C25D 3 - Electroplating; Baths therefor

Patents for C25D 3 - Electroplating; Baths therefor (11,896)
11/2006
11/09/2006	US20060249392 Method to reduce ferric ions in ferrous based plating baths
11/08/2006	EP1719827A1 Composite chromium plating film and sliding member having the same and its production method
11/08/2006	EP1719826A1 Electroplating solution composition for organic polymer-zinc alloy composite plating and plated metal material using such composition
11/08/2006	EP1719825A1 Electroplated coating of zinc alloy with excellent corrosion resistance and plated metal material having same
11/08/2006	EP1718786A1 Baths, systems and processes for electroplating zinc-nickel ternary and higher alloys and articles so electroplated
11/08/2006	EP1718780A1 High-carbon steel wire with nickel sub coating
11/08/2006	EP1579031A4 Peel strength enhancement of copper laminates 102426-201
11/08/2006	EP1324979B1 Ionic liquids and their use as solvents
11/08/2006	EP1214191A4 Treated copper foil and process for making treated copper foil
11/08/2006	CN1860257A Electrolyte for the galvanic deposition of aluminum-magnesium alloys
11/08/2006	CN1858306A Process for cathode electrolytic deposition of rare-earth conversion film
11/08/2006	CN1283848C Method of copper-plating small-diameter holes
11/08/2006	CN1283846C Polishing agent for alkaline non-cyanide zincate zinc plating and process for preparing polishing agent composition
11/02/2006	WO2006114305A1 Alkaline electroplating bath having a filtration membrane
11/02/2006	US20060243599 Electroplating additive for improved reliability
11/02/2006	US20060243598 Auxiliary electrode encased in cation exchange membrane tube for electroplating cell
11/02/2006	EP1717353A1 Alkaline galvanizing bath comprising a filtration membrane
11/02/2006	EP1717351A1 Galvanic bath
11/02/2006	CA2600273A1 Alkaline electroplating bath having a filtration membrane
11/01/2006	CN1854352A Galvanic bath
11/01/2006	CN1854351A Zn Fe-SiO2 composite cell liquor
11/01/2006	CN1854350A Method for electroplating ZnFe-SiO2 iron and steel parts
10/2006
10/31/2006	US7128981 Sliding member
10/31/2006	US7128823 Anolyte for copper plating
10/31/2006	US7128822 Leveler compounds
10/31/2006	US7128821 Immersing the wafer in an electropolishing electrolyte solution and removing defects and particles from the wafer by rotational friction between the wafer and the electrolyte solution in combination with electrolysis
10/26/2006	WO2006113473A1 Method for electrodeposition of bronzes
10/26/2006	WO2006111837A2 Method for production of foamed metal
10/26/2006	US20060237325 Cu ecp planarization by insertion of polymer treatment step between gap fill and bulk fill steps
10/26/2006	US20060237324 Pulse plating process for deposition of gold-tin alloy
10/25/2006	EP1715081A1 Alloy coating for diffusion barrier, method for forming same, and high-temperature device member
10/25/2006	EP1343924B1 Improvements relating to metal finishes
10/19/2006	WO2006110864A2 Method for improving surface roughness during electro-polishing
10/19/2006	WO2006110178A2 Use of controlled atmosphere plasma spray combined with electrodeposition to fabricate a rocket engine chamber
10/19/2006	WO2006108476A2 Electrolyte and method for depositing tin bismuth alloy layers
10/19/2006	US20060234067 Laser gilding film containing curing coating and manufacture thereof
10/19/2006	US20060231409 Plating solution, conductive material, and surface treatment method of conductive material
10/19/2006	DE19960606B4 Verfahren zur Verbesserung der Korrosionsbeständigkeit von Stahlgegenständen A process for improving the corrosion resistance of steel articles
10/19/2006	DE102005016819A1 Elektrolyt und Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten Electrolyte and process for deposition of tin-bismuth alloy layers
10/18/2006	EP1711961A2 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
10/18/2006	CN1847463A Chrome plating component
10/18/2006	CN1846990A Multi-layer coating having excellent adhesion and sliding properties and production method thereof
10/18/2006	CN1280452C Copper plating bath and method for plating substrate by using the same and substrate treating unit
10/17/2006	US7122108 Tin-silver electrolyte
10/17/2006	US7122105 Use of siderophores to increase the current efficiency of iron plating solutions
10/12/2006	US20060228569 Production method of substrate with black film and substrate with black film
10/12/2006	US20060226021 Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit
10/12/2006	US20060226014 Method and process for improved uniformity of electrochemical plating films produced in semiconductor device processing
10/12/2006	US20060226002 Insoluble anode
10/11/2006	EP1709215A2 Chromium-free antitarnish adhesion promoting treatment composition
10/11/2006	EP1361837B1 Endoprothesis with galvanised silver layer
10/11/2006	CN1846077A Laminated composite material, production and use thereof
