Patents
Sitemap › G01 - Measuring; Testing › G01R - Measuring electric variables; Measuring magnetic variables › G01R 3 - Apparatus or processes specially adapted for the manufacture of measuring instruments
Patents for G01R 3 - Apparatus or processes specially adapted for the manufacture of measuring instruments (2,138)
12/1998
12/23/1998EP0826152A4 Method and apparatus for testing semiconductor dice
12/17/1998DE19725897A1 Manufacturing method for current detection coil e.g. for circuit breaker applications
12/17/1998DE19725896A1 Method of manufacturing current detection coil e.g. for current transform
12/15/1998US5848465 Method for fabrication of probe
12/01/1998US5844421 Probe control method for leveling probe pins for a probe test sequence
12/01/1998US5844418 Carrier having interchangeable substrate used for testing of semiconductor dies
12/01/1998US5844317 Consolidated chip design for wire bond and flip-chip package technologies
12/01/1998US5843844 Probe sheet and method of manufacturing the same
11/1998
11/24/1998US5841292 Automated test pin loading apparatus
11/19/1998WO1998052052A2 Magnet core
11/17/1998US5838160 Integral rigid chip test probe
11/11/1998EP0859686A4 Fabricating interconnects and tips using sacrificial substrates
11/03/1998US5831443 For testing semiconductor probe cards
11/03/1998US5829126 Method of manufacturing probe card
10/1998
10/28/1998CN1197514A Microelectronic contact structure and method of making same
10/15/1998WO1998045716A1 Method for making cards with multiple contact tips for testing semiconductor chips
10/13/1998US5821763 For probing an electronic device
09/1998
09/30/1998CN1194693A Microelectronic spring contact element
09/29/1998US5815000 Method for testing semiconductor dice with conventionally sized temporary packages
09/22/1998US5811982 High density cantilevered probe for electronic devices
09/16/1998EP0864871A2 Cleaning method, device and tool for board electrical-test probes and board electrical-test device and method
08/1998
08/26/1998EP0859686A1 Fabricating interconnects and tips using sacrificial substrates
08/18/1998US5796264 Apparatus for manufacturing known good semiconductor dice
07/1998
07/14/1998US5781022 Substrate having self limiting contacts for establishing an electrical connection with a semiconductor die
07/14/1998US5778485 Probe card cleaning apparatus, probe apparatus with the cleaning apparatus, and probe card cleaning method
06/1998
06/30/1998US5772451 Sockets for electronic components and methods of connecting to electronic components
06/24/1998EP0729652A4 Contact structure for interconnections, interposer, semiconductor assembly and method
06/09/1998US5763879 Diamond probe tip
06/02/1998US5758537 Method and apparatus for mounting, inspecting and adjusting probe card needles
05/1998
05/26/1998US5756370 Making temporary electrical connection for testing
05/26/1998US5756021 Electronic devices comprising dielectric foamed polymers
05/13/1998EP0841572A2 Wafer-level burn-in system
05/06/1998EP0839323A1 Microelectronic spring contact elements
05/06/1998EP0839322A1 Microelectronic contact structure and method of making same
05/06/1998EP0839321A1 Contact tip structures for microelectronic interconnection elements and methods of making same
04/1998
04/29/1998EP0838685A2 Probe card with needle-like probes resiliently supported by rigid substrate and process for fabricating thereof
04/07/1998US5736279 Accurate drilling of probe holes in the insulating plate of an electrical test head
03/1998
03/19/1998WO1998011449A1 Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof
03/19/1998WO1998011445A1 Probe structure having a plurality of discrete insulated probe tips
03/12/1998WO1997043656A3 Wafer-level burn-in and test
03/10/1998US5726580 Universal wafer carrier for wafer level die burn-in
03/04/1998EP0826152A1 Method and apparatus for testing semiconductor dice
03/03/1998US5723347 Semi-conductor chip test probe and process for manufacturing the probe
02/1998
02/10/1998US5716218 Process for manufacturing an interconnect for testing a semiconductor die
11/1997
11/27/1997WO1997044676A1 Microelectronic contact structure and method of making same
11/25/1997US5691649 Carrier having slide connectors for testing unpackaged semiconductor dice
11/25/1997US5690998 Method of coating a conductive probe needle
11/20/1997WO1997043656A2 Wafer-level burn-in and test
11/20/1997WO1997043654A1 Microelectronic spring contact elements
