Patents
Sitemap › C25 - Electrolytic or electrophoretic processes; Apparatus therefor › C25D - Processes for the electrolytic or electrophoretic production of coatings; Electroforming; Joining workpieces by electrolysis; Apparatus therefor › C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
11/1998
11/05/1998WO1998049374A2 Device for electrolytic treatment of printed circuit boards and conductive films
11/05/1998DE19738513C1 Palladium alloy membrane foil for hydrogen separation
11/05/1998CA2287274A1 Apparatus for electrolytically treating printed circuit boards and conductor foils
11/05/1998CA2287251A1 Apparatus for electrolytically treating a board-like item to be treated and method of electrically shielding edge regions of the item to be treated during the electrolytic treatment
11/04/1998EP0875603A1 Coated article
11/04/1998EP0875602A1 Article having a coating
11/04/1998EP0875601A1 Coated article
11/04/1998EP0875600A1 Coated article
11/04/1998EP0875599A1 Coated article
11/04/1998EP0875598A1 Article having a decorative and protective multi-layer coating
11/04/1998EP0875597A1 Article having a decorative and protective multi-layer coating
11/04/1998EP0875596A1 Article having a decorative and protective coating
11/04/1998EP0874921A1 Process and system for electrochemical treatment of long stretched-out items
11/04/1998EP0874920A1 Process and device for the electrochemical treatment of items with a fluid
11/04/1998CN1198293A Copper foil for manufacture of printed circuits and method of producing same
11/03/1998US5830334 Nozzle for fast plating with plating solution jetting and suctioning functions
11/03/1998US5829128 Method of mounting resilient contact structures to semiconductor devices
10/1998
10/29/1998DE19803490A1 Electrodeposition unit for semiconductor wafer coating
10/29/1998DE19717512A1 Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen Apparatus for electroplating of printed circuit boards under constant conditions in continuous flow systems
10/28/1998EP0741804B1 Process and device for the electrolytic metal coating or etching of articles
10/27/1998US5827410 Device for the electrolytic treatment of plate-shaped workpieces
10/27/1998US5826516 For screen printing of solder paste
10/22/1998WO1998046810A1 Bipolar electrochemical connection of materials
10/22/1998WO1998046809A1 A method for electroplating with a refractory metal
10/22/1998DE19716428A1 Zinc-coated steel products
10/22/1998DE19716375A1 Two-stage zinc electroplating of metal article
10/22/1998DE19716044A1 Selective solder electrodeposition on circuit board pads
10/22/1998CA2288658A1 A method for electroplating with a refractory metal
10/21/1998CN1196402A Two-colour forming method for metal
10/21/1998CN1040345C Method for sintering oxide film by electro-chemical deposition-thermal decomposition
10/15/1998WO1998045505A1 Method of electroplating nonconductive plastic molded product
10/15/1998WO1998045504A1 Article, method, and apparatus for electrochemical fabrication
10/15/1998CA2572786A1 Method for electrochemical fabrication including etching to remove flash
10/15/1998CA2572503A1 Method for electrochemical fabrication including enhanced data manipulation
10/15/1998CA2572499A1 Method for electrochemical fabrication including use of multiple structural and/or sacrificial materials
10/14/1998EP0662984B1 Process for treating plastic surfaces and swelling solution
10/14/1998CN2294267Y Device and apparatus for chlorination of electrode of electroencephalograph
10/14/1998CN1196161A Process for producing through-connected printed circuit board and multilayered printed circuit board
10/14/1998CN1195716A Method and apparatus for sequentially metalizing polymeric films and products made thereby
10/13/1998US5821686 Inner-shield material to be attached inside a color cathode ray tube
10/07/1998EP0869549A2 Solder bump formation
10/07/1998EP0868545A1 Process and circuitry for generating current pulses for electrolytic metal deposition
10/07/1998CN1195034A Strip composite material and its producing method and device
10/06/1998US5817422 Optical apparatus having a highly diffusive metal surface layer
10/01/1998DE19717510C1 Vorrichtung zur Abblendung von Galvanisiergut in Durchlaufanlagen Device for dimming of electroplated in continuous flow systems
09/1998
09/30/1998EP0867529A1 A method and apparatus for sequentially metalizing polymeric films and products made thereby
09/26/1998CA2233339A1 Coated subtrate and process for production thereof
09/24/1998DE19711857A1 Electrode structure for accumulators
09/23/1998EP0866149A2 Zinciferous coated steel sheet and method for producing the same
09/22/1998US5810992 Electroplating of iron-cobalt alloy onto aluminum alloy parts
09/22/1998US5810991 Pickling sheet to deposit tin to cover surface irregularities prior to zinc deposition; good whiteness, smoothness
09/22/1998US5810990 Method for plating and finishing a cylinder bore
09/22/1998CA2060044C Method for making a steel sheet useful in making a high strength drawn and ironed can
