| Patents for G01R 3 - Apparatus or processes specially adapted for the manufacture of measuring instruments (2,138) |
|---|
| 11/08/2001 | WO2001084166A1 Compliant probe apparatus |
| 11/08/2001 | US20010039109 Lithographic contact elements |
| 11/08/2001 | US20010038293 Projection electrode, its forming method and apparatus for testing an electronic component |
| 11/01/2001 | US20010035196 Removal deposits with air vibration |
| 10/25/2001 | WO2001080315A2 Shaped springs and methods of fabricating and using shaped springs |
| 10/23/2001 | US6307392 Probe card and method of forming a probe card |
| 10/18/2001 | US20010031575 High density interconnection test connector especially for verification of integrated circuits |
| 10/12/2001 | CA2305069A1 Micromachined element and method of fabrication thereof |
| 10/09/2001 | US6300780 High density integrated circuit apparatus, test probe and methods of use thereof |
| 10/02/2001 | US6297164 Method for producing contact structures |
| 10/02/2001 | US6295729 Angled flying lead wire bonding process |
| 09/27/2001 | US20010024118 Bondpad attachments having self-limiting properties for penetration of semiconductor die |
| 09/27/2001 | DE10011974A1 Micro-technological current sensor assembly, has conductors arranged closely in line on run-around frame and fixed by insulating plastic cover, after which run-around frame is removed |
| 09/26/2001 | EP1135690A2 Lithographic contact elements |
| 09/25/2001 | US6294028 For reducing the risk of environmental contamination by mercury and mercury salts used during removal of gold ballbonds from the pads of a semiconductor device |
| 09/18/2001 | US6290510 Spring structure with self-aligned release material |
| 09/18/2001 | US6289583 Method for making cards with multiple contact tips for testing semiconductor chips |
| 09/13/2001 | WO2001067116A2 Temperature compensated vertical pin probing device |
| 09/13/2001 | US20010021483 Forming masking layer with aperture; filling with conductive material; removal |
| 09/12/2001 | CN1312910A Holder of electroconductive contactor and method for producing same |
| 09/06/2001 | US20010019177 Method of manufacturing a contact element and a multi-layered wiring substrate, and wafer batch contact board |
| 09/04/2001 | US6285204 Method for testing semiconductor packages using oxide penetrating test contacts |
| 08/28/2001 | US6279227 Method of forming a resilient contact structure |
| 08/23/2001 | US20010015650 Probe card for testing semiconductor integrated circuit and method of manufacturing the same |
| 08/22/2001 | EP0975979B1 Method for making cards with multiple contact tips for testing semiconductor chips |
| 08/21/2001 | US6277218 Conducting a thermal treatment on the probe needles, wherein the temperature of the thermal treatment is about 60 degrees celsius to about 100 degrees celsius and rapidly cooling the probe needles |
| 08/16/2001 | DE10105876A1 Anschlußstruktur und zugehöriges Herstellungsverfahren Terminal structure and manufacturing method thereof |
| 08/14/2001 | US6274823 Interconnection substrates with resilient contact structures on both sides |
| 08/09/2001 | WO2001057541A1 Adapter for testing printed circuit boards and testing needle for such an adapter |
| 08/09/2001 | US20010012739 Composite microelectronic spring structure and method for making same |
| 08/09/2001 | US20010011907 Test interconnect for bumped semiconductor components and method of fabrication |
| 08/09/2001 | DE10004974A1 Adapter for testing circuit boards comprises testing needles and two guide plate units which are laterally movable relative to one another for alignment of the respective guide holes for testing needles |
| 08/01/2001 | EP1120657A1 Test connector with high interconnection density for integrated circuits |
| 07/31/2001 | US6268015 Method of making and using lithographic contact springs |
| 07/26/2001 | US20010009724 Depositing coating on elongate member to give a coated elongate member, coating comprising at least one metal and at least one additive, the additive capable of codepositing with the metal, heat treating; electronics packaging |
| 07/26/2001 | US20010009376 Probe arrangement assembly, method of manufacturing probe arrangement assembly, probe mounting method using probe arrangement assembly, and probe mounting apparatus |
| 07/24/2001 | US6265245 Compliant interconnect for testing a semiconductor die |
| 07/12/2001 | US20010007421 Method and apparatus for cleaning electronic test contacts |
| 07/10/2001 | US6257958 Method for cleaning semiconductor device probe |
| 07/05/2001 | WO2001048818A1 Resilient interconnect structure for electronic components and method for making the same |
| 07/05/2001 | WO2001047831A1 Carbon-containing aluminum nitride sintered compact, and ceramic substrate for use in apparatus for manufacturing and inspecting semiconductor |
| 07/04/2001 | EP1113276A2 Process and apparatus for cleaning contact needles |
| 07/03/2001 | US6255727 Contact structure formed by microfabrication process |
| 07/03/2001 | US6255602 Multiple layer electrical interface |
| 07/03/2001 | US6255126 Lithographic contact elements |
| 07/03/2001 | US6254469 Wafer for cleaning semiconductor device probe |
| 06/28/2001 | WO2001046704A2 A differential, low voltage swing reducer |
| 06/27/2001 | CN1300943A Whisker calibrator for levelling set of whiskers |
| 06/26/2001 | US6252175 Electronic assembly comprising a substrate and a plurality of springable interconnection elements secured to terminals of the substrate |
| 06/21/2001 | US20010004556 Contact structure and production method thereof and probe contact assembly using same |
| 06/13/2001 | DE19952943A1 Nadelkarten-Justageeinrichtung zur Planarisierung von Nadelsätzen einer Nadelkarte Probe card adjusting device for planarization of needle sets a probe card |
