| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 01/16/2007 | US7163915 Aqueous solutions containing dithionic acid and/or metal dithionate for metal finishing |
| 01/11/2007 | WO2007004581A1 Sn-PLATED COPPER ALLOY BAR HAVING EXCELLENT FATIGUE CHARACTERISTICS |
| 01/11/2007 | WO2007003956A2 Eutectic mixtures based upon multivalent metal ions |
| 01/11/2007 | WO2006053062A3 Tin alloy electroplating system |
| 01/11/2007 | WO2003000937A3 Heat treatment method for a cold-rolled strip with an ni and/or co surface coating, sheet metal producible by said method and battery can producible by said method |
| 01/11/2007 | US20070007144 Tin electrodeposits having properties or characteristics that minimize tin whisker growth |
| 01/11/2007 | US20070007143 electroplating copper on a printed circuit board; leveling agent is a reaction product of the diglycidyl ether of a diol and heterocylic compound (imidazole, triazole, tetrazole, benzimidazole, benzotriazole, piperidine, morpholine, piperazine, pyridine); does not negatively impact the throwing power |
| 01/10/2007 | EP1741805A1 Composite plated product and method for producing same |
| 01/10/2007 | EP1741804A1 Electrolytic copper plating method |
| 01/10/2007 | EP1192297B1 Acidic bath for galvanic deposition of lustrous gold and gold alloy layers and lustring additive therfor |
| 01/10/2007 | CN1891673A Method for preparing diamond film surface metal patternization |
| 01/09/2007 | US7160629 A bright tin or bright lead-free tin-alloy having no whiskers after 4 months storage at 52 degrees C. and 98% relative humidity; preferred alloying elements are nickel, copper, bismuth, zinc, silver or indium; prepared from a solution of acidic electrolytes and carboxylated polyalkyleneimines |
| 01/09/2007 | CA2385468C Integrated circuit plating using highly-complexed copper plating baths |
| 01/04/2007 | WO2007002424A1 Silver barrier layer to minimize whisker growth in tin electrodeposits |
| 01/04/2007 | WO2007000109A1 Soft blackplates for tinning and production method for the same |
| 01/04/2007 | WO2007000108A1 Soft blackplates with hardness hr30t of 51±3 for tinning and production method for the same |
| 01/03/2007 | EP1738000A2 Production of a structured hard chromium layer and production of a coating |
| 01/03/2007 | CN1888143A Electrogalvanized steel plate and steel plate electrogalvanizing process |
| 01/03/2007 | CN1293235C Copper electrolyte and electrolytic copper foil prepared using the same |
| 01/02/2007 | US7156851 Implant and process of modifying an implant surface |
| 12/28/2006 | WO2005021836A3 Chromium-free antitarnish adhesion promoting treatment composition |
| 12/28/2006 | CA2510958A1 Titanium nitride-covered safety shoe reinforcement element and method of making same |
| 12/27/2006 | CN1885594A Method for preparing lithium ion battery negative electrode material |
| 12/27/2006 | CN1885443A Method for improving critical current density of Bi-2223 strip material |
| 12/27/2006 | CN1292097C Additive for electroplating liquid and its use in tin-lead alloy plating |
| 12/26/2006 | US7153590 Composite copper foil and manufacturing method thereof |
| 12/26/2006 | US7153408 deposit has a stable hardness and is free from self-annealing during high speed plating; copper methane sulphonate. methane sulphonic acid, hydrochloric acid as source of chloride ions, an alkylthioalkylsulfonic acid, and a polyether |
| 12/21/2006 | WO2006135735A2 Enhanced transparent conductive coatings and methods for making them |
| 12/21/2006 | WO2006052310A3 Nickel electroplating bath designed to replace monovalent copper strike solutions |
| 12/21/2006 | US20060286398 Layered composite meterial for plain bearings, production and use thereof |
| 12/21/2006 | US20060283716 Method of direct plating of copper on a ruthenium alloy |
| 12/21/2006 | US20060283715 Zinc-nickel alloy electroplating system |
| 12/21/2006 | US20060283714 Sources of gold ions, silver ions, and copper ions; a mercaptotetrazole or mercaptotriazole; and a dithiocarboxylic acid having a non-protic carbon atom in alpha position to the acid group or salts or esters (4-methylimidazole-5-dithiocarboxylic acid); improved brightness and color uniformity. |
