Patents
Patents for G01R 3 - Apparatus or processes specially adapted for the manufacture of measuring instruments (2,138)
10/2007
10/02/2007US7276920 Packaging and interconnection of contact structure
09/2007
09/26/2007CN100339985C Shaped springs and methds of fabricating and using shaped springs
09/25/2007US7274197 Contact system for interfacing a semiconductor wafer to an electrical tester
09/20/2007WO2005076832A3 Method for manufacturing single wall carbon nanotube tips
09/20/2007US20070214875 Cantilever and cantilever manufacturing method
09/19/2007EP1624309B1 Sheet-like probe, process for producing the same and its application
09/18/2007US7271015 Manufacturing method of semiconductor integrated circuit device and probe card
09/12/2007EP1831703A1 Reinforced probes for testing semiconductor devices
09/06/2007US20070207559 Fabrication method of semiconductor integrated circuit device
09/06/2007US20070205783 Sheet-Like Probe, Method Of Producing The Probe, And Application Of The Probe
09/05/2007CN101030548A Micro-mechanical wafer chip test detecting card and its production
08/2007
08/30/2007US20070200574 Sheet-like probe, method of producing the probe, and application of the probe
08/29/2007CN101024480A Method for forming microelectronic spring structures on a substrate
08/23/2007US20070193353 Silicon inertial sensors formed using MEMS
08/22/2007CN1333452C A hollow microprobe using a mems technique and a method of manufacturing the same
08/16/2007US20070190671 Manufacturing method of semiconductor integrated circuit device and probe card
08/14/2007US7256592 Probe with trapezoidal contractor and device based on application thereof, and method of producing them
08/14/2007US7254861 Device for cleaning tip and side surfaces of a probe
08/09/2007US20070180916 Capacitive micromachined ultrasound transducer and methods of making the same
08/08/2007CN101014865A A highly resilient cantilever spring probe for testing ics
08/02/2007US20070178814 Method of cleaning a probe
07/2007
07/25/2007CN101006347A Stacked tip cantilever electrical connector
07/18/2007EP1553623B1 Anisotropic conductivity probe
07/18/2007CN1327502C Inspection device and method for manufacturing the same
07/18/2007CN101002311A Method and apparatus for producing co-planar bonding pads on a substrate
07/17/2007US7245137 Test head assembly having paired contact structures
07/17/2007US7244125 Connector for making electrical contact at semiconductor scales
07/17/2007US7243410 Method for manufacturing a probe card
07/12/2007WO2007078493A1 Probe card assembly
07/12/2007US20070161285 Electrically-conductive-contact holder, electrically-conductive-contact unit, and method for manufacturing electrically-conductive-contact holder
07/03/2007US7239127 Apparatus and method for inspecting electronic circuits
07/03/2007US7237316 Method for fabricating a three-dimensional acceleration sensor
06/2007
06/28/2007US20070145885 Organic el panel
06/28/2007US20070144841 Miniaturized Contact Spring
06/26/2007US7235413 Fabrication method of semiconductor integrated circuit device
06/20/2007EP1798561A1 Treating method for probes positioned on a test card
06/14/2007US20070134824 Probe card and method for manufacturing probe card
06/14/2007DE19957326B4 Verfahren zur Herstellung von Kontaktstrukturen A method for producing contact structures
06/07/2007US20070126444 Probe with trapezoidal contactor and device based on application thereof, and method of producing them
06/07/2007US20070124932 Probe with trapezoidal contactor and device based on application thereof, and method of producing them
05/2007
05/31/2007US20070119233 Sensor for detecting particles in a gas stream and method for its manufacture
05/30/2007CN1973208A A method for providing alignment of a probe
05/30/2007CN1973207A Sheetlike probe, its manufacturing method and its application
05/24/2007US20070117234 Sputtered Spring Films With Low Stress Anisotropy
05/24/2007DE10393364B4 Lochmikrosonde unter Nutzung einer MEMS-Technik und ein Verfahren zur Herstellung derselben Hollow microprobe using an MEMS technique and a method of manufacturing the same
05/22/2007US7219426 Method of manufacturing protruding-volute contact
05/15/2007US7216417 Method for manufacturing an electromechanical sensor element
05/10/2007US20070103181 System and method of mitigating effects of component deflection in a probe card analyzer
