and methods for cleaning test probes
05/15/2003US20030092206 Method of manufacturing semiconductor apparatus
05/15/2003US20030090280 Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter
05/15/2003US20030089384 Base sheet with a foamed layer having dispersed abrading particles on it and a polishing layer on top of it
05/15/2003US20030088975 Semiconductor test structure having a laser defined current carrying structure
05/15/2003DE10113786C2 Abtastverfahren für ein Eingangssignal mit einer Grundfrequenz Scanning method for an input signal having a fundamental frequency
05/13/2003US6560861 Microspring with conductive coating deposited on tip after release
05/06/2003US6558168 Probe card
05/01/2003WO2003035541A2 Probe needle for testing semiconductor chips and method for producing said probe needle
05/01/2003WO2002101830A3 Electronic components with plurality of contoured microelectronic spring contacts
05/01/2003US20030080770 Method for universal wafer carrier for wafer level die burn-in
04/2003
04/29/2003US6555764 Used to electrically test integrated circuit of large-scale integration device with terminals of integrated circuit being connected to contacts of integrated circuit contactor
04/29/2003US6553661 Semiconductor test structure having a laser defined current carrying structure
04/23/2003EP1304768A2 Spring structure
04/22/2003US6551408 Removal deposits with air vibration
04/17/2003US20030071330 Strength and durability of a spring structure is increased by providing a stress-balancing pad formed on the unlifted anchor portion of the spring metal finger
04/16/2003EP1301827A1 Photolithographically-patterned out-of-plane coil structures and method of making
04/15/2003US6548315 Manufacture method for semiconductor inspection apparatus
04/09/2003EP1300685A2 Chemically etched microcontact
04/03/2003WO2003027689A1 Electrical test probes and methods of making the same
04/03/2003US20030062915 Probe card with contact apparatus and method of manufacture
04/03/2003US20030062398 Method for manufacturing raised electrical contact pattern of controlled geometry
04/01/2003US6540524 Contact structure and production method thereof
03/2003
03/27/2003WO2003025589A1 Contact structure, method of manufacturing the structure, and contact assembly using the structure
03/27/2003WO2003025588A1 Contact structure, method of manufacturing the structure, and contact assembly using the structure
03/27/2003US20030060131 Method of cleaning a probe card
03/27/2003US20030059102 Device and method for investigating predetermined areas of printed circuit boards
03/27/2003US20030057975 Segmented contactor
03/27/2003US20030057957 Method for chemically etching photo-defined micro electrical contacts
03/25/2003US6538214 Method for manufacturing raised electrical contact pattern of controlled geometry
03/18/2003US6535012 Universal wafer carrier for wafer level die burn-in
03/18/2003US6535003 Contact structure having silicon finger contactor
03/13/2003US20030048108 Structural design and processes to control probe position accuracy in a wafer test probe assembly
03/11/2003US6531327 Method for manufacturing semiconductor device utilizing semiconductor testing equipment
03/11/2003US6530805 Contact pin holder assembly
03/11/2003US6530148 Method for making a probe apparatus for testing integrated circuits
03/06/2003US20030045136 IC pocket
03/06/2003US20030042922 Probe having a microstylet and method of manufacturing the same
03/04/2003US6526655 Angled flying lead wire bonding process
02/2003
02/27/2003WO2003017351A1 Probe card manufacturing method
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