10/11/2006	CN1846076A Layered composite material for plain bearings, production and use thereof
10/11/2006	CN1844478A Process for electrochemical deposition preparation of solar cell film materials
10/11/2006	CN1844477A Electrolytic copper foil coating excellent in chemical resistance and cohesive force and its surface treatment method
10/11/2006	CN1844476A Subacidity bath for electroplating Sn-Ag-Cu alloy coating and electroplating method therefor
10/11/2006	CN1844462A Ni-S active cathode for hydrogen evolution with gradient structure and method for preparing same
10/11/2006	CN1279217C Method for controlling tin loss in tin or tin alloys electroplating solution oxidation
10/11/2006	CN1279216C Process and composition for high speed plating of tin and tin alloys
10/04/2006	CN2823558Y Monomeic hydraulic prop movable prop with composite protection layer surface for mine
10/04/2006	CN1840737A Reflective and resistant coatings and methods for applying to composite structures
10/04/2006	CN1840218A Method for preparing environment-friendly electroplating powder
10/04/2006	CN1277958C Electroplating method
10/03/2006	US7115325 Controlling particle sizes; metal plating solution
10/03/2006	US7115197 Plating crushable zinc alloy; alkaline pH
10/03/2006	US7115196 Coating or coppering substrates such as semiconductor wafers in electrolytic cells to form electroconductive layers that are readily annealed at low temperatures; electrical and electronic apparatus
09/2006
09/28/2006	WO2006101141A1 Molten salt composition and use thereof
09/28/2006	WO2006043994A3 Process for preparing a non-conductive substrate for electroplating
09/28/2006	US20060213780 Electroplating composition and method
09/27/2006	EP1705267A1 Tin-plated product and method for producing same
09/27/2006	CN1837415A Acid electrolytes
09/27/2006	CN1837414A Addictive for tin-electroplating solution of tin methane sulphonate series
09/27/2006	CN1837413A Composition for plating pure tin and electronic component employing the same
09/26/2006	US7113367 FeNiRe soft magnetic film and thin film magnetic head using the same for simultaneous adjustment of resistivity and saturated magnetic flux density
09/21/2006	US20060210823 Low surface roughness electrolytic copper foil and process for producing the same
09/21/2006	US20060207886 Water-soluble copper salt, sulfuric acid, chloride ions, anda leveler of a quaternary polyvinylimidazolium and a copolymer of a vinylpyrrolidone and a quaternary vinylimidazolium; excellent filling properties in plating of blind via-holes with small diameter, high aspect ratio and through-holes
09/20/2006	EP1702090A1 Zinc or zinc alloy deposition installation
09/20/2006	EP1702018A2 Chambers, systems, and methods for electrochemically processing microfeature workpieces
09/20/2006	CN2818504Y Coninuous production line of alkali zinc-plated and coating-resistant fingerprint film on rolling plate
09/20/2006	CN1834303A Method of increasing tightness of electrical deposition growth deposition of zinc thin layer
09/20/2006	CN1834302A Copper foil and producing method thereof, flexible printed wiring board
09/20/2006	CN1833881A Prodn. technique of hollowed-out plane thin sheet metallic handicraft
09/19/2006	US7109375 Co-polymer comprising: one or more di- tertiary amines including an amide or thioamide functional group linked to unsaturated tertiary amine compound;
09/14/2006	WO2006094755A1 Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit
09/14/2006	US20060201820 Aqueous zinc-nickel electroplating alkaline bath, comprising water zinc compound, nickel compound, complexing agent and polyoxyalkylene nonionic surfactant; alloying; smoothness, ductility
09/14/2006	US20060201801 Electrochemical cell suitable for use in electronic device
09/14/2006	CA2599183A1 Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit
09/13/2006	CN1833054A Aqueous, acidic solution and method for electrolytically depositing copper coatings as well as use of said solution
09/13/2006	CN1831203A Electrolytic copper foil
09/13/2006	CN1274457C Method for preparing assembly with brazed parts
09/12/2006	US7105082 Using a metal compound; polymerization inhibitor ,promoter and electrolyte; heating, controlling temperature
09/07/2006	US20060198988 Coated metal article and method of making same
09/07/2006	US20060196775 Methods and apparatuses for electrochemical deposition
09/06/2006	EP1697561A1 Copper electrodeposition in microelectronics
09/06/2006	CN1829010A Partial electric plating method for box type structure jack contact of electric connector
09/06/2006	CN1829000A Steel earthing pole and its chemical nickel-plating surface processing method
09/06/2006	CN1827853A Forming method and model manufactured by the forming method
09/06/2006	CN1827337A Electroplating hot-pressing diamond saw blade and method for manufacturing same
09/06/2006	CN1273648C Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion
08/2006
08/31/2006	WO2006072784A3 Nanoporous filter

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