| Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
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| 05/31/2007 | WO2007059545A1 Tool with electrochemically deposited antiabrasive layer |
| 05/31/2007 | WO2006108476A3 Electrolyte and method for depositing tin bismuth alloy layers |
| 05/31/2007 | DE202007003510U1 Metallhülse für eine Heizwalze und elektrochemisches Bad zur Herstellung von derartigen Metallhülsen Metal sleeve for a heating roller and electro chemical bath for producing such metal sleeves |
| 05/31/2007 | DE102005063123B3 Piston ring for sealing chamber in cylinder has running-in layer containing hydrogen and nanocrystalline carbide phases |
| 05/30/2007 | EP1789611A2 Controlling the hardness of electrodeposited copper coatings by variation of current profile |
| 05/30/2007 | CN1970819A Binary NiP amorphous alloy bulk and method for preparing same |
| 05/30/2007 | CN1318650C Method for working rotary axle holder |
| 05/24/2007 | US20070114132 Device and method for separating metals and/or metal alloys from metallo-organic electrolytes |
| 05/24/2007 | DE102005055742A1 Electrochemical process to coat electrical connector metal component with tin or silver |
| 05/23/2007 | EP1526943B1 Brazing product and method of manufacturing a brazing product with use of a plating bath |
| 05/22/2007 | US7220347 Electrolytic copper plating bath and plating process therewith |
| 05/18/2007 | WO2007055764A2 Metal laminate |
| 05/18/2007 | WO2007055172A1 Nonaqueous electrolyte solution and secondary battery containing same |
| 05/17/2007 | US20070111016 Laser ablation resistant copper foil |
| 05/17/2007 | US20070108062 Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds |
| 05/17/2007 | US20070108061 Electrolyte for the galvanic deposition of aluminum-magnesium alloys |
| 05/16/2007 | EP1784527A1 Chromium plating method |
| 05/16/2007 | CN1965109A Method for imparting resistance to hydrogen to article |
| 05/16/2007 | CN1962957A Method for ultrasonic electroplating of diamond drilling bit |
| 05/16/2007 | CN1962950A Treatment method for plastic rubber surface with coloured titanium metal texture |
| 05/16/2007 | CN1962944A Gray surface treatment process for electrolytic copper foil |
| 05/16/2007 | CN1962239A Acrylic rubber and cast iron direct joint method |
| 05/15/2007 | US7217655 Electroplated CoWP composite structures as copper barrier layers |
| 05/15/2007 | CA2199344C Optical unit electrolytic solution |
| 05/10/2007 | US20070102301 One-point recalibration method for reducing error in concentration measurements for an electrolytic solution |
| 05/09/2007 | EP1784064A1 Flexible printed wiring board terminal part or flexible flat cable terminal part |
| 05/09/2007 | EP1783249A1 Phosphated galvanized steel sheet |
| 05/09/2007 | EP1781421A1 Silver plating in electronics manufacture |
| 05/09/2007 | CN1961099A Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| 05/09/2007 | CN1958873A Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product |
| 05/09/2007 | CN1958867A Post-processing technique for chrome plated parts locally |
| 05/09/2007 | CN1958866A Air feeding technique and equipment for transporting alumina in fume cleaning of aluminum cell |
| 05/09/2007 | CN1958865A Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product |
| 05/09/2007 | CN1958864A Organic blending additive in use for producing ultrathin two-faced bright electrolytic copper foil |
| 05/09/2007 | CN1958863A Ultrathin two-faced bright electrolytic copper foil in high performance, and preparation method |
| 05/09/2007 | CN1958845A Method in use for chemical plating Mi-P alloy on surface of stainless steel |
| 05/09/2007 | CN1314839C Copper bath capable of depositing lackluster copper coat and method thereof |
| 05/09/2007 | CN1314838C Making process of electrolytic copper foil with great high-temperature elongation |
| 05/08/2007 | US7214440 Metallic separator for fuel cell and production method for the same |
| 05/08/2007 | US7214409 High strength Ni-Pt-Al-Hf bondcoat |
| 05/08/2007 | US7214306 Dissolving rhenium oxide in a hydrogen peroxide solution;immersing a negative and a positive electrode into the solution;immersing a substrate to be coated with rhenium into the solution next to the negative electrode or, alternatively, using the substrate to be coated as the negative electrode |
| 05/03/2007 | WO2007050280A2 A catalyst and a method for manufacturing the same |
| 05/03/2007 | WO2007050210A1 Electrode surface coating and method for manufacturing the same |
| 05/03/2007 | US20070099020 Metal foam |
| 05/03/2007 | US20070098590 Ni-pt alloy and target comprising the alloy |
| 05/02/2007 | EP1778888A1 Chromium plating |
| 05/02/2007 | EP1702018A4 Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| 05/02/2007 | EP1595001B1 Surface-coating method |
| 05/02/2007 | CN1955342A Method for electroplating double-layer admiro film on Nd-Fe-B magnetic surface |
| 05/02/2007 | CN1313647C Electroplating liquid and technology used in electrodeposition of tungsten series noncrystalline alloy cladding material or nanometer alloy cladding material |
| 04/26/2007 | WO2007046870A2 Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition, and articles incorporating such deposits |