09/17/1998WO1998040920A2 Method for manufacturing a bipolar plate
09/17/1998WO1998040542A1 A method for chromating metals having surface oxide layers
09/17/1998WO1998040539A1 Electroplating apparatus and process for reducing oxidation of oxidizable plating anions and cations
09/17/1998WO1998040538A2 Method for electrolytic deposition of a smooth surface metal on a substrate using graphite dispersion
09/17/1998WO1998040537A1 Graded metal hardware component for an electrochemical cell
09/17/1998DE19806360A1 Verfahren zum elektrolytischen Abscheiden einer Metallschicht mit glatter Oberfläche auf einem Substrat unter Verwendung einer Graphitdispersion A method for the electrolytic deposition of a metal layer with a smooth surface on a substrate using a graphite dispersion
09/16/1998CN1193293A Ultra-thin steel sheet and mfg. method therefor
09/15/1998US5807469 For integrated circuits
09/14/1998CA2231205A1 Process for the back side coating of metal components and product produced therefrom
09/11/1998WO1998039105A1 Metal-plating of cured and sintered transient liquid phase sintering pastes
09/09/1998EP0862665A1 Process for the electrolytic deposition of metal layers
09/09/1998CN1192487A Plated aluminum alloy, cylinder block thereof, planting line and planting method
09/09/1998CN1039728C Method for making multi-layer metallic pattern
09/08/1998US5804466 Electroplating using zinc nitrate aqueous solution containing carbohydrates such as mono, di or polysaccharides; excellent adhesion to the substrate
09/08/1998US5804054 Preparation of copper indium gallium diselenide films for solar cells
09/08/1998US5804053 Continuously electroplated foam of improved weight distribution
09/08/1998US5804052 Method and device for continuous uniform electrolytic metallizing or etching
09/03/1998WO1998038357A1 Circuitry and method for an electroplating plant or etching plant pulse power supply
09/03/1998CA2282391A1 Circuit arrangement and method for supplying pulse current to electroplating or etching systems
09/01/1998US5800930 Nodular copper/nickel alloy treatment for copper foil
09/01/1998US5800858 Method for conditioning halogenated polymeric materials and structures fabricated therewith
09/01/1998US5800695 Plating turbine engine components
08/1998
08/27/1998WO1998037261A1 Production of conductive metal substrates for battery electrodes
08/27/1998WO1998036850A1 Method of manufacturing a plated vehicle wheel having non-plated tire bead seats
08/27/1998DE19738970A1 Electroplating apparatus for electroplating semiconductor substrate
08/26/1998EP0859877A1 Flexible continuous cathode contact circuit for electrolytic plating of c4, tab microbumps, and ultra large scale interconnects
08/26/1998EP0859686A1 Fabricating interconnects and tips using sacrificial substrates
08/26/1998CN1191500A Ribbon-like core interconnection elements
08/26/1998CN1191392A Multi-layer plated lead frame
08/25/1998US5798138 Method of selectively metallising an inner, electrically insulating surface of an open body
08/25/1998US5798033 Process for preparing porous metallic body and porous metallic body for battery electrode substrate prepared therefrom
08/20/1998WO1998036107A1 Plating apparatus and method
08/19/1998EP0859419A1 Core body for electrode base of secondary cell, process for manufacturing the core body, electrode base of secondary cell, process for manufacturing the electrode base, and electrode and battery using them
08/19/1998EP0859071A2 Process for selective galvanic coating of electrical contact elements
08/19/1998EP0858520A1 A method for coating titanium and titanium alloys with ceramics
08/19/1998CN2288188Y Magnetoplating device
08/18/1998US5795662 Zincate-treated article of Al-Mg-Si base alloy and method of manufacturing the same
08/18/1998US5795460 Method for removal of films from metal surfaces using electrolysis and cavitation action
08/12/1998EP0858099A2 Method of treating substrate and apparatus for the same
08/12/1998CN1190443A Roll forming structure steel profiles with galvanised coating
08/11/1998US5792595 Exposing photoresist layer to light, developing to form resist pattern, forming electrolytically plated layer, superposing photosensitive sheet on substrate, forming metal pattern
08/11/1998US5792565 Multiple layered article having a bright copper layer
08/11/1998US5792333 Subjecting at least one side of foil to electroplating using an alternating current, wherein a sulfuric acid bath or a sulfuric acid/copper sulfate bath is used as electrolyte
08/11/1998US5792265 Device and process for producing reinforcing layers on cylinder running surfaces of internal combustion engines and the like
08/06/1998WO1998033959A1 Method for electroplating nonconductive material
08/06/1998WO1998033951A1 Composition and method for priming substrate materials
08/06/1998CA2278580A1 Composition and method for priming substrate materials
1 ... 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 ... 179