| 12/21/2006 | DE10223957B4 Ein verbessertes Verfahren zum Elektroplattieren von Kupfer auf einer strukturierten dielektrischen Schicht An improved method for electroplating copper on a patterned dielectric layer |
| 12/20/2006 | CN1882719A Improved copper bath for electroplating fine circuitry on semiconductor chips |
| 12/20/2006 | CN1882550A Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds |
| 12/20/2006 | CN1880512A Trivalent chromium electroplating solution in sulfate system and method for preparing same |
| 12/20/2006 | CN1291068C Process for extracting Zn-Ni alloy from electrolyte |
| 12/19/2006 | US7151049 Electroplating compositions and methods |
| 12/19/2006 | US7150939 Surface-treated steel sheet for battery container, a battery container, and a battery using same |
| 12/19/2006 | US7150819 Structure and plating method of thin film magnetic head and magnetic storage apparatus |
| 12/19/2006 | US7150818 Process for electrochemical deposition of tantalum and an article having a surface modification |
| 12/19/2006 | US7150781 Pyrophosphoric acid bath for use in copper-tin alloy plating |
| 12/13/2006 | EP1732113A2 Silver metallization by damascene method |
| 12/13/2006 | EP1731631A2 Production of a composite material |
| 12/13/2006 | CN1876897A Electroplating aqueous solution for quick nickel plating of porous substrate |
| 12/13/2006 | CN1290385C Printed wiring board-use copper foil and copper clad laminated sheet using printed wiring board-use copper foil |
| 12/13/2006 | CN1290160C Metallization method for producing integrated circuit copper interconnecting wire by separating bipolar acid chemical plating |
| 12/13/2006 | CN1289718C Zn-Ni-RE electroplating layer and its electroplating method |
| 12/13/2006 | CN1289717C Steel parts plated by Zn-Fe-SiO2 |
| 12/13/2006 | CN1289716C Palladium electroplating liquid |
| 12/12/2006 | US7147896 Surface of zirconia ceramic is cleaned, acid etched, rinsed; activating surface is achieved by first applying a tin sensitizer, rinsing, and then a palladium activator, then applying electroless nickel to surface of material and rinsing; surface can be subsequently plated with gold, nickel, copper, tin |
| 12/12/2006 | US7147767 Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor |
| 12/12/2006 | US7147766 Depositing barrier layer; depositing seed layer of metal on barrier layer; removing seed layer from barrier layer, electroplating metal using portion of seed layer and exposed portions of barrier layer; removing excess plated metal |
| 12/07/2006 | WO2006129886A1 Plating method, electrically conductive film and light-transmitting electromagnetic wave shielding film |
| 12/07/2006 | WO2006129806A1 Separator for fuel cell and method for manufacturing the same |
| 12/07/2006 | WO2006129540A1 Nb-Al TYPE SUPERCONDUCTING WIRE HAVING STABILIZING COPPER DEPOSIT TENACIOUSLY ADHERENT THERETO AND PROCESS FOR PRODUCING THE SAME |
| 12/07/2006 | US20060272951 Electroplating process and composition |
| 12/07/2006 | US20060272950 High purity electrolytic sulfonic acid solutions |
| 12/07/2006 | US20060272949 electrodeposition of nanostructure particle size metals selected from tungsten, molybdenum, nickel and cobalt, to form crack and void free protective coatings, having corrosion and wear resistance |
| 12/06/2006 | EP1728898A2 Electrolytes for the deposition of gold alloys |
| 12/06/2006 | CN1873511A Negative magnetic permeability material in aperiodic infrared band |
| 12/06/2006 | CN1873058A Plating solution, conductive material, and surface treatment method of conductive material |
| 12/06/2006 | CN1288946C Method for preparing surface treated copper foil |
| 12/06/2006 | CN1288945C Method for preparing surface treated copper foil |
| 12/06/2006 | CN1288279C Detin liquid and its preparation technology and use |
| 12/06/2006 | CN1288109C Metallized ceramic for microwave megnetron and it production method |
| 12/05/2006 | US7144768 Fabrication of titanium and titanium alloy anode for dielectric and insulated films |
| 12/05/2006 | US7144637 Multilayer, corrosion-resistant finish and method |
