| Patents for G01R 3 - Apparatus or processes specially adapted for the manufacture of measuring instruments (2,138) |
|---|
| 11/29/2000 | CN1275204A Grinding chip |
| 11/21/2000 | US6150186 Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive |
| 10/24/2000 | US6137299 Method and apparatus for testing integrated circuit chips |
| 10/19/2000 | DE10003282A1 Probe contact assembly for probe card in semiconductor chip inspection system, has inclined contact pin assembly with conductive layer formed on substrate, which when contacts pad spring power is generated |
| 10/10/2000 | US6130545 Method and apparatus for scrubbing the bond pads of an integrated circuit during wafer sort |
| 10/03/2000 | US6127831 Method of testing a semiconductor device by automatically measuring probe tip parameters |
| 09/19/2000 | US6121058 Method for removing accumulated solder from probe card probing features |
| 09/12/2000 | US6118894 Integrated circuit probe card inspection system |
| 09/12/2000 | US6118289 Cleaning method and cleaning device and cleaning tool for board electrical-test probes, and board electrical-test device and method |
| 09/05/2000 | US6114864 Probe card with plural probe tips on a unitary flexible tongue |
| 08/29/2000 | US6110823 Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method |
| 08/23/2000 | CN1264470A Conductive contact |
| 08/02/2000 | EP1023743A2 Composite electrical contact structure and method for manufacturing the same |
| 08/02/2000 | CN2390208Y Discharging counting checker for hand-held arrester |
| 07/26/2000 | EP1021822A2 Method and apparatus for cleaning electronic test contacts |
| 07/25/2000 | US6094058 Temporary semiconductor package having dense array external contacts |
| 07/18/2000 | US6091254 Universal wafer carrier for wafer level die burn-in |
| 07/18/2000 | US6091251 Discrete die burn-in for nonpackaged die |
| 07/18/2000 | US6091250 Discrete die burn-in for nonpackaged die |
| 07/18/2000 | US6090261 Method and apparatus for controlling plating over a face of a substrate |
| 07/12/2000 | EP1018651A1 Grinding chip |
| 07/11/2000 | US6087845 Universal wafer carrier for wafer level die burn-in |
| 06/21/2000 | EP1010014A2 Magnet core |
| 06/08/2000 | WO2000033089A2 Lithographic contact elements |
| 06/06/2000 | US6072324 Method for testing semiconductor packages using oxide penetrating test contacts |
| 05/31/2000 | DE19957326A1 Contact structures, especially for wafer or chip testing pin cards, are produced by a two-dimensional photolithographic process on a silicon substrate |
| 05/30/2000 | US6068669 Compliant interconnect for testing a semiconductor die |
| 05/09/2000 | US6060893 Carrier having slide connectors for testing unpackaged semiconductor dice |
| 05/09/2000 | US6059982 Micro probe assembly and method of fabrication |
| 05/03/2000 | CN1252129A Method for making cards with multiple contact tips for testing semiconductor chips |
| 04/26/2000 | EP0995996A1 Conductive contact |
| 04/18/2000 | US6049976 Method of mounting free-standing resilient electrical contact structures to electronic components |
| 04/06/2000 | WO1999035505A3 Method for removing accumulated solder from probe card probing features |
| 03/28/2000 | US6042712 Apparatus for controlling plating over a face of a substrate |
| 03/23/2000 | WO2000016107A1 Method for manufacturing substrate for inspecting semiconductor device |
| 03/21/2000 | US6040239 Non-oxidizing touch contact interconnect for semiconductor test systems and method of fabrication |
| 03/15/2000 | EP0764352A4 Microelectronic contacts and assemblies |
| 02/24/2000 | WO2000010016A1 Contactor and production method for contactor |
| 02/22/2000 | US6028425 Signal generator |
| 02/15/2000 | US6024629 Probe apparatus and a method for polishing a probe |
| 02/10/2000 | WO2000007029A1 Holder of electroconductive contactor, and method for producing the same |
| 02/03/2000 | WO2000005595A1 Grinding chip |
| 02/02/2000 | EP0975979A1 Method for making cards with multiple contact tips for testing semiconductor chips |
| 02/01/2000 | US6020624 Semiconductor package with bi-substrate die |
| 02/01/2000 | US6019663 System for cleaning semiconductor device probe |
| 01/18/2000 | US6016061 Cantilever type probe needle for probe card and method of fabrication and control thereof |
| 12/21/1999 | US6005288 Compliant contact system with alignment structure for testing unpackaged semiconductor device |
| 12/14/1999 | US6002266 Socket including centrally distributed test tips for testing unpackaged singulated die |
| 11/23/1999 | US5989994 Method for producing contact structures |
| 11/18/1999 | WO1999036790A3 Test probe interface unit and method of manufacturing the same |
