| Patents for G01R 3 - Apparatus or processes specially adapted for the manufacture of measuring instruments (2,138) |
|---|
| 07/11/2002 | US20020089343 Contact structure for electrical communication with contact targets |
| 07/11/2002 | US20020089342 Method for producing a contact structure |
| 07/04/2002 | US20020086451 Manufacture method for semiconductor inspection apparatus |
| 07/04/2002 | US20020084799 Semiconductor test structure having a laser defined current carrying structure |
| 07/03/2002 | EP1218757A1 Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card |
| 07/02/2002 | US6414477 Method for optimizing probe card analysis and scrub mark analysis data |
| 06/20/2002 | US20020076971 Contact structure and production method thereof |
| 06/20/2002 | US20020075021 Contact structure having silicon finger contactor |
| 06/18/2002 | US6406991 Method of manufacturing a contact element and a multi-layered wiring substrate, and wafer batch contact board |
| 06/13/2002 | WO2002047209A1 Contact structure and production method thereof and probe contact assembly using same |
| 06/13/2002 | US20020072136 Method for manufacturing semiconductor device utilizing semiconductor testing equipment |
| 06/13/2002 | US20020070742 Universal wafer carrier for wafer level die burn-in |
| 06/06/2002 | DE10151125A1 Anschlussstruktur und zugehöriges Herstellungsverfahren sowie die Anschlussstruktur verwendende Prüfanschlussanordnung Terminal structure and manufacturing method thereof, and the connection structure Prüfanschlussanordnung use |
| 06/05/2002 | EP1210208A1 Membrane probing system |
| 06/04/2002 | US6399900 Contact structure formed over a groove |
| 06/04/2002 | US6398561 Contact structure of lead |
| 05/30/2002 | US20020066063 Methods for making contact device for making connection to an electronic circuit device and methods of using the same |
| 05/23/2002 | WO2002041015A1 Kit and method for cleaning socket connection terminal, and electronic part tester |
| 05/23/2002 | US20020061668 Probe card and method of fabricating same |
| 05/22/2002 | CN1350325A Contact structure member and production method thereof, and probe contact assembly using said contact structure member |
| 05/21/2002 | US6392429 Temporary semiconductor package having dense array external contacts |
| 05/14/2002 | US6388549 Magnet core |
| 05/14/2002 | US6388456 Probe card and manufactoring method therefor |
| 05/09/2002 | US20020055282 Electronic components with plurality of contoured microelectronic spring contacts |
| 05/08/2002 | CN1084518C Foamed polymer forming method and electric apparatus using with the same foamed polymer |
| 05/07/2002 | US6384616 Packaging and interconnection of contact structure |
| 05/07/2002 | US6384470 Contact terminal element, contact terminal device |
| 05/02/2002 | WO2002035244A1 Method for making a block for testing components |
| 05/02/2002 | EP1200992A1 Resilient interconnect structure for electronic components and method for making the same |
| 05/02/2002 | EP1200843A1 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
| 04/25/2002 | US20020048973 Contact structure and production method thereof and probe contact assembly using same |
| 04/25/2002 | US20020048954 Contact structure and production method thereof and probe contact assembly using same |
| 04/17/2002 | EP1197756A2 Probe card for testing integrated circuits |
| 04/17/2002 | CN1345087A Contact component and its manufacture and probe contact assembly using the contact component |
| 04/16/2002 | US6372529 Forming elongated probe points useful in testing semiconductor devices |
| 04/11/2002 | US20020041189 Vertical probe card |
| 04/10/2002 | EP1194784A2 Temperature compensated vertical pin probing device |
| 04/02/2002 | US6366105 Electrical test apparatus with gas purge |
| 03/28/2002 | WO2002025298A1 Inspection unit and method of manufacturing substrate |
| 03/28/2002 | WO2001080315A3 Shaped springs and methods of fabricating and using shaped springs |
| 03/28/2002 | DE10145147A1 Connecting structure used for forming electrical connection in highly integrated circuits comprises connecting substrate, connecting elements mounted on horizontal surface of the substrate, base region, and spring region |
| 03/26/2002 | US6361331 Spring structure with self-aligned release material |
| 03/21/2002 | US20020033707 Semiconductor device testing apparatus and semiconductor device manufacturing method using it |
| 03/20/2002 | EP1188061A1 Segmented contactor |
| 03/19/2002 | US6359454 Pick and place mechanism for contactor |
| 03/19/2002 | US6359337 Composite electrical contact structure and method for manufacturing the same |
| 03/19/2002 | US6358762 Manufacture method for semiconductor inspection apparatus |