05/10/2007US20070103180 Universal wafer carrier for wafer level die burn-in
05/10/2007DE10003282B4 Kontaktstruktur Contact structure
05/09/2007EP1782078A1 A method for providing alignment of a probe
05/09/2007EP1782077A1 Stacked tip cantilever electrical connector
05/09/2007EP1362005B1 Method for forming electrically conductive contact structures
05/09/2007CN1314970C Probe unit and its manufacturing method
05/08/2007US7215131 Segmented contactor
05/08/2007US7213323 Method of forming an electronic pressure sensitive transducer on a printed circuit board
05/02/2007CN1957454A Silicon wafer for probe bonding and probe bonding method using thereof
05/02/2007CN1957259A Sheetlike probe, its manufacturing method and its application
05/01/2007US7212019 Probe needle for testing semiconductor chips and method for producing said probe needle
05/01/2007US7211795 Method for manufacturing single wall carbon nanotube tips
05/01/2007US7211155 Apparatuses and methods for cleaning test probes
04/2007
04/25/2007EP1777194A2 Method for forming microelectronic spring structures on a substrate
04/18/2007EP1774583A2 Method and apparatus for producing co-planar bonding pads on a substrate
04/17/2007US7204010 Method of making a load sensor plate
04/12/2007US20070080698 Contact System for Wafer Level Testing
04/05/2007US20070075716 Probe for testing a device under test
04/05/2007US20070074392 Membrane probing system
04/04/2007CN1308693C Contact probe, method of manufacturing the contact probe, and device and method for inspection
04/03/2007US7198962 Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step
03/2007
03/29/2007US20070069744 Board for probe card, inspection apparatus, photo-fabrication apparatus and photo-fabrication method
03/29/2007US20070069743 Sheet-like probe, process for producing the same and its application
03/21/2007EP1365250B1 Method of manufacturing contact probe
03/21/2007CN1933119A Contactor having contact electrodes formed by laser processing
03/13/2007US7189078 See-saw interconnect assembly with dielectric carrier grid providing spring suspension
03/13/2007US7189077 Lithographic type microelectronic spring structures with improved contours
03/08/2007US20070054513 Methods of fabricating and using shaped springs
03/07/2007CN1926676A Probe positioning and bonding device and probe bonding method
03/07/2007CN1926438A See-saw interconnect assembly with dielectric carrier grid providing spring suspension
03/01/2007US20070045874 Lithographic Type Microelectronic Spring Structures with Improved Contours
03/01/2007US20070044545 Oscillator and method of making for atomic force microscope and other applications
02/2007
02/22/2007US20070039387 Movement detector having six degrees of freedom with three position sensors and method for the production of a sensor
02/20/2007US7180312 Probe card and method for manufacturing probe card
02/20/2007US7178236 Method for constructing a membrane probe using a depression
02/13/2007US7176702 Contact system for wafer level testing
02/13/2007US7174629 Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor
02/08/2007WO2007016599A1 Method and apparatus for cleaning a probe card
02/08/2007WO2007015713A1 Torsion spring probe contactor design
02/08/2007US20070028667 Electronic nose sensor array, sensor system including the same, method of manufacturing the same, and analysis method using the sensor system
02/07/2007CN1299344C Device for testing semiconductor device
02/06/2007US7172707 Sputtered spring films with low stress anisotropy
01/2007
01/30/2007US7170307 System and method of mitigating effects of component deflection in a probe card analyzer
01/24/2007CN1900725A Lithographic contact elements
01/24/2007CN1296716C Probe device and its manufacturing method
01/23/2007US7167014 Method for testing using a universal wafer carrier for wafer level die burn-in
01/23/2007US7167012 Universal wafer carrier for wafer level die burn-in
01/18/2007US20070012108 Method for manufacturing a micromechanical motion sensor, and a micromechanical motion sensor
01/18/2007US20070012087 Sensor
01/17/2007EP1744167A1 Sheet-like probe, method of producing the probe, and application of the probe
01/17/2007EP1744166A1 Sheet-like probe, method of producing the probe, and application of the probe
01/17/2007CN1898572A Conductive contact holder, conductive contact unit and process for producing conductive contact holder
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