| 06/07/2001 | US20010002624 Tip structures. |
| 06/07/2001 | US20010002594 Use of a substrate having an upper side which generates an adhesive force for removing bond pad material deposits from the ends of contacting needles without damaging the bond pads and without effecting the electrical properites of needles |
| 06/05/2001 | US6242803 Semiconductor devices with integral contact structures |
| 05/25/2001 | WO2001036986A1 Probe card |
| 05/23/2001 | EP1102071A1 Holder of electroconductive contactor, and method for producing the same |
| 05/10/2001 | DE19953169A1 Arrangement to allow precise drilling of contact mounting holes in an existing test adapter board for use in testing printed circuit boards with components already mounted on it |
| 05/10/2001 | DE19952183A1 Appliance for forming a needle point used for measurement/testing purposes in biological and engineering oscillates point in grinding powder on oscillating plate |
| 05/09/2001 | EP1098200A2 Adjusting device for the planarization of probe sets of a probe card |
| 05/02/2001 | CN1293824A Process for manufacturing semiconductor device |
| 04/24/2001 | US6222379 Conventionally sized temporary package for testing semiconductor dice |
| 04/24/2001 | US6219908 Method and apparatus for manufacturing known good semiconductor die |
| 04/17/2001 | US6218848 Semiconductor probe card having resistance measuring circuitry and method of fabrication |
| 04/17/2001 | US6218203 Method of producing a contact structure |
| 04/11/2001 | EP1091400A1 Wafer prober |
| 04/10/2001 | US6215670 Method for manufacturing raised electrical contact pattern of controlled geometry |
| 04/10/2001 | US6215322 Conventionally sized temporary package for testing semiconductor dice |
| 04/10/2001 | US6214180 Method for shorting pin grid array pins for plating |
| 04/05/2001 | WO2001023898A1 Method of manufacturing semiconductor inspection |
| 03/27/2001 | US6208156 Test carrier for packaging semiconductor components having contact balls and calibration carrier for calibrating semiconductor test systems |
| 03/27/2001 | US6206273 Structures and processes to create a desired probetip contact geometry on a wafer test probe |
| 03/27/2001 | US6205660 Method of making an electronic contact |
| 03/22/2001 | WO2001020347A1 Nano-drive for high resolution positioning and for positioning of a multi-point probe |
| 03/22/2001 | CA2381803A1 Nano-drive for high resolution positioning and for positioning of a multi-point probe |
| 03/21/2001 | EP1085327A1 Multi-point probe |
| 03/21/2001 | EP1085326A2 Multilayer wiring board, manufacturing method thereof, and wafer block contact board |
| 03/20/2001 | US6204674 Assembly structure for making integrated circuit chip probe cards |
| 03/20/2001 | US6204074 Chip design process for wire bond and flip-chip package |
| 03/20/2001 | US6203411 Method and apparatus for polishing electrical probes |
| 03/08/2001 | WO2000033089A3 Lithographic contact elements |
| 03/08/2001 | DE10023379A1 Thin film probe manufacturing method for testing integrated circuit, involves removing substrate from electrical conducting material after connecting track to electrical conducting material |
| 03/06/2001 | US6197603 Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step |
| 02/15/2001 | DE10037216A1 Connecting structure for forming an electrical connection which can be mounted on a testing card for testing semiconductor wafers comprises a connecting substrate with a connecting element |
| 02/08/2001 | WO2001009623A1 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
| 02/08/2001 | DE10035976A1 Highly reliable test connection structure for large numbers of components on semiconductor wafer or components on PCB, is machine-assembled with great precision in silicon |
| 02/06/2001 | US6184587 Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components |
| 02/01/2001 | WO2001007207A1 Membrane probing system |
| 01/30/2001 | US6181144 Semiconductor probe card having resistance measuring circuitry and method fabrication |
| 01/25/2001 | WO2001006559A1 Wafer prober |
| 01/23/2001 | US6176004 Method of forming a sensor for sensing signals on conductors |
| 01/18/2001 | DE10031543A1 Production of a connecting structure used in the production of electronic circuits comprises producing an insert in a plastic layer formed on a planar substrate |
| 01/18/2001 | DE10015744A1 Contact structure in probe card, has projection made of electrically conducting material provided in contact board to connect contact pad that is in electrical communication with PCB, via contact trace in via hole |
| 01/11/2001 | DE10020713A1 Contact structure for probe card, has contactor formed on dielectric substrate by minute machining operation such that contact section of contactor is perpendicularly formed on one end of horizontal section |
| 01/09/2001 | US6170116 Abrasive member and cleaning device for probe needle for probe card |
| 01/04/2001 | WO2001000659A1 Benzimidazolone peptidomimetics as thrombin receptor antagonists |
| 12/20/2000 | EP1061381A2 Method for optimizing probe card analysis and scrub mark analysis data |
| 12/14/2000 | WO2000075677A1 Segmented contactor |
| 12/06/2000 | EP1023743A4 Composite electrical contact structure and method for manufacturing the same |
| 12/05/2000 | US6156484 One photolithographic masking step in the fabrication of sculpted, uniformly shaped contacts using mask comprising different sized features, through which differing etch rates can be achieved; make array of electrical test probe contacts |
| 12/05/2000 | US6156188 Using the main shaft of an electrodischarge machining machine to mount thereon a probe for effecting the drilling operation of a pcb board; upon completion of the drilling operation, the probe is severed and then fastened with the pcb board |