| 12/05/2006 | US7144491 Used in the manufacture of an electrolytic copper foil that allows fine patterning and that is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures |
| 12/05/2006 | US7144489 Adding saccharic acid or a salt or lactone as an additive to the electroplating solution; contacting the additive with an iron(III) species to form an iron(III)-additive species; irradiating the electroplating solution |
| 11/30/2006 | WO2006127320A2 Electroplating apparatus based on an array of anodes |
| 11/30/2006 | US20060266800 Copper welding solid wire with good arc stability |
| 11/30/2006 | US20060266655 Multiple chemistry electrochemical plating method |
| 11/30/2006 | DE102005024116A1 Preparation of iridium precipitate comprises reacting iridium compound with an alkaline compound in a solvent under iridium-containing precipitate in the presence of compound such as oxalic acid and formic acid |
| 11/29/2006 | CN1871375A Workpieces coated with an aluminum/magnesium alloy |
| 11/29/2006 | CN1868657A Solid copper plating welding wires with excellent arc stability |
| 11/23/2006 | US20060263625 Laminated composite material, production and use thereof |
| 11/23/2006 | US20060260948 Method for electrodeposition of bronzes |
| 11/23/2006 | DE19643091B4 Verwendung von wasserlöslichen Reaktionsprodukten aus Polyamidoaminen, Polyaminen und Epihalogenhydrin in galvanischen Bädern sowie Verfahren zu ihrer Herstellung und galvanische Bäder, die diese enthalten Use of water-soluble reaction products of polyamidoamines, polyamines and epihalogenohydrin in electroplating baths and methods for their preparation and plating baths containing these |
| 11/23/2006 | DE102005022692A1 Verfahren zur Herstellung beschichteter Oberflächen und Verwendung derselben A process for preparing coated surfaces, and using the same |
| 11/22/2006 | CN1867704A Electrolytic method for phosphating metal surfaces and phosphated metal layer |
| 11/22/2006 | CN1867703A Electroplating compositions and methods for electroplating |
| 11/22/2006 | CN1865517A Process for preparing cyanide-free alkaline zinc-electroplating anti-fingerprint rolled board |
| 11/22/2006 | CN1865516A Electroplating solution and electroplating method |
| 11/22/2006 | CN1865515A Improvement of gold electroforming process |
| 11/21/2006 | US7138043 Coating lining on internal combustion engines; corrosion and wear resistance |
| 11/21/2006 | US7138040 Suppressing the generation of copper or copper oxide particles on anode, use a formed black film composed of copper phosphide and copper chloride formed on the anode surface due to electrolysis |
| 11/16/2006 | US20060257683 Stainless steel electrolytic coating |
| 11/16/2006 | US20060254929 Method for producing water containing metal ion and water treatment method using said production method, and tool for producing water containing metal ion and water treatment device using said production tool |
| 11/16/2006 | US20060254924 Process for electroplating for producing an iron platinum magnetic material having an especially strong coercive force and excellent properties by using electroplating solution containing ionic iron, ionic platinum, and a complexing agent |
| 11/16/2006 | US20060254923 Low hydrogen embrittlement (LHE) zinc-nickel plating for high strength steels (HSS) |
| 11/15/2006 | EP1722013A1 ELECTROPLATING IN PRESENCE OF CO sb 2 /sb |
| 11/15/2006 | EP1721029A2 Iron-phosphorus electroplating bath and method |
| 11/15/2006 | EP1720842A1 Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds |
| 11/15/2006 | CN2837310Y Corrosion inhibition device for pipe |
| 11/14/2006 | US7135404 Method for applying metal features onto barrier layers using electrochemical deposition |
| 11/14/2006 | US7135103 Preparation of soft magnetic thin film |
| 11/09/2006 | WO2006117920A1 Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution |
| 11/09/2006 | US20060251926 Magnetic alloy substrate of Sm Co Cu Fe-T in which T is Zr, Hf, Ti, Mn, Cr, Nb, Mo, W, V, Ni, and/or Ta covered with a platinum diffustion barrier that is preferably deposited by electroplating |