| 11/09/1999 | US5980270 Soldering with resilient contacts |
| 10/26/1999 | US5973405 Composite electrical contact structure and method for manufacturing the same |
| 10/19/1999 | US5968282 Brush with thinner bristles; soft rubber cleaner with inorganic filler; semiconductors |
| 10/13/1999 | CN1045693C Contact structure for interconnections, interposer, semiconductor assembly and method |
| 10/12/1999 | US5966022 Wafer level burn-in system |
| 10/05/1999 | US5961728 The present invention relates to the field of semiconductor testing equipment and, more specifically, to the field of probe cards and probers for semiconductor test systems. |
| 09/23/1999 | WO1999048147A1 Process for manufacturing semiconductor device |
| 09/15/1999 | EP0942288A2 Method and apparatus for assigning pins for electrical testing of printed circuit boards |
| 09/07/1999 | US5949244 Low tolerance probe card and probe ring systems |
| 09/07/1999 | US5949242 Method and apparatus for testing unpackaged semiconductor dice |
| 08/31/1999 | US5946553 Process for manufacturing a semiconductor package with bi-substrate die |
| 08/17/1999 | US5938784 Linear feedback shift register, multiple input signature register, and built-in self test circuit using such registers |
| 08/11/1999 | CN1225724A Wafer-level burn-in and test |
| 08/10/1999 | US5934914 Microelectronic contacts with asperities and methods of making same |
| 08/03/1999 | US5933121 Antenna array for sensing signals on conductors |
| 08/03/1999 | US5932323 Method and apparatus for mounting, inspecting and adjusting probe card needles |
| 07/27/1999 | US5926951 Method of stacking electronic components |
| 07/22/1999 | WO1999036790A2 Test probe interface unit and method of manufacturing the same |
| 07/15/1999 | WO1999035505A2 Method for removing accumulated solder from probe card probing features |
| 07/01/1999 | WO1999013494A3 Method and apparatus for cleaning electronic test contacts |
| 06/30/1999 | EP0925513A1 Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof |
| 06/30/1999 | EP0925509A1 Probe structure having a plurality of discrete insulated probe tips |
| 06/29/1999 | US5917707 Flexible contact structure with an electrically conductive shell |
| 06/29/1999 | US5915755 Method for forming an interconnect for testing unpackaged semiconductor dice |
| 06/22/1999 | US5914614 High density cantilevered probe for electronic devices |
| 06/16/1999 | EP0886894A4 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 06/15/1999 | US5912046 By placing the liquid having solids in suspension in a centrifuge and spinning it about an axis so that liquid is forced against the surface of component |
| 06/01/1999 | US5909121 Method and apparatus for scrubbing the bond pads of an integrated circuit during wafer sort |
| 05/18/1999 | US5905382 Universal wafer carrier for wafer level die burn-in |
| 05/14/1999 | WO1998052052A3 Magnet core |
| 05/11/1999 | US5903161 Electrically conductive rod-shaped single crystal product and assembly for measuring electrical properties employing such product, as well as processes for their production |
| 05/04/1999 | US5900738 Method of testing semiconductor devices |
| 04/20/1999 | US5896036 Carrier for testing semiconductor dice |
| 04/15/1999 | WO1999005701A3 Composite electrical contact structure and method for manufacturing the same |
| 04/07/1999 | CN1213083A Probe for testing semiconductor device and its manufacture method and probe device used thereof |
| 04/06/1999 | US5890390 Method and apparatus for mounting, inspecting and adjusting probe card needles |
| 03/31/1999 | EP0905502A2 A probe apparatus and a method for polishing a probe |
| 03/18/1999 | WO1999013494A2 Method and apparatus for cleaning electronic test contacts |
| 03/09/1999 | US5878486 Method of burning-in semiconductor devices |
| 03/09/1999 | US5878485 Method for fabricating a carrier for testing unpackaged semiconductor dice |
| 03/03/1999 | EP0898712A2 Wafer-level burn-in and test |
| 03/02/1999 | US5877961 Electronic support work station and method of operation |
| 02/17/1999 | CN1208368A Fabricating interconnects and tips using sacrificial substrates |
| 02/04/1999 | WO1999005701A2 Composite electrical contact structure and method for manufacturing the same |
| 01/28/1999 | WO1999004274A1 Conductive contact |
| 01/27/1999 | EP0893695A2 Test probe for semiconductor devices and method of manufacturing of the same |
| 01/19/1999 | US5861759 Automatic probe card planarization system |
| 01/12/1999 | US5859539 For testing multiple semiconductor devices |
| 12/30/1998 | EP0886894A2 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 12/29/1998 | US5852871 Method of making raised contacts on electronic components |