| 04/26/2007 | US20070092786 Platinum electrode surface coating and method for manufacturing the same |
| 04/26/2007 | US20070092751 Plate for housing and/or lids for button cells and process for manufacturing such a plate |
| 04/26/2007 | US20070089995 Damascene copper plating for coils in thin film heads |
| 04/26/2007 | US20070089994 Platinum electrode surface coating and method for manufacturing the same |
| 04/26/2007 | CA2609481A1 Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition, and articles incorporating such deposits |
| 04/25/2007 | EP1776739A2 Laser ablation resistant copper foil |
| 04/25/2007 | EP1639155A4 Zinc and zinc-alloy electroplating |
| 04/25/2007 | CN1953868A Chromium-free antitarnish adhesion promoting treatment composition |
| 04/25/2007 | CN1952217A Process for applying waste and old zinc to continuous zinc coating of steel plate |
| 04/25/2007 | CN1951673A Method for direct joint of ethylen-propylene rubber and cast iron |
| 04/25/2007 | CN1312323C Copper electrolytic solution containing quaternary amine compound having specific skeleton and organic sulfur compound as additives, and electrolytic copper foil produced therefrom |
| 04/24/2007 | US7208073 Media for use in plating electronic components |
| 04/24/2007 | CA2143354C Surface-treated wire for use in composite elements of elastomeric material and manufacturing process of same |
| 04/19/2007 | WO2006113816A3 Underlayer for reducing surface oxidation of plated deposits |
| 04/19/2007 | WO2006094755A8 Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit |
| 04/19/2007 | US20070087208 Sacrificial coating for fluoride ion cleaning |
| 04/19/2007 | US20070087175 Wired circuit board |
| 04/19/2007 | US20070084732 Leveler compounds |
| 04/19/2007 | US20070084731 Process for plating a metal object with a wear-resistant coating and method of coating |
| 04/19/2007 | DE102005049789A1 Wässriges, alkylisches, cyanidfreies Bad zur galvanischen Abscheidung von Zink- und Zinklegierungsüberzügen Aqueous alkylisches, cyanide bath for the electrodeposition of zinc and zinc alloy coatings |
| 04/18/2007 | EP1774065A1 Electronic component having tin rich deposit layer and the process for depositing the same |
| 04/18/2007 | CN1311105C Production method of composite photo catalytic antibacterial foamed metal |
| 04/18/2007 | CN1311103C Method for electroplating electrode of ceramic wafer electronic component |
| 04/12/2007 | WO2007041650A1 Single bath electrodeposited cu(in,ga)se2 thin films useful as photovoltaic devices |
| 04/12/2007 | WO2007039035A1 Electrochemical deposition of selenium in ionic liquids |
| 04/12/2007 | WO2006069369A3 A method for constructing contact formations |
| 04/11/2007 | CN1946879A Copper electrolysis solution containing compound having specific skeleton as additive, and electrolytic copper foil produced therefrom |
| 04/11/2007 | CN1944716A Non-cyanogen type electrolytic gold plating bath for bump forming |
| 04/11/2007 | CN1309874C Tin plating method |
| 04/05/2007 | WO2007037144A1 Process for producing composite-plated material |
| 04/05/2007 | US20070076834 Radium Target and method for producing it |
| 04/05/2007 | DE112005001074T5 Galvanisierlösung für eutektische Gold-Zinn-Legierung Plating for eutectic gold-tin alloy |
| 04/05/2007 | DE10337030B4 Schichtverbundwerkstoff, Herstellung und Verwendung Layered composite material, manufacture and use |
| 04/05/2007 | DE102005046908A1 Electrochemical deposition of gray selenium on substrate e.g. non-metal, metalloid, metal, alloy or conductive and metallized ceramic or plastics for use as photosemiconductor in photovoltaics or electronics is carried out from ionic liquid |
| 04/04/2007 | CN1940148A Plated film of gold-cobalt amorphous alloy, electroplating bath, and method for electroplating |
| 04/04/2007 | CN1940147A Formation method of gold bump or gold wiring |
| 04/04/2007 | CN1940146A Leveler compounds |
| 04/04/2007 | CN1940145A Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil |
| 04/04/2007 | CN1940144A Production of zirconium hydride surface Cr CO hydrogen penetration barrier layer |
| 04/04/2007 | CN1308493C Complex of ammonium thicoaurite and preparation process thereof |
| 03/29/2007 | US20070071999 Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil |
| 03/29/2007 | US20070071991 protect a monocrystalline superalloy rich in rhenium against corrosion whilst avoiding the formation of progressive secondary reaction zones, a layer (3) formed of tungsten and cobalt is deposited on its surface before aluminisation treatment. |
| 03/29/2007 | US20070068823 Tin electroplating solution and tin electroplating method |
| 03/29/2007 | US20070068821 Method of manufacturing chromium plated article and chromium plating apparatus |
| 03/29/2007 | DE10347702B4 Sinterkörper auf Basis Niobsuboxid Sintered body based on niobium suboxide |
| 03/29/2007 | CA2622917A1 Electroplating composition for coating a substrate surface with a metal |
| 03/28/2007 | EP1766106A2 Pulse reverse electrolysis of acidic copper electroplating solutions |
| 03/28/2007 | CN1936092A Method for directly electrodepositing zinc on magnesium surface |
| 03/28/2007 | CN1307327C Electroplating method |