11/20/1997WO1997043653A1 Contact tip structures for microelectronic interconnection elements and methods of making same
11/18/1997US5689429 Finger wear detection for production line battery tester
11/11/1997US5686317 Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die
10/1997
10/22/1997EP0802419A2 Probe card and method of forming the same
10/21/1997US5678301 Method for forming an interconnect for testing unpackaged semiconductor dice
10/07/1997US5673477 Method of fabricating probe unit
09/1997
09/09/1997US5666063 Method and apparatus for testing an integrated circuit
09/02/1997US5663654 For testing an array of semiconductor dice located on a wafer
08/1997
08/12/1997US5657394 Integrated circuit probe card inspection system
07/1997
07/31/1997WO1997027489A1 Improved method and apparatus for scrubbing the bond pads of an integrated circuit during wafer sort
06/1997
06/24/1997US5640762 Method and apparatus for manufacturing known good semiconductor die
06/03/1997US5635846 Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer
06/03/1997US5634267 Method and apparatus for manufacturing known good semiconductor die
05/1997
05/27/1997US5632631 Microelectronic contacts with asperities and methods of making same
05/07/1997EP0772049A2 Method for fabrication of probe
04/1997
04/29/1997US5625298 Semi-conductor chip test probe
04/01/1997US5615824 Method of making an electrical connection
03/1997
03/26/1997EP0764352A1 Microelectronic contacts and assemblies
03/20/1997WO1996038858A3 Method and probe card for testing semiconductor devices
03/04/1997US5607818 Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition
12/1996
12/17/1996US5585282 Process for forming a raised portion on a projecting contact for electrical testing of a semiconductor
12/05/1996WO1996038858A2 Method and probe card for testing semiconductor devices
11/1996
11/28/1996WO1996037931A1 Spring element electrical contact and methods
11/28/1996WO1996037332A1 Fabricating interconnects and tips using sacrificial substrates
11/28/1996WO1996037331A1 Wire bonding, severing, and ball forming
11/26/1996US5578934 Method and apparatus for testing unpackaged semiconductor dice
11/07/1996WO1996035129A1 Method and apparatus for testing semiconductor dice
11/06/1996CN1135268A Contact structure for interconnections, interposer, semiconductor assembly and method
09/1996
09/25/1996CN1131747A Electronic devices comprising dielectric foamed polymers
09/24/1996US5559444 Method and apparatus for testing unpackaged semiconductor dice
09/04/1996EP0729652A1 Contact structure for interconnections, interposer, semiconductor assembly and method
07/1996
07/30/1996US5541525 Carrier for testing an unpackaged semiconductor die
07/23/1996US5539324 Universal wafer carrier for wafer level die burn-in
07/02/1996US5532613 Probe needle
07/02/1996US5531022 Method of forming a three dimensional high performance interconnection package
05/1996
05/21/1996US5519332 Carrier for testing an unpackaged semiconductor die
05/14/1996US5517127 Additive structure and method for testing semiconductor wire bond dies
05/07/1996US5513430 Method for manufacturing a probe
02/1996
02/27/1996US5495179 Carrier having interchangeable substrate used for testing of semiconductor dies
01/1996
01/30/1996US5487999 Method for fabricating a penetration limited contact having a rough textured surface
12/1995
12/19/1995US5476211 Method of manufacturing electrical contacts, using a sacrificial member
12/14/1995WO1995034106A1 Microelectronic contacts and assemblies
12/14/1995WO1995034000A1 Connecting device and its manufacture
10/1995
10/11/1995EP0664925A4 Interconnection structure for integrated circuits and method for making same.
09/1995
09/26/1995US5453404 Method for making an interconnection structure for integrated circuits
08/1995
08/30/1995EP0669534A1 Method of producing a sensor assembly for an electromagnetic detecting device, and sensor assembly produced thereby
08/08/1995US5440240 Z-axis interconnect for discrete die burn-in for nonpackaged die
08/02/1995EP0664925A1 Interconnection structure for integrated circuits and method for making same
05/1995
05/26/1995WO1995014314A1 Contact structure for interconnections, interposer, semiconductor assembly and method
04/1995
04/18/1995US5408190 Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die
04/05/1995EP0646800A1 Probe for testing semi-conductor chips
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