| 03/14/2002 | US20020031921 Contact structure of lead |
| 03/14/2002 | US20020030479 Work inspection apparatus |
| 03/07/2002 | US20020027444 Packaging and interconnection of contact structure |
| 02/28/2002 | US20020024348 Packaging and interconnection of contact structure |
| 02/28/2002 | US20020023773 Method for manufacturing raised electrical contact patten of controlled geometry |
| 02/26/2002 | US6351133 Packaging and interconnection of contact structure |
| 02/21/2002 | WO2002015653A1 Compliant interconnect assembly |
| 02/21/2002 | WO2002015260A1 Probe, probe card and probe manufacturing method |
| 02/21/2002 | WO2001046704A3 A differential, low voltage swing reducer |
| 02/21/2002 | DE10065965A1 Fertigungsverfahren für einen Stromsensor der Mikrosystemtechnik Manufacturing method for a current sensor microsystem technology |
| 02/19/2002 | US6348805 Method and apparatus for assigning pins for electrical testing of printed circuit boards |
| 02/14/2002 | US20020019196 Wafer for cleaning semiconductor device probe |
| 02/07/2002 | WO2002010780A1 Electrical test probe wedge tip |
| 02/07/2002 | WO2002010779A1 Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card |
| 02/07/2002 | WO2001067116A3 Temperature compensated vertical pin probing device |
| 02/07/2002 | US20020016095 Spring structure with self-aligned release material |
| 02/07/2002 | US20020014004 High density integrated circuit apparatus, test probe and methods of use thereof |
| 02/05/2002 | US6344752 Contactor and production method for contractor |
| 01/31/2002 | WO2002009169A1 Inspection apparatus and probe card |
| 01/31/2002 | US20020013070 Spring structure with self-aligned release material |
| 01/31/2002 | US20020011858 Temperature compensated vertical pin probing device |
| 01/31/2002 | US20020011001 High density integral test probe and fabrication method |
| 01/30/2002 | EP1176635A2 Spring structure and method |
| 01/29/2002 | US6343369 Methods for making contact device for making connection to an electronic circuit device and methods of using the same |
| 01/29/2002 | US6342789 Universal wafer carrier for wafer level die burn-in |
| 01/24/2002 | US20020009904 Probe card |
| 01/24/2002 | US20020008966 Microelectronic contacts with asperities and methods of making same |
| 01/24/2002 | US20020008535 Probe structure and manufacturing method thereof |
| 01/22/2002 | US6340894 Semiconductor testing apparatus including substrate with contact members and conductive polymer interconnect |
| 01/17/2002 | US20020005569 Contact terminal element, contact terminal device, manufacture thereof, and method of measuring semiconductor device |
| 01/08/2002 | US6337572 Electric contact probe unit |
| 01/08/2002 | US6336269 Method of fabricating an interconnection element |
| 01/03/2002 | US20020000821 Contact probe and fabrication method thereof |
| 01/03/2002 | US20020000815 Methods and structures for electronic probing arrays |
| 01/02/2002 | EP0664925B1 Interconnection structure for integrated circuits and method for making same |
| 01/02/2002 | CN1329753A Wafer prober |
| 01/02/2002 | CN1329721A Photoetching contact elements |
| 01/01/2002 | US6334247 High density integrated circuit apparatus, test probe and methods of use thereof |
| 12/27/2001 | US20010054907 High density cantilevered probe for electronic devices |
| 12/27/2001 | US20010054906 Probe card and a method of manufacturing the same |
| 12/25/2001 | US6332270 Method of making high density integral test probe |
| 12/11/2001 | US6329827 High density cantilevered probe for electronic devices |
| 12/06/2001 | DE10025751A1 Verfahren zum Untersuchen einer leiterplatte an einem vorbestimmten Bereich der Leiterplatte und Vorrichtung zum Durchführen des Verfahrens A method of inspecting a circuit board in a predetermined area of the printed circuit board and device for carrying out the method |
| 12/05/2001 | EP1160576A2 Contact probe and fabrication method thereof |
| 11/29/2001 | WO2001091053A1 Method for examining a pre-determined area of a printed circuit board and device for carrying out said method |
| 11/29/2001 | US20010045012 Angled flying lead wire bonding process |
| 11/27/2001 | US6322433 Grinding chip |
| 11/22/2001 | WO2001088612A1 Photolithographically-patterned out-of-plane coil structures and method of making |
| 11/22/2001 | WO2001088551A1 Probe card and method of producing the same |
| 11/22/2001 | US20010044225 Method for forming microelectronic spring structures on a substrate |
| 11/20/2001 | US6320397 Molded plastic carrier for testing semiconductor dice |
| 11/15/2001 | US20010040460 Method of making a high density integral test probe |
| 11/13/2001 | US6316